Patents by Inventor Yu An

Yu An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10091672
    Abstract: Embodiments of the present invention provide a fault handling method, apparatus and system, and relate to the field of communications, where the method includes: detecting, by a lower-layer fault management system, a fault alarm status in a lower-layer service; obtaining, by means of query by the lower-layer fault management system, according to the fault alarm status and a service dependence relationship table stored in a system, an affected higher-layer service; sending, by the lower-layer fault management system, a fault notification message to a higher-layer fault management system corresponding to the affected higher-layer service; and determining, by the higher-layer fault management system, according to the fault notification message whether a higher-layer service in which a fault occurs needs to be handled.
    Type: Grant
    Filed: December 27, 2015
    Date of Patent: October 2, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Ming Yu
  • Patent number: 10087772
    Abstract: The turbomachine includes a rotatable member defining an axis of rotation and an inner annular casing extending circumferentially over at least a portion of the rotatable member. The inner annular casing includes a radially outer surface. The turbomachine further includes an outer annular casing extending over at least a portion of the inner annular casing. The inner annular casing and the outer annular casing define a plurality of cavities therebetween. The clearance control system includes a manifold system including a plurality of conduits extending circumferentially about the inner annular casing and disposed within the cavities. The clearance control system also includes an impingement system extending circumferentially about the inner annular casing and disposed within the cavities. The conduits are configured to channel a flow of cooling fluid to the impingement system which is configured to channel the cooling fluid to the radially outer surface of the inner annular casing.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: October 2, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Changjie Sun, Yu Xie Mukherjee, Bhaskar Nanda Mondal, Atanu Saha, Marcia Boyle Johnson, Wenfeng Lu
  • Patent number: 10090217
    Abstract: A chip packaging method and package structure, the package structure including a substrate, a sensing chip coupled to the substrate, a plastic package layer located on the substrate, and a covering layer located on the plastic package layer and a first surface of the sensing chip; the sensing chip including the first surface and a second surface opposite to the first surface, and further including a sensing area located on the first surface; the second surface of the sensing chip faces towards the substrate; and the plastic package layer encloses the sensing chip, and the surface of the plastic package layer is flush with the first surface of the sensing chip.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: October 2, 2018
    Assignee: China Wafer Level CSP Co., Ltd.
    Inventors: Zhiqi Wang, Qiong Yu, Wei Wang
  • Patent number: 10090581
    Abstract: A multiple antenna apparatus is provided. A first feed antenna unit is shared for receiving and transmitting radio frequency (RF) signals corresponding to a bandwidth of a first resonance mode, so as to increase antenna configurable space of the multiple antenna apparatus, and thus a closed slot antenna formed by a wire, a ground plane and a radiation element is able to be configured in the multiple antenna apparatus to receive and transmit the RF signals corresponding to a second resonance mode.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: October 2, 2018
    Assignee: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Yu-Yi Chu, Tse-Hsuan Wang, Shih-Keng Huang, Chia-Chi Chang
  • Patent number: 10089255
    Abstract: Memory systems may include a plurality of queues, a queue ready indicator suitable for grouping the plurality of queues into a predefined number of queue ranges, each queue range having associated with it a queue range ready signal, and setting a queue range ready signal to ready when each queue in the queue range associated with the queue range ready signal is ready for processing, and a queue process sequencer suitable for determining a queue range ready for processing based on the queue range ready signals, and processing a queue within the queue range determined to be ready for processing.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: October 2, 2018
    Assignee: SK Hynix Inc.
    Inventors: Xianfeng Rui, Fan Yang, Ryan Yu, Ananthanarayanan Nagarajan
  • Patent number: 10090045
    Abstract: Provided is a programming method of a nonvolatile memory device including a plurality of memory cells. The programming method of the nonvolatile memory device includes: programming a first set of memory cells of the plurality of memory cells to a target state based on a primary program voltage such that a threshold voltage distribution of the first set of memory cells is formed; grouping the first set of memory cells into a plurality of cell groups at least one cell group having a different threshold voltage distribution width from others, based on program speeds of the first set of memory cells; and reprogramming remaining cell groups other than a first cell group that is programmed to the target state among the plurality of cell groups, to the target state based on a plurality of secondary program voltages determined based on threshold voltage distribution widths of the plurality of cell groups.
    Type: Grant
    Filed: March 11, 2018
    Date of Patent: October 2, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wook-ghee Hahn, Chang-yeon Yu, Joo-kwang Lee
  • Patent number: 10090304
    Abstract: An impurity source film is formed along a portion of a non-planar semiconductor fin structure. The impurity source film may serve as source of an impurity that becomes electrically active subsequent to diffusing from the source film into the semiconductor fin. In one embodiment, an impurity source film is disposed adjacent to a sidewall surface of a portion of a sub-fin region disposed between an active region of the fin and the substrate and is more proximate to the substrate than to the active area. In further embodiments, the impurity source film may provide a source of dopant that renders the sub-fin region complementarily doped relative to a region of the substrate forming a P/N junction that is at least part of an isolation structure electrically isolating the active fin region from a region of the substrate.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: October 2, 2018
    Assignee: Intel Corporation
    Inventors: Walid M. Hafez, Chia-Hong Jan, Jeng-Ya D. Yeh, Hsu-Yu Chang, Neville Dias, Chanaka Munasinghe
  • Patent number: 10091774
    Abstract: According to some embodiments, a wireless device receives (1020) a discovery burst from a network node (115). The same discovery burst includes multiple signals within at least one subframe, each of the multiple signals having one or more associated measurement functions. At least one of the multiple signals is received with multiple repetitions within the same discovery burst and two or more repetitions of the same type of signal can be combined by the wireless device. The wireless device performs (1024) at least one radio measurement based at least in part on a particular one of the signals of the discovery burst. The performed at least one radio measurement corresponds to a measurement function associated with the particular signal of the discovery burst.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: October 2, 2018
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Havish Koorapaty, Sorour Falahati, Mattias Frenne, George Jöngren, Muhammad Kazmi, Daniel Larsson, Yu Yang
  • Patent number: 10091701
    Abstract: A wireless communication system includes a plurality of Content Aware Routers (CARs) to facilitate a User Equipment (UE) handover. A source CAR exchanges communication data with a UE over a source wireless access point using Information Centric Network (ICN) routing. A target CAR receives a notification of the UE handover, requests the communication data for the UE, and receives subsequent data communication for the UE. The target CAR exchanges communication data with the UE over a target wireless access point using ICN routing.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: October 2, 2018
    Assignee: Sprint Communications Company L.P.
    Inventors: Ankur Sharma, Yu Zhou, Noman Muzaffar Alam
  • Patent number: 10091627
    Abstract: Message handshaking and integration may be provided. A message may be created by a client in a first format. The client may determine whether a server in communication with the client is operable to deliver the message in a second format. If so, the client may provide the message, in the first format, to the server for delivering to at least one recipient in the second format.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: October 2, 2018
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Yong Gang Mao, Shang Tao Zhou, Dong Dong Guo, Gleb Kholodov, Giok Hong Khoo, Yu Xiang Li, Ning Wang, Dong Hui Zhang, Yi Zhang
  • Patent number: 10090284
    Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device includes a first set of through vias between and connecting a top package and a redistribution layer (RDL), the first set of through vias in physical contact with a molding compound and separated from a die. The semiconductor device also includes a first interconnect structure between and connecting the top package and the RDL, the first interconnect structure separated from the die and from the first set of through vias by the molding compound. The first interconnect structure includes a second set of through vias and at least one integrated passive device.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: October 2, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen
  • Patent number: 10090382
    Abstract: The disclosure relates to forming single diffusion break (SDB) and end isolation regions in an integrated circuit (IC) structure, and resulting structures. An IC structure according to the disclosure includes: a plurality of fins positioned on a substrate; a plurality of gate structures each positioned on the plurality of fins and extending transversely across the plurality of fins; an insulator region positioned on and extending transversely across the plurality of fins between a pair of the plurality of gate structures; at least one single diffusion break (SDB) region positioned within the insulator region and one of the plurality of fins, the at least one SDB extending from an upper surface of the substrate to an upper surface of the insulator region; and an end isolation region positioned laterally adjacent to a lateral end of one of the plurality of gate structures.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: October 2, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hong Yu, Xinyuan Dou, Hui Zhan, Zhenyu Hu
  • Patent number: 10091639
    Abstract: Embodiments of the present disclosure disclose a registration area determining method, to reduce overheads for sending paging signaling to user equipment. The method in the embodiments of the present disclosure includes: determining, by a mobility management entity, that both duration in which user equipment does not access a basic registration area in a registration area of the user equipment and duration in which the user equipment does not initiate a periodic basic registration area update procedure are greater than or equal to preset duration; generating, by the mobility management entity, a new registration area for the user equipment, where the new registration area does not include the basic registration area; and sending, by the mobility management entity, the new registration area to the user equipment. The embodiments of the present disclosure further provide a mobility management entity, to reduce the overheads for sending paging signaling to the user equipment.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: October 2, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yu Yin, Caixia Qi
  • Patent number: 10088440
    Abstract: A heat dissipation estimating method is disclosed. The heat dissipation estimating method includes following steps: providing an input heat to a fin of a heat sink unit; obtaining an average temperature of the fin according to the input heat; obtaining an output heat according to the average temperature; determining whether the input heat is the same as the output heat or not; while the input heat is different from the output heat, updating the input heat according to the output heat and repeating the above steps until the input heat is the same as the output heat; and while the input heat is the same as the output heat, obtaining a total heat dissipation value of the heat sink unit according to the input heat and a ratio value.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: October 2, 2018
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Hua-Feng Chen, Wei-Yi Lin, Meng-Lung Chiang, Yu-Hsuan Lin
  • Patent number: 10087527
    Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: October 2, 2018
    Assignee: Wistron NeWeb Corp.
    Inventors: Babak Radi, Shih-Hong Chen, Yu-Fu Kuo, Chun-Lin Chen, Jing-Wen Chen
  • Patent number: 10088044
    Abstract: A parking brake actuator includes a motor, a power transfer assembly or gearing connected to an output shaft of the motor, a planetary gear set including a linear gear connected to the power transfer assembly, a planetary gear engaged with the linear gear, and a ring gear engaged with the planetary gear and including an insertion protrusion formed on a bottom, and a housing including a motor seating recess in which the motor is accommodated and a ring gear seating in which the ring gear is accommodated, in which the ring gear accommodating portion includes an insertion groove formed on a bottom surface into which the insertion protrusion is forcibly inserted.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: October 2, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Byeong Jong Yu
  • Patent number: 10091529
    Abstract: A method and apparatus for entropy coding and decoding a transformation block are provided. The method of entropy coding a transformation block includes: determining, according to a certain scan order, a location of a last significant transformation coefficient having a non-zero value from among transformation coefficients included in a transformation block having a certain size; and coding information about the determined location of the last significant transformation coefficient by using a horizontal axis direction location of the last significant transformation coefficient and a vertical axis direction location in the transformation block of the last significant transformation coefficient.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: October 2, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bae-Keun Lee, Yu-Mi Sohn
  • Patent number: 10086549
    Abstract: A plastic extrusion process control method includes: receiving a plurality of historical process data of a plastic extrusion process from a database, in which each of the historical process data includes a plurality of critical parameters and a plurality of quality value; dividing each of the critical parameters into a plurality of levels; grouping the historical process data according to the levels of the critical parameters to obtain a plurality of parameter sets; calculating a quality indicator of each of the parameter sets to build an empirical response surface according to the historical process data corresponding to the parameter sets; and configuring the critical parameters of the plastic extrusion process to an automatic manufacturing system according to the empirical response surface, such that the automatic manufacturing system performs the plastic extrusion process according to the critical parameters.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: October 2, 2018
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Yin-Jing Tien, Yi-Chang Chen, Cheng-Juei Yu
  • Patent number: 10091273
    Abstract: A data collecting device collecting state information of a photovoltaic device is provided. The data collecting device includes a reception unit collecting the state information, and a transmitting unit transmitting the state information according to a state information transmission time based on a state information group including the state information.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: October 2, 2018
    Assignee: LSIS CO., LTD.
    Inventors: Young Gyu Yu, Choong Kun Cho
  • Patent number: 10091793
    Abstract: A UE controls in-device coexistence (IDC) indication message generation to mitigate potential throughput impact on UE to maintain UE performance as much as possible. Under the proposed method, FDM-based solution is always preferred by the UE. Based on the IDC indication message generated by the UE, a network applies an IDC interference mitigation solution that prioritizes FDM-based solution. Specifically, the UE first sends an IDC message requesting FDM-based solution. In case the serving eNB does not respond, the UE sends a new IDC message by alternating IDC option. Even if a TDM-based solution has been received, the UE may continue requesting FDM-based solution to gain UE performance.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: October 2, 2018
    Assignee: MEDIATEK INC.
    Inventors: Li-Chun Ko, Yih-Shen Chen, Yu-Ting Chen, Chung-Wei Wang, Yi-Chien Wang