Abstract: A pixel array that includes some pixels with high absorption (HA) structures and other pixels without HA structures exhibits increased dynamic range for near infrared (NIR) light. Additionally, the pixel array is a uniform array of photodiodes and thus does not exhibit current leakage that would have been caused by irregular isolation structures. Additionally, the pixel array may further a lateral overflow integration capacitor to further increase the dynamic range for NIR light.

Abstract: A resin composition includes a polymer, which has a first structural unit of Formula (1) and a second structural unit of Formula (2). The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength and warpage at high temperature.

Abstract: A method is provided for a travelling vehicle to detect lane lines. A front camera module captures frames of front image of the vehicle, a rear camera module captures frames of rear image of the vehicle, and a speed sensor module senses speed trajectory of the vehicle. In the method, the frames of front image, the frames of rear image and the sensed speed trajectory are used to obtain pairs of matched front and rear images, and to determine reliability of a lane line feature detected in a current front image or a current rear image based on the pairs of matched front and rear images, and the lane line feature detected from the current front image or the current rear image is outputted upon determining that the currently detected lane line feature is reliable.

Abstract: The present invention discloses a diaphragm for a speaker including a lower surface area, a central area formed on said lower surface area, an upper surface area formed on said central area. The upper surface area, the central area and the lower surface area includes homogeneous amorphous materials. The diaphragm includes internal stress changing with a depth from the surface to the center of the diaphragm.

Abstract: An image sensor includes photosensitive areas in a first array within a semiconductor substrate. Microlens are disposed over the semiconductor substrate in a second array. Metal shields are disposed between a subset of the microlenses and corresponding photosensitive areas. The metal half-shields have dimensions and positions that provide half-shielding that enables half-shield phase detection autofocus. An antireflective coating is disposed over the metal half-shields. The metal half-shields and the antireflective coating may be in a composite grid that provides lateral separation between color filters. Alternatively, metal half-shields and the antireflective coating may be in below a layer that includes color filters. The antireflective coating includes a quarter-wave layer.

Abstract: The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light-emitting chip includes a light-emitting surface, a connecting surface, and a side surface. The packaging layer covers the light-emitting surface and the first side surface. The connecting surface is exposed from the packaging layer. The fluorescent layer is disposed on the packaging layer, and covers on the light-emitting surface and the first side surface. The lens structure is disposed on a top surface of the fluorescent layer. A surface of the lens structure is recessed towards the light-emitting chip to form a curved surface. The reflecting layer is disposed on the curved surface.

Abstract: An image sensor includes a semiconductor substrate, a first isolation structure, a visible light detection structure, and an infrared light detection structure. The semiconductor substrate has a first surface and a second surface opposite to the first surface in a vertical direction. The first isolation structure is disposed in the semiconductor substrate for defining pixel regions in the semiconductor substrate. The visible light detection structure and the infrared light detection structure are disposed within the same pixel region, and a first portion of the visible light detection structure is disposed between the second surface of the semiconductor substrate and the infrared light detection structure in the vertical direction. The infrared light detection structure includes an epitaxial structure disposed in the semiconductor substrate, and the visible light detection structure includes a doped region including a material identical to a material of the semiconductor substrate.

Abstract: Systems and methods for generating a radio frequency (RF) signal by a digital-to-analog converter (DAC) with transmission frequency within a wide transmission frequency range are described. An output reactance of the DAC coupled (directly or indirectly) to one or more antennas corresponds to the transmission frequency of the RF signals. Multiple embodiments of the DAC are described to include circuitry for tuning the output reactance of the DAC, and therefore, shifting a center frequency to select a transmission frequency range (from multiple transmission frequency ranges) for providing the RF signals.

Abstract: A resin composition includes a vinyl group-containing resin and a phosphorus-containing compound of Formula (1) or a prepolymer thereof, wherein: relative to 100 parts by weight of the vinyl group-containing resin, the phosphorus-containing compound of Formula (1) is 35 to 60 parts by weight; or relative to 100 parts by weight of the vinyl group-containing resin, the prepolymer of the phosphorus-containing compound of Formula (1) is 50 to 90 parts by weight. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more properties can be improved.

Abstract: An auxiliary vehicle mirror device includes a main rod unit, a securing unit and an auxiliary mirror unit. The main rod unit includes a connecting rod, first and second fixture rods connected perpendicularly to opposite ends of the connecting rod and extending respectively in opposite directions, and first and second ball fixtures disposed respectively on the first and second fixture rods. The first ball fixture is engaged with a first socket seat of the securing unit to be freely rotatable relative to it. The second ball fixture is engaged with a second socket seat of the auxiliary mirror unit to be freely rotatable relative to it.

Abstract: A semiconductor structure includes an interconnect structure, a passivation structure, a first capacitor, and a contact feature. The interconnect structure is disposed over a semiconductor substrate. The passivation structure is disposed over the interconnect structure. The first capacitor is disposed within the passivation structure. The contact feature is disposed over the passivation structure, wherein the first capacitor is proximal to a corner of the contact feature. A method of manufacturing the semiconductor structure is also provided.

Abstract: Using a large language model to comply with a user request. The large language model receives tool documentation for each of one or more tools, and analyzes the tool documentation for each of the one or more tools to determine, for each tool, one or more tasks that the tool is operable to perform. Upon receiving a request from a user, the large language model generates a plan for complying with the request by using one or more of the tools, the plan including performance of one or more of the tasks.

Abstract: The present invention provides an inpatient unit of modular design, built of recycled materials and environmentally friendly materials, allowing reconfiguration, redeployment and quick assembly, preventing indoor air from leaking, applicable to epidemic prevention and treating special patients, with high structural strength, lower cost and good environmental benefit.

Abstract: Certain aspects of the present disclosure generally relate to electronic circuits and, more particularly, to an operational transconductance amplifier (OTA). One example amplifier generally includes: a first pair of input transistors; a first pair of cascode transistors coupled in cascode with the first pair of input transistors, respectively; a second pair of input transistors; a second pair of cascode transistors coupled in cascode with the second pair of input transistors, respectively; and a third pair of input transistors coupled to the second pair of cascode transistors, respectively.

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 150 to 200 parts by weight of a ceramic filler, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes a maleimide resin and a diamine compound in a molar ratio of between 1:2 and 2:1; the ceramic filler has a thermal conductivity of greater than 30 W/(m·K); and the diamine compound includes a compound of Formula (1), a compound of Formula (2), a compound of Formula (3) or a combination thereof. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more properties can be improved.

Abstract: A method for correcting critical dimension (CD) measurements of a lithographic tool includes steps as follows. A correction pattern having a first sub-pattern parallel to a first direction and a second sub-pattern parallel to a second direction is provided on a lithographic mask; wherein the first sub-pattern and the second sub-pattern come cross with each other. A first After-Develop-Inspection critical dimension (ADI CD) of a developed pattern formed on a photo-sensitive layer and transferred from the correction pattern is measured using the lithographic tool along a first scanning direction. A second ADI CD of the developed pattern is measured using the lithographic tool along a second scanning direction. The first ADI CD is subtracted from the second ADI CD to obtain a measurement bias value. Exposure conditions and/or measuring parameters of the lithographic tool are adjusted according to the measurement bias value.

Abstract: An image sensor includes a semiconductor substrate having a first surface and a second surface opposite to the first surface in a vertical direction, a first isolation structure disposed in the semiconductor substrate for defining pixel regions, a visible light detection structure, an infrared light detection structure, and a reflective layer. The visible light detection structure and the infrared light detection structure are disposed within the same pixel region. The visible light detection structure includes a first portion disposed between the second surface and the infrared light detection structure in the vertical direction and a second portion disposed between the infrared light detection structure and the first isolation structure in a horizontal direction. The infrared light detection structure is disposed between the reflective layer and the first portion in the vertical direction. The second portion is not sandwiched between the reflective layer and the second surface in the vertical direction.

Abstract: A workpiece orientation mechanism includes: a driving device including a transmission motor and a controller which are connected with each other via signal, the transmission motor defining an axial direction; a rotating seat, combined with the transmission motor, and capable of being driven to rotate by the transmission motor; an orientation head disposed on the rotating seat to rotate synchronously with the rotating seat, wherein the orientation head is capable of moving along the axial direction relative to the rotating seat, one end of the orientation head includes a mounting head, and a blocking member is disposed on the orientation head; reset means, arranged between the rotating seat and the orientation head, and positioning the orientation head at a predetermined position; and a sensor facing the blocking member, wherein the sensor is signally connected with the controller.

Abstract: An embodiment of the invention provides a method for configuring a transmitter (Tx) bandwidth (BW) and a receiver (Rx) BW of a communication apparatus, including: transmitting a first capability of a Tx and a second capability of an Rx to a network device; receiving at least one configuration associated to the first capability and the second capability from the network device; and configuring the Tx BW and the Rx BW according to the at least one configuration; wherein the Tx BW is in a Tx channel BW (CBW), and the Rx BW is in an Rx CBW.

Abstract: Account delegation is provided. A request for access to a secure system using an owner's account is received from an applier via a browser supplement module on the applier's computing device. The request is communicated to the account owner via a browser supplement module on the account owner's computing device. Approval of the request is received from the account owner. The secure system is logged into using the account owner's credential. A connection to the applier's computing device is established to act as a proxy for communication between the secure system and the applier's computing device. Further provided herein are a computer system and a computer program product for performing the method.