Abstract: An alternating current light emitting diode device is disclosed, which comprises a substrate having a supporting surface and two supporting elements locating on the two sides of the supporting surface; a plurality of LED grains set on the supporting surface; a first chip resistor set on one of the two supporting elements; and a plurality of electrical wires providing electrical connections between the LED grains, and between the LED grain and the first chip resistor. Therefore, the total wattage of the AC LED device can be lowered to a designed range by using a chip resistor with proper resistance, and the total illumination efficiency can be increased.

Abstract: An LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and an LED module electrically connected with the positive-electrode frame and the negative-electrode frame. The LED module includes a plurality of LED chips. The heatsink slug is provided, at its surface, with a plurality of cup-like recesses. The plural LED chips are each bonded, correspondingly, on a plane in the cup-like recess. Each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex contour. As a result, a specific proportion for the color lights emitted from all the LED chips and from the fluorescent material in every direction of a space can be maintained, and that a better spatial color uniformity can be achieved.

Abstract: A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.

Abstract: The present invention provides a phosphor composition for AC LEDs, which is represented by the following formula (I): M1?x?ySi2O2?wN2+2w/3:Eux,Ry??(I) wherein, M, R, x, y, and w are defined the same as the specification. In addition, the present invention also provides an AC LED manufactured with the same.

Abstract: An LED support's lead frame structure includes a side frame, a loading piece connected with the side frame, and at least one electrode pin. The electrode pin is located at one side of the loading piece and is spaced apart therefrom. The loading piece has a thickness same as that of the electrode pin. The electrode pin includes, connected in sequence, a first external leading section, a wire-bonding section, and a second external leading section. Both the first and the second external leading sections are connected with the side frame. The wire-bonding section includes a first protrusion. Therefore, the material required for wire-bonding is decreased, and the steps for machining the lead frame are decreased, so that the manufacturing process can be speeded up. This will help LED products miniaturized and the LED structure superior in thermal conductivity.

Abstract: An LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and an LED module electrically connected with the positive-electrode frame and the negative-electrode frame. The LED module includes a plurality of LED chips. The heatsink slug is provided, at its surface, with a plurality of cup-like recesses. The plural LED chips are each bonded, correspondingly, on a plane in the cup-like recess. Each of the LED chips is covered with a fluorescent colloidal layer having a curved and convex contour. As a result, a specific proportion for the color lights emitted from all the LED chips and from the fluorescent material in every direction of a space can be maintained, and that a better spatial color uniformity can be achieved.

Abstract: A LED package structure includes a heatsink slug, a positive-electrode frame, a negative-electrode frame, and a LED module electrically connected with the positive-electrode frame and the negative-electrode frame, respectively. The heatsink slug is provided, on its surface, with a converged ladder-like recess, where the LED module is fixed on a plane deep inside the recess. Thereby, the fluorescent-colloidal-layer covering on the LED module has an increased thickness in a normal direction, making the color-lights emitted from the chips and from the fluorescent colloid in the space and in every direction able to be maintained so as to achieve a better spatial color uniformity.

Abstract: A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.

Abstract: A high-efficiency LED includes: a substrate, an epitaxial layer structure, a cathode, an anode, a transparent sealing compound and a polyimide layer. The polyimide layer covers surfaces of the epitaxial layer structure and the substrate. The transparent sealing compound covers the polyimide layer, the substrate, the epitaxial layer structure, the cathode and the anode. The polyimide layer of the present invention has a refractive index higher than that of packaging materials in prior art, so as to reduce total internal reflection and optical consumption caused by light scattered from the epitaxial layer structure and the transparent sealing compound.

Abstract: An AC LED device for avoiding harmonic current and flash includes an AC power input terminal, a first AC LED group and a second AC LED group. The AC power input terminal receives an AC power including a positive half-cycle and a negative half-cycle. The first AC LED group is turned on in the positive half-cycle and turned off in the negative half-cycle. The second AC LED group is turned on in the negative half-cycle and turned off in the positive half-cycle. Each of the first AC LED group and the second AC LED group has an overall on voltage with a value lower than a peak voltage value of the AC power by a predetermined value, and an overall peak inverse voltage with a value higher than the peak voltage value of the AC power, so as to increase power factor and avoid harmonic current, thereby effectively eliminating flash problems of the AC LED.

Abstract: An AC LED package structure includes a heat-sink slug, an AC LED module, a positive-electrode frame, a negative-electrode frame, and an insulation submount. The AC LED module is electrically connected with the positive-electrode frame and the negative-electrode frame, respectively. The insulation submount is interposed between the AC LED module and the heat-sink slug. The insulation submount is characterized by having a voltage-resistance value greater than 1000 volts. Therefore, it is possible to prevent the AC LED chip of an AC LED device from being broken through by high voltage, causing an electric shock if a human body touches the AC LED device. And moreover, the AC LED device can satisfy the requirements of a certified safety specification.

Abstract: An LED package structure includes an LED chip, an internal transparent colloidal layer, a fluorescent colloidal layer, and an external transparent colloidal layer. The internal transparent colloidal layer is interposed between the LED chip (such as a blue-light LED chip) and the fluorescent colloidal layer (such as a yellow fluorescent colloidal layer), and that the external transparent colloidal layer, in cooperation with the internal transparent colloidal layer, sandwiches and envelops the fluorescent colloidal layer so as to lower the possibility that light emitted from the LED chip may be absorbed by the LED chip itself because the light is scattered backward by particles of the fluorescent powder. This will increase overall lumen output and decrease thermal energy of the LED chip, and will as well provide a more desirable moisture insulation for the fluorescent powder.

Abstract: An alternating current light emitting diode device is disclosed, which comprises a substrate having a supporting surface and two supporting elements locating on the two sides of the supporting surface; a plurality of LED grains set on the supporting surface; a first chip resistor set on one of the two supporting elements; and a plurality of electrical wires providing electrical connections between the LED grains, and between the LED grain and the first chip resistor. Therefore, the total wattage of the AC LED device can be lowered to a designed range by using a chip resistor with proper resistance, and the total illumination efficiency can be increased.