Patents by Inventor Yu-Cang Chen

Yu-Cang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Touch device and input module
    Patent number: 11164707
    Abstract: The invention provides a touch device and an input module. The touch device includes a cover plate, a circuit board, a restoration element, a bracket, at least one conductive pad, and a buffer layer. The circuit board is disposed on one side of the cover plate and has a first surface facing the cover plate, a second surface opposite to the first surface, and at least one conductive switch disposed on the second surface. The bracket is disposed on the second surface of the circuit board. The restoration element is disposed on the second surface, and the conductive pad is disposed on the bracket and located between the bracket and the circuit board. The conductive pad and the restoration element are separately disposed, and the conductive pad corresponds to the conductive switch. The buffer layer is disposed between the second surface and the restoration element.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: November 2, 2021
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Cheng-An Lu, Kuo-Hua Kao, Yu-Cang Chen
  • TOUCH DEVICE AND INPUT MODULE
    Publication number: 20200333917
    Abstract: The invention provides a touch device and an input module. The touch device includes a cover plate, a circuit board, a restoration element, a bracket, at least one conductive pad, and a buffer layer. The circuit board is disposed on one side of the cover plate and has a first surface facing the cover plate, a second surface opposite to the first surface, and at least one conductive switch disposed on the second surface. The bracket is disposed on the second surface of the circuit board. The restoration element is disposed on the second surface, and the conductive pad is disposed on the bracket and located between the bracket and the circuit board. The conductive pad and the restoration element are separately disposed, and the conductive pad corresponds to the conductive switch. The buffer layer is disposed between the second surface and the restoration element.
    Type: Application
    Filed: March 30, 2020
    Publication date: October 22, 2020
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Cheng-An Lu, Kuo-Hua Kao, Yu-Cang Chen