Abstract: One aspect of the present disclosure pertains to an IC packaging structure that includes a bottom circuit structure having first semiconductor devices on a first substrate, a first interconnect structure over the first semiconductor devices, and a first bonding structure over the first interconnect structure; and a top circuit structure having second semiconductor devices on a second substrate, a second interconnect structure underlying the second semiconductor devices, and a second bonding structure underlying the second interconnect structure. The first bonding structure includes a first metal feature having a first crystalline bulk layer of a metal and a first amorphous surface layer of the metal. The second bonding structure includes a second metal feature having a second crystalline bulk layer of the metal and a second amorphous surface layer of the metal. The top circuit structure is bonded to the bottom circuit structure through the first and second amorphous surface layers.

Abstract: A method for forming a bonding structure is provided, including providing a first metal, wherein the first metal has a first absolute melting point. The method includes forming a silver nano-twinned layer on the first metal. The silver nano-twinned layer includes parallel-arranged twin boundaries. The parallel-arranged twin boundaries include 90% or more [111] crystal orientation. The method includes oppositely bonding the silver nano-twinned layer to a second metal. The second metal has a second absolute melting point. The bonding of the silver nano-twinned layer and the second metal is performed at a temperature of 300° C. to half of the first absolute melting point or 300° C. to half of the second absolute melting point.

Abstract: An antenna structure includes a substrate, a radiation unit, and a metal plate. The radiation unit is disposed on the substrate. The metal plate is separated from the radiation unit for a distance and is electrically isolated with the radiation unit. The metal plate is excited by the radiation unit to generate at least one resonance mode, and includes a hole penetrating the metal plate. Thus, the gain is enhanced, the bandwidth is increased, and multiple resonance modes are provided.

Abstract: An antenna structure includes a substrate, a radiation unit, and a metal plate. The radiation unit is disposed on the substrate. The metal plate is separated from the radiation unit for a distance and is electrically isolated with the radiation unit. The metal plate is excited by the radiation unit to generate at least one resonance mode, and includes a hole penetrating the metal plate. Thus, the gain is enhanced, the bandwidth is increased, and multiple resonance modes are provided.