Patents by Inventor Yousuke KONDOU

Yousuke KONDOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board
    Patent number: 10834812
    Abstract: A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: November 10, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takakuni Nasu, Yousuke Kondou, Masaomi Hattori, Kouta Kimata, Atsushi Kaga, Guangzhu Jin
  • WIRING BOARD
    Publication number: 20200077512
    Abstract: A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.
    Type: Application
    Filed: July 26, 2019
    Publication date: March 5, 2020
    Inventors: Takakuni NASU, Yousuke KONDOU, Masaomi HATTORI, Kouta KIMATA, Atsushi KAGA, Guangzhu JIN