Abstract: A method for drying a wafer includes a cleaning step, a liquid replacing step, and a drying step. In the cleaning step, a workpiece located in a process chamber is cleaned with a cleaning solution. In the liquid replacing step, a drying agent in gas phase is compressed to convert into liquid phase, and the drying agent in liquid phase is introduced to the process chamber to replace the cleaning solution. In the drying step, the cleaning solution is discharged out of the process chamber, and then the drying agent is converted from liquid phase back to gas phase and is discharged out of the process chamber.

Abstract: A barrier layer is formed in a portion of a thickness of sidewalls in a recess prior to formation of an interconnect structure in the recess. The barrier layer is formed in the portion of the thickness of the sidewalls by a plasma-based deposition operation, in which a precursor reacts with a silicon-rich surface to form the barrier layer. The barrier layer is formed in the portion of the thickness of the sidewalls in that the precursor consumes a portion of the silicon-rich surface of the sidewalls as a result of the plasma treatment. This enables the barrier layer to be formed in a manner in which the cross-sectional width reduction in the recess from the barrier layer is minimized while enabling the barrier layer to be used to promote adhesion in the recess.

Abstract: Some embodiments relate to an integrated chip structure. The integrated chip structure includes a substrate having a first device region and a second device region. A plurality of first transistor devices are disposed in the first device region and respectively include epitaxial source/drain regions disposed on opposing sides of a first gate structure. The epitaxial source/drain regions have an epitaxial material. A plurality of second transistor devices are disposed in the second device region and respectively include implanted source/drain regions disposed on opposing sides of a second gate structure. A dummy region includes one or more dummy structures. The one or more dummy structures have dummy epitaxial regions including the epitaxial material.

Abstract: A method of compiling a deep learning model includes reading metadata from a compiled result, the metadata indicating a structure of the deep learning model corresponding to a low-level IR, receiving shape information of an input tensor of the deep learning model, determining a shape of an output tensor of a first computation operation of the computation operations based on the shape information of the input tensor of the deep learning model and the structure of the deep learning model, tiling the output tensor of the first computation operation into one or more tiles according to the shape of the output tensor of the first computation operation and hardware limitations of a processor executing the deep learning model, and patching one or more copies of a templated hardware command into executable hardware commands.

Abstract: An electronic device includes a display screen, a first aperture region and a second aperture region. The display screen is disposed on a surface of the electronic device. The first aperture region is disposed on the surface of the electronic device, and a visible light is able to enter into an internal portion of the electronic device through the first aperture region. The second aperture region is disposed on the surface of the electronic device, and the visible light is able to enter into the internal portion of the electronic device through the second aperture region. The display screen is disposed between the first aperture region and the second aperture region and configured to be a spacing maintained therebetween, and a shape of the first aperture region and a shape of the second aperture region are non-circular and mirror-symmetrical to each other.

Abstract: A handheld device includes a body and a back cover. The body has a back portion covered by the back cover. The back cover includes a yielding layer and a rigid layer. The yielding layer has an outer surface and an inner surface opposite to each other. The inner surface faces the back portion. The rigid layer is formed on the inner surface and locked to the body. The rigid layer has a hole exposing the back portion and covered by the yielding layer. When a portion of the yielding layer corresponding to the hole is pressed, the portion of the yielding layer is elastically deformed to closely lean on the back portion, and the locked body and rigid layer are released due to a force between the portion of the yielding layer and the back portion, such that the back cover may depart from the body.

Abstract: A super I/O module for controlling at least one I/O port of a computer system is provided. The super I/O module includes a controller, a signal detector and a selector. The controller supports functions corresponding to the I/O port. The signal detector receives an input signal from the I/O port, and detects whether the input signal has an identification code. When detecting that the input signal has the identification code, the signal detector generates a selection signal according to the identification code. The selector receives the selection signal and selectively provides the input signal to the controller or a function circuit of the computer system according to the selection signal.

Abstract: A handheld device includes a body and a back cover. The body has a back portion covered by the back cover. The back cover includes a yielding layer and a rigid layer. The yielding layer has an outer surface and an inner surface opposite to each other. The inner surface faces the back portion. The rigid layer is formed on the inner surface and locked to the body. The rigid layer has a hole exposing the back portion and covered by the yielding layer. When a portion of the yielding layer corresponding to the hole is pressed, the portion of the yielding layer is elastically deformed to closely lean on the back portion, and the locked body and rigid layer are released due to a force between the portion of the yielding layer and the back portion, such that the back cover may depart from the body.

Abstract: A super I/O module for controlling at least one I/O port of a computer system is provided. The super I/O module includes a controller, a signal detector and a selector. The controller supports functions corresponding to the I/O port. The signal detector receives an input signal from the I/O port, and detects whether the input signal has an identification code. When detecting that the input signal has the identification code, the signal detector generates a selection signal according to the identification code. The selector receives the selection signal and selectively provides the input signal to the controller or a function circuit of the computer system according to the selection signal.