Patents by Inventor Yousuke Watanabe

Yousuke Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11736036
    Abstract: An electric power converter includes a plurality of switch pairs respectively corresponding to a plurality of phases and each consisting of an upper-arm switch and a lower-arm switch. Each of the lower-arm switches of the switch pairs has a first terminal, a second terminal and a gate. The electric power converter further includes: a voltage generation circuit having its positive electrode side connected to the second terminal of only one of the lower-arm switches of the switch pairs; a negative-electrode-side electrical path connected to a negative electrode side of the voltage generation circuit; and at least one capacitor having a first end connected to the second terminal of one of the remainder of the lower-arm switches of the switch pairs, which is not connected with the voltage generation circuit, and a second end connected to the negative-electrode-side electrical path.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: August 22, 2023
    Assignee: DENSO CORPORATION
    Inventors: Akira Tokumasu, Yousuke Watanabe
  • Patent number: 10493983
    Abstract: A vehicle driving support system includes a detection part detecting an object; an area classification part classifying areas other than a presence area where the object detected by the detection part is present into an empty area and an unknown area, the empty area being such an area that it is determined that no object is present and an unknown area being such an area that whether an object is present is unknown; and a control part guiding a vehicle to the empty area.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: December 3, 2019
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Hiroaki Takada, Yousuke Watanabe, Shigeharu Teshima, Yoshiki Ninomiya, Kenya Sato
  • Patent number: 10353394
    Abstract: A driving assistance device includes a driving situation acquisition unit that acquires driving situations of vehicles that may collide with each other, a driving characteristics acquisition unit that acquires driving characteristics of drivers of the vehicles, a driving action determination unit that determines driving actions that allow the vehicles to avoid collision with each other in the driving situation acquired by the driving situation acquisition unit and that match the driving characteristics acquired by the driving characteristics acquisition unit, and a driving action instruction unit that instructs the vehicles about the driving actions determined by the driving action determination unit.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: July 16, 2019
    Assignees: Toyota Jidosha Kabushiki Kaisha, National University Corporation Nagoya University
    Inventors: Hiroaki Takada, Yousuke Watanabe, Kentaro Takaki, Takayuki Morikawa, Yoshiki Ninomiya, Shigeharu Teshima
  • Publication number: 20180046193
    Abstract: A driving assistance device includes a driving situation acquisition unit that acquires driving situations of vehicles that may collide with each other, a driving characteristics acquisition unit that acquires driving characteristics of drivers of the vehicles, a driving action determination unit that determines driving actions that allow the vehicles to avoid collision with each other in the driving situation acquired by the driving situation acquisition unit and that match the driving characteristics acquired by the driving characteristics acquisition unit, and a driving action instruction unit that instructs the vehicles about the driving actions determined by the driving action determination unit.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 15, 2018
    Inventors: Hiroaki Takada, Yousuke Watanabe, Kentaro Takaki, Takayuki Morikawa, Yoshiki Ninomiya, Shigeharu Teshima
  • Patent number: 9160329
    Abstract: A circuit control device controlling a switching circuit which has a semiconductor switching element, having a main controller, a drive signal output portion and an obtaining portion. The main controller outputs a drive control signal. The drive signal output portion receives the drive control signal and outputs a drive signal to the switching element, the switching element acting on the basis of the drive signal. The obtaining portion obtains circuit information on status of the switching circuit in synchronization with the drive control signal.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: October 13, 2015
    Assignee: DENSO CORPORATION
    Inventors: Yousuke Watanabe, Junichi Fukuta, Tsuneo Maebara
  • Patent number: 9098060
    Abstract: A cleaning device includes a cleaning member for removing a developer from a surface of a member to be cleaned and the cleaning member includes a blade portion, and a flexible plate-like supporting member configured to support the blade portion, the supporting member including one end portion, in which the blade portion is provided, the other end portion, which has a portion to be fixed to a frame member, a bent portion, which is positioned between the one end portion and a side plate portion projecting from a side end of the one end portion, and a sealing member, which is provided between the cleaning member and the frame member, configured to prevent the developer from leaking from a storage chamber and fixed to one of the side plate portion and the frame member.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: August 4, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yousuke Watanabe, Masao Uyama
  • Publication number: 20140241772
    Abstract: A cleaning device includes a cleaning member for removing a developer from a surface of a member to be cleaned and the cleaning member includes a blade portion, and a flexible plate-like supporting member configured to support the blade portion, the supporting member including one end portion, in which the blade portion is provided, the other end portion, which has a portion to be fixed to a frame member, a bent portion, which is positioned between the one end portion and a side plate portion projecting from a side end of the one end portion, and a sealing member, which is provided between the cleaning member and the frame member, configured to prevent the developer from leaking from a storage chamber and fixed to one of the side plate portion and the frame member.
    Type: Application
    Filed: February 25, 2014
    Publication date: August 28, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Yousuke Watanabe, Masao Uyama
  • Publication number: 20110168374
    Abstract: Disclosed is a corrugated-fin type radiator (1), which comprises corrugated fins (10), and a support substrate (20) having a plurality of fixing grooves (23) defined by side walls (24) and a bottom (25). The bottom (25) has a ridge (26) at least in its portion, and the side walls (24) are formed of a vertical wall (24a), a tapered wall (24b) and a corner (24c). A fin fixing portion (14) is fixed along the side walls (24) and the bottom (25) of the fixing grooves (23). Also disclosed is a method for manufacturing the corrugated-fin type radiator (1), which comprises a substrate manufacturing step, a fin shaping step and a fixing step. Thus, it is possible to provide the corrugated-fin type radiator capable of improving a radiation efficiency, and a method for manufacturing the radiator.
    Type: Application
    Filed: January 21, 2009
    Publication date: July 14, 2011
    Applicant: MIZUTANI ELECTRIC IND. CO., LTD.
    Inventors: Yousuke Watanabe, Fumio Mutou, Takumi Koyama, Tadashi Yoshimura, Mitsuya Miyamoto
  • Patent number: 7903422
    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: March 8, 2011
    Assignee: NEC Corporation
    Inventor: Yousuke Watanabe
  • Publication number: 20100014255
    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.
    Type: Application
    Filed: September 25, 2009
    Publication date: January 21, 2010
    Applicant: NEC CORPORATION
    Inventor: Yousuke Watanabe
  • Patent number: 7616446
    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: November 10, 2009
    Assignee: NEC Corporation
    Inventor: Yousuke Watanabe
  • Publication number: 20080068810
    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.
    Type: Application
    Filed: November 15, 2007
    Publication date: March 20, 2008
    Applicant: NEC CORPORATION
    Inventor: Yousuke Watanabe
  • Patent number: 7330354
    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: February 12, 2008
    Assignee: NEC Corporation
    Inventor: Yousuke Watanabe
  • Publication number: 20060126310
    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure.
    Type: Application
    Filed: December 15, 2005
    Publication date: June 15, 2006
    Applicant: NEC Corporation
    Inventor: Yousuke Watanabe