Patents by Inventor Yousuke NAKADA

Yousuke NAKADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10903012
    Abstract: A ceramic capacitor includes a multilayer structure, wherein a main component of dielectric layers is ceramic expressed by a general formula AmBO3 (0.995?m?1.010), wherein the dielectric layers include a rare earth element Re as a first sub-component by 2.0 mol to 5.0 mol when converted into Re2O3/2, include Mg as a second sub-component by 1.0 mol to 3.0 mol when converted into MgO, include V as a third sub-component by 0.05 mol to 0.25 mol when converted into V2O5/2, include Si as a fourth sub-component by 0.5 mol to 5.0 mol when converted into SiO2, include an alkali earth metal element M as a fifth sub-component by 0.1 mol to 5.0 mol when converted into MCO3, on a presumption that an amount of the ceramic is 100 mol, wherein a ratio Si/V is 30 or less.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: January 26, 2021
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Yasuyuki Inomata, Yousuke Nakada, Tetsuo Shimura
  • Patent number: 10854388
    Abstract: A ceramic electronic component includes a ceramic body, a sintered metal film, and a metal terminal. The ceramic body includes internal electrodes. The sintered metal film has a joint surface having a surface roughness Ra of 0.200 ?m or less. The sintered metal film is connected to the internal electrodes and formed on a surface of the ceramic body. The metal terminal is jointed to the joint surface.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 1, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaki Mochigi, Kazuya Sato, Yousuke Nakada
  • Patent number: 10529487
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which internal electrodes and dielectric layers are alternately stacked; a first external electrode connected to a subset of the internal electrodes; and a second external electrode sandwiching the multilayer structure with the first external electrode in a first direction is connected to another subset of the internal electrodes, wherein t12×W1/N is equal to or more than 0.1, when a distance between a first edge positioned at outermost of the internal electrodes in a second direction intersecting with the first direction in a plane direction of the internal electrodes and the dielectric layers and a second edge positioned at innermost of the internal electrodes in the second direction is W1 (mm), each thickness of the plurality of dielectric layers is t1 (?m), and a stack number of the plurality of dielectric layers is N.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: January 7, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaki Mochigi, Yousuke Nakada, Shinichi Tsunoda, Yasuyuki Mashimo
  • Publication number: 20190228911
    Abstract: A ceramic capacitor includes a multilayer structure, wherein a main component of dielectric layers is ceramic expressed by a general formula AmBO3 (0.995?m?1.010), wherein the dielectric layers include a rare earth element Re as a first sub-component by 2.0 mol to 5.0 mol when converted into Re2O3/2, include Mg as a second sub-component by 1.0 mol to 3.0 mol when converted into MgO, include V as a third sub-component by 0.05 mol to 0.25 mol when converted into V2O5/2, include Si as a fourth sub-component by 0.5 mol to 5.0 mol when converted into SiO2, include an alkali earth metal element M as a fifth sub-component by 0.1 mol to 5.0 mol when converted into MCO3, on a presumption that an amount of the ceramic is 100 mol, wherein a ratio Si/V is 30 or less.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 25, 2019
    Inventors: Yasuyuki INOMATA, Yousuke NAKADA, Tetsuo SHIMURA
  • Patent number: 10347428
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure having an internal electrode and a dielectric layer alternately stacked; external electrodes provided on a first and second faces of the multilayer structure, wherein t12×L1/N is equal to or more than 0.1, when a distance between a first edge positioned at outermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in an array direction of the first external electrode and the second external electrode and a second edge positioned at innermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in the array direction is L1 (mm), each thickness of the plurality of dielectric layers is t1 (?m), and a stack number of the plurality of dielectric layers is N.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: July 9, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masaki Mochigi, Yousuke Nakada, Shinichi Tsunoda, Yasuyuki Mashimo
  • Patent number: 10224707
    Abstract: In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: March 5, 2019
    Assignee: TAIYO YUDEN CO., LTD
    Inventors: Yousuke Nakada, Kenji Matsumoto, Tetsuo Shimura, Kazuya Sato
  • Patent number: 9966193
    Abstract: An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: May 8, 2018
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kenji Matsumoto, Yousuke Nakada, Tetsuo Shimura, Kazuya Sato
  • Publication number: 20180012703
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure having an internal electrode and a dielectric layer alternately stacked; external electrodes provided on a first and second faces of the multilayer structure, wherein t12×L1/N is equal to or more than 0.1, when a distance between a first edge positioned at outermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in an array direction of the first external electrode and the second external electrode and a second edge positioned at innermost of edges of the plurality of internal electrodes that are not connected to the first external electrode or the second external electrode in the array direction is L1 (mm), each thickness of the plurality of dielectric layers is t1 (?m), and a stack number of the plurality of dielectric layers is N.
    Type: Application
    Filed: June 27, 2017
    Publication date: January 11, 2018
    Inventors: Masaki MOCHIGI, Yousuke NAKADA, Shinichi TSUNODA, Yasuyuki MASHIMO
  • Publication number: 20170352483
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which internal electrodes and dielectric layers are alternately stacked; a first external electrode connected to a subset of the internal electrodes; and a second external electrode sandwiching the multilayer structure with the first external electrode in a first direction is connected to another subset of the internal electrodes, wherein t12×W1/N is equal to or more than 0.1, when a distance between a first edge positioned at outermost of the internal electrodes in a second direction intersecting with the first direction in a plane direction of the internal electrodes and the dielectric layers and a second edge positioned at innermost of the internal electrodes in the second direction is W1 (mm), each thickness of the plurality of dielectric layers is t1 (?m), and a stack number of the plurality of dielectric layers is N.
    Type: Application
    Filed: May 24, 2017
    Publication date: December 7, 2017
    Inventors: Masaki MOCHIGI, Yousuke NAKADA, Shinichi TSUNODA, Yasuyuki MASHIMO
  • Publication number: 20170317484
    Abstract: In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.
    Type: Application
    Filed: April 25, 2017
    Publication date: November 2, 2017
    Inventors: Yousuke NAKADA, Kenji MATSUMOTO, Tetsuo SHIMURA, Kazuya SATO
  • Publication number: 20170290161
    Abstract: In an embodiment, a multilayer ceramic capacitor with interposer CWI1 has adhesive material parts 40 provided between the multilayer ceramic capacitor 10 and interposer 20, and the adhesive material parts 40 include space-setting members 41 for setting the spacing between the multilayer ceramic capacitor 10 and interposer 20. The electronic component with interposer can offer an improvement to the issue of its height dimension varying excessively.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Inventors: Tetsuo SHIMURA, Yousuke NAKADA
  • Publication number: 20170186551
    Abstract: An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.
    Type: Application
    Filed: September 20, 2016
    Publication date: June 29, 2017
    Applicant: TAIYO YUDEN CO. LTD.
    Inventors: Kenji MATSUMOTO, Yousuke NAKADA, Tetsuo SHIMURA, Kazuya SATO