Patents by Inventor Yu-Chang Chow

Yu-Chang Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6401728
    Abstract: A process for cleaning the interior walls of a reaction chamber after a number of silicon wafers is etched inside the chamber. The cleaning process includes bombarding the interior walls of the chamber with a first type of plasma in a dry cleaning operation, and then bombarding the interior walls of the chamber with a second type of plasma containing the element hydrogen in a warm-up operation. No silicon wafers need to be placed inside the chamber when the dry cleaning operation or the warm-up operation is conducted.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: June 11, 2002
    Assignee: United Microelectronics Corp.
    Inventors: Yu-Chang Chow, W. H. Cheng, Chia-Fu Yeh, C. M. Chi, Cobby Lee
  • Patent number: 6374832
    Abstract: A waferless seasoning process is described, which waferless seasoning process is suitable for an etching chamber of an etching machine when the etching environment is so bad that etching cannot be performed. A dry cleaning process with a plasma formed by oxygen and hydrogen bromide is performed to restore the etching environment in the etching chamber.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: April 23, 2002
    Assignee: United Microelectronics Corp.
    Inventors: Yu-Chang Chow, Wen-Hua Cheng, Hung-Chen Yu, Chih-Ming Chi
  • Publication number: 20010052350
    Abstract: A process for cleaning the interior walls of a reaction chamber after a number of silicon wafers is etched inside the chamber. The cleaning process includes bombarding the interior walls of the chamber with a first type of plasma in a dry cleaning operation, and then bombarding the interior walls of the chamber with a second type of plasma containing the element hydrogen in a warm-up operation. No silicon wafers need to be placed inside the chamber when the dry cleaning operation or the warm-up operation is conducted.
    Type: Application
    Filed: April 5, 1999
    Publication date: December 20, 2001
    Inventors: YU-CHANG CHOW, W. H. CHENG, CHIA-FU YEH, C.M. CHI, COBBY LEE
  • Publication number: 20010046769
    Abstract: A waterless seasoning process is described, which waterless seasoning process is suitable for an etching chamber of an etching machine when the etching environment is so bad that etching cannot be performed. A dry cleaning process with a plasma formed by oxygen and hydrogen bromide is performed to restore the etching environment in the etching chamber.
    Type: Application
    Filed: March 29, 1999
    Publication date: November 29, 2001
    Inventors: YU-CHANG CHOW, W.H. CHENG, H.C. YU, C.M. CHI
  • Patent number: 6232226
    Abstract: A method of fabricating a barrier layer includes a clamped metal layer formed on a substrate. After the formation of the clamped metal layer, a rapid thermal process is performed. A clampless metal nitride layer is then formed on the clamped metal layer.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: May 15, 2001
    Assignee: United Microelectronics Corp.
    Inventor: Yu-Chang Chow
  • Patent number: 4777061
    Abstract: A process is disclosed for depositing tungsten non-selectively on conductors and dielectrics without the use of an adhesive interlayer. The process comprises an argon pre-treatment followed by low power plasma deposition to nucleate the tungsten. A thick, adherent layer of tungsten is then deposited.
    Type: Grant
    Filed: December 14, 1987
    Date of Patent: October 11, 1988
    Assignees: Spectrum CVD, Inc.
    Inventors: Schyi-yi Wu, J. B. Price, John Mendonca, Yu Chang Chow