Patents by Inventor Yousuke Kawamura

Yousuke Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder powder, and solder paste using solder powder
    Patent number: 8882934
    Abstract: In solder powder having an average particle size of 5 ?m or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: November 11, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Sho Nakagawa, Hiroki Muraoka, Kanji Kuba, Yousuke Kawamura
  • SOLDER POWDER, AND SOLDER PASTE USING SOLDER POWDER
    Publication number: 20140174605
    Abstract: In solder powder having an average particle size of 5 ?m or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.
    Type: Application
    Filed: August 22, 2012
    Publication date: June 26, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Sho Nakagawa, Hiroki Muraoka, Kanji Kuba, Yousuke Kawamura