Patents by Inventor Yousuke Sugioka

Yousuke Sugioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8499275
    Abstract: The present invention aims to improve accuracy of a planar manufacturing drawing used to instruct manufacture of a three-dimensional structure in a planar form. According to path plan information is acquired by a path plan information acquisition unit 11a and manufacturing requirement information is acquired by a manufacturing requirement information acquisition unit, a layout configuration production unit 11c produces a layout configuration model in which the three-dimensional structure is laid out in a planar manner based on a manufacture layout and distortion of the wire harness. Then, a simulation unit 11d simulates a transformation from the layout configuration model to the mounting configuration model with which the three-dimensional structure is mounted to a mount object. Then, an evaluation item evaluating unit 11e evaluates a predetermined evaluation item by comparing the simulation result and the three-dimensional structure indicated by the path plan information.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: July 30, 2013
    Assignee: Yazaki Corporation
    Inventors: Shinji Tsuchiya, Kouki Nagakura, Yousuke Sugioka, Masayoshi Sawai
  • Patent number: 8397203
    Abstract: The present invention aims to improve accuracy of a planar manufacturing drawing used to instruct manufacture of a three-dimensional structure in a planar form. According to path plan information is acquired by a path plan information acquisition unit 11a and manufacturing requirement information is acquired by a manufacturing requirement information acquisition unit, a layout configuration production unit 11c produces a layout configuration model in which the three-dimensional structure is laid out in a planar manner based on a manufacture layout and distortion of the wire harness. Then, a simulation unit 11d simulates a transformation from the layout configuration model to the mounting configuration model with which the three-dimensional structure is mounted to a mount object. Then, an evaluation item evaluating unit 11e evaluates a predetermined evaluation item by comparing the simulation result and the three-dimensional structure indicated by the path plan information.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: March 12, 2013
    Assignee: Yazaki Corporation
    Inventors: Shinji Tsuchiya, Kouki Nagakura, Yousuke Sugioka, Masayoshi Sawai
  • Publication number: 20110046763
    Abstract: The present invention aims to improve accuracy of a planar manufacturing drawing used to instruct manufacture of a three-dimensional structure in a planar form. According to path plan information is acquired by a path plan information acquisition unit 11a and manufacturing requirement information is acquired by a manufacturing requirement information acquisition unit, a layout configuration production unit 11c produces a layout configuration model in which the three-dimensional structure is laid out in a planar manner based on a manufacture layout and distortion of the wire harness. Then, a simulation unit 11d simulates a transformation from the layout configuration model to the mounting configuration model with which the three-dimensional structure is mounted to a mount object. Then, an evaluation item evaluating unit 11e evaluates a predetermined evaluation item by comparing the simulation result and the three-dimensional structure indicated by the path plan information.
    Type: Application
    Filed: February 25, 2009
    Publication date: February 24, 2011
    Applicant: Yazaki Corporation
    Inventors: Shinji Tsuchiya, Kouki Nagakura, Yousuke Sugioka, Masayoshi Sawai