Patents by Inventor Youwei Yao

Youwei Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11879170
    Abstract: A device includes a substrate and a stressed layer disposed on a first surface of the substrate. The stressed layer includes: a first set of patterns having a predetermined geometry, size, and arrangement selected to control an equibiaxial stress field of the stressed layer, wherein the equibiaxial stress field varies in magnitude over the first surface of the substrate, and a second set of patterns etched into the first set of patterns and the substrate, the second set of patterns comprising a plurality of substantially parallel lines arranged to control at least a uniaxial stress field of the stressed layer, wherein the uniaxial stress field varies in magnitude over the first surface of the substrate.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: January 23, 2024
    Assignee: Massachusetts Institute of Technology
    Inventors: Youwei Yao, Brandon Chalifoux, Mark Schattenburg
  • Publication number: 20210047729
    Abstract: A device includes a substrate and a stressed layer disposed on a first surface of the substrate. The stressed layer includes: a first set of patterns having a predetermined geometry, size, and arrangement selected to control an equibiaxial stress field of the stressed layer, wherein the equibiaxial stress field varies in magnitude over the first surface of the substrate, and a second set of patterns etched into the first set of patterns and the substrate, the second set of patterns comprising a plurality of substantially parallel lines arranged to control at least a uniaxial stress field of the stressed layer, wherein the uniaxial stress field varies in magnitude over the first surface of the substrate.
    Type: Application
    Filed: August 14, 2020
    Publication date: February 18, 2021
    Inventors: Youwei Yao, Brandon Chalifoux, Mark Schattenburg
  • Patent number: 10274644
    Abstract: A deposition system for forming a stress distributed coating layer is provided which comprises a deposition apparatus comprising a source from which a coating material emanates, the source configured to restrict a flux of the coating material towards a backside of an optical substrate; a holder configured to hold the optical substrate; a drive system configured to provide relative translation of the source and the optical substrate; and a bias voltage power supply operably coupled to the source and the optical substrate and configured to apply a bias voltage between the source and the backside of the optical substrate.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: April 30, 2019
    Assignee: Northwestern University
    Inventors: Youwei Yao, Melville Paul Ulmer, Jian Cao, Xiaoli Wang
  • Publication number: 20180081083
    Abstract: A deposition system for forming a stress distributed coating layer is provided which comprises a deposition apparatus comprising a source from which a coating material emanates, the source configured to restrict a flux of the coating material towards a backside of an optical substrate; a holder configured to hold the optical substrate; a drive system configured to provide relative translation of the source and the optical substrate; and a bias voltage power supply operably coupled to the source and the optical substrate and configured to apply a bias voltage between the source and the backside of the optical substrate.
    Type: Application
    Filed: November 27, 2017
    Publication date: March 22, 2018
    Inventors: Youwei Yao, Melville Paul Ulmer, Jian Cao, Xiaoli Wang
  • Patent number: 9864105
    Abstract: A method of forming a stress distributed coating layer is provided which comprises depositing a coating material emanating from a source at a first location on a backside of an optical substrate at a first bias voltage to provide a first coating region at the first location characterized by a first stress and depositing the coating material at a second location on the backside of the optical substrate at a second bias voltage to provide a second coating region at the second location characterized by a second stress, thereby forming a stress distributed coating layer on the backside of the optical substrate comprising the first and second coating regions. Deposition systems and coated optical substrates are also provided.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: January 9, 2018
    Assignee: Northwestern University
    Inventors: Youwei Yao, Melville Paul Ulmer, Jian Cao, Xiaoli Wang
  • Publication number: 20160349410
    Abstract: A method of forming a stress distributed coating layer is provided which comprises depositing a coating material emanating from a source at a first location on a backside of an optical substrate at a first bias voltage to provide a first coating region at the first location characterized by a first stress and depositing the coating material at a second location on the backside of the optical substrate at a second bias voltage to provide a second coating region at the second location characterized by a second stress, thereby forming a stress distributed coating layer on the backside of the optical substrate comprising the first and second coating regions. Deposition systems and coated optical substrates are also provided.
    Type: Application
    Filed: May 27, 2016
    Publication date: December 1, 2016
    Inventors: Youwei Yao, Melville Paul Ulmer, Jian Cao, Xiaoli Wang