Patents by Inventor Yu Aoki

Yu Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT
    Publication number: 20150024173
    Abstract: The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.
    Type: Application
    Filed: February 4, 2013
    Publication date: January 22, 2015
    Inventors: Shingo Tahara, Shigeki Katogi, Hiroshi Matsutani, Kouichi Abe, Akitoshi Tanimoto, Yu Aoki
  • PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT
    Publication number: 20140322635
    Abstract: There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein R1 represents a hydrogen atom or a hydrocarbon group; R2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.
    Type: Application
    Filed: October 31, 2012
    Publication date: October 30, 2014
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Akitoshi Tanimoto, Shigeru Nobe, Kei Kasuya, Hiroshi Matsutani, Shigeki Katogi, Yu Aoki, Shingo Tahara
  • Positive photosensitive resin composition, method of creating resist pattern, and electronic component
    Patent number: 8836089
    Abstract: The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: September 16, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Akitoshi Tanimoto, Shigeru Nobe, Kei Kasuya, Hiroshi Matsutani, Takumi Ueno, Yu Aoki, Shingo Tahara
  • POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT
    Publication number: 20130168859
    Abstract: The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.
    Type: Application
    Filed: September 2, 2011
    Publication date: July 4, 2013
    Inventors: Akitoshi Tanimoto, Shigeru Nobe, Kei Kasuya, Hiroshi Matsutani, Takumi Ueno, Yu Aoki, Shingo Tahara