Patents by Inventor Yr Lin

Yr Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked die package with stud spacers
    Publication number: 20080150156
    Abstract: A system may include a first integrated circuit die comprising a first upper surface, an integrated circuit package substrate comprising a second upper surface, a wire coupled to the a first upper surface and to the second upper surface, a plurality of elements coupled to the first upper surface, and a second integrated circuit die coupled to the plurality of elements. A portion of the wire is disposed between the first integrated circuit die and the second integrated circuit die.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Inventors: Yr Lin, Nelson Punzalan, Chee Key Chung