Patents by Inventor Youzi Miura

Youzi Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless plating process and process for producing multilayer wiring board
    Patent number: 4659587
    Abstract: In a selective electroless plating process suitable for formation and correction of a minute pattern by plating film, irradiation of the surface of a workpiece with a laser beam serves to selectively activate the surface of the workpiece to allow an electroless plating film to deposited on only the activated portions. The portion of the workpiece where plating is effected is irradiated with a radiation energy beam to form a damaged portion, which is contact with a plating bath during and/or after the irradiation to selectively from a plating film on the damaged portion. The portion of a workpiece where a pole as the connector part of a multilayer wiring board is to be formed is irradiated with a laser beam and allowed to have a pole selectively formed only thereon.
    Type: Grant
    Filed: October 10, 1985
    Date of Patent: April 21, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Midori Imura, Makoto Morijiri, Masanobu Hanazono, Shinichi Kazui, Youzi Miura, Hiroyuki Ogino