Patents by Inventor Yu Bao He

Yu Bao He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7994516
    Abstract: The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: August 9, 2011
    Assignee: OSRAM Gesellschaft mit beschränkter Haftung
    Inventors: Chi Man Chan, Huajian Fan, Yu Bao He, Xi Yuan He, Ze Sheng Ye, Max Yue
  • Publication number: 20090272986
    Abstract: The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.
    Type: Application
    Filed: March 31, 2009
    Publication date: November 5, 2009
    Applicant: OSRAM Gesellschaft mit beschrankter Haftung
    Inventors: Chi Man Chan, Huajian Fan, Yu Bao He, Xi Yuan He, Ze Sheng Ye, Max Yue