Patents by Inventor Youzou SATOU

Youzou SATOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing bonded wafer and bonded wafer
    Patent number: 11211285
    Abstract: In a method of producing a bonded wafer, the amount of depression of the polishing cloth is 50 ?m to 90 ?m, and the surface hardness (ASKER C) of the polishing cloth is 50 to 60. In the bonded wafer, the polycrystalline silicon layer has a thickness variation ?t of 5% or less, and the support substrate wafer has a GBIR of 0.2 ?m or less and an SFQR of 0.06 ?m or less after the polycrystalline silicon layer is polished.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: December 28, 2021
    Assignee: SUMCO CORPORATION
    Inventors: Youzou Satou, Kazuaki Kozasa
  • METHOD OF PRODUCING BONDED WAFER AND BONDED WAFER
    Publication number: 20200343130
    Abstract: In a method of producing a bonded wafer, the amount of depression of the polishing cloth is 50 ?m to 90 ?m, and the surface hardness (ASKER C) of the polishing cloth is 50 to 60. In the bonded wafer, the polycrystalline silicon layer has a thickness variation ?t of 5% or less, and the support substrate wafer has a GBIR of 0.2 ?m or less and an SFQR of 0.06 ?m or less after the polycrystalline silicon layer is polished.
    Type: Application
    Filed: January 8, 2019
    Publication date: October 29, 2020
    Applicant: SUMCO Corporation
    Inventors: Youzou SATOU, Kazuaki KOZASA