Patents by Inventor Yu-Chang Pai
Yu-Chang Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120032385Abstract: A clamping mechanism for holding a workpiece includes an end executor, a driving member, and a contact member detachably mounted on the end executor. The end executor includes a plurality of claws arranged in matrix. The contact member includes a mounting board and a plurality of contact sleeves corresponding to the claws. The driving member is capable of driving the mounting board, moving the contact sleeves to extend the claws, and hold the workpiece.Type: ApplicationFiled: December 30, 2010Publication date: February 9, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHEN-CHUN LI, HSIEN-CHUAN LIANG, WEN-LAING TSENG, YUNG-CHIEH CHEN, YU-CHANG PAI, SHOU-KUO HSU
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Publication number: 20120025857Abstract: An exemplary manipulator of a robot includes a fastening seat defining two guiding grooves, a driving mechanism disposed on the fastening seat, two transmitting plates respectively received in the two guiding grooves and cooperating with the driving mechanism, and two detecting bars each fixedly connecting with a corresponding transmitting plate. A detecting pin is fixed on each of the detecting bars. Under a driving action of the driving mechanism on the transmitting plates, the transmitting plates are activated to slide in the guiding grooves to cause the detecting bars to move close to or apart from each other, whereby a distance between the two detecting pins is automatically regulated.Type: ApplicationFiled: September 17, 2010Publication date: February 2, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHEN-CHUN LI, HSIEN-CHUAN LIANG, WEN-LAING TSENG, YU-CHANG PAI, SHOU-KUO HSU
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Publication number: 20120018199Abstract: A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply.Type: ApplicationFiled: August 30, 2010Publication date: January 26, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YING-TSO LAI, YU-CHANG PAI
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Publication number: 20120016920Abstract: A direct current compensation method for S-parameter rational functions reads S-parameters f(sk), which are generated at given frequency sk, from a storage unit. An S-parameter, which is generated at frequency sk=0 is supplemented into the S-parameters f(sk), upon the condition that there is no S-parameter which is generated at the frequency sk=0. An S-parameter ration function is generated according to the S-parameters f(sk). A DC level of the S-parameter rational function is compensated to generate a compensated S-parameter rational function.Type: ApplicationFiled: March 2, 2011Publication date: January 19, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: WEN-LAING TSENG, SHEN-CHUN LI, YU-CHANG PAI, SHOU-KUO HSU
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Publication number: 20120016620Abstract: A system and method for testing objects using a mechanical arm includes establishing coordinate system based on a work area of the mechanical arm, and obtaining test parameters from a storage system. The method further includes controlling the mechanical arm to get an object and position the object to the position of a test platform according to the test parameters, controlling the mechanical arm to get test tool from a tool shelf and position the test tool to a position of test point on the object to test the object according to the test parameters. The method also includes controlling the mechanical arm to get the object from the test platform and position the object to the location reserved for the object according to the test parameters.Type: ApplicationFiled: December 24, 2010Publication date: January 19, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: SHEN-CHUN LI, HSIEN-CHUAN LIANG, WEN-LAING TSENG, YUNG-CHIEH CHEN, YU-CHANG PAI, SHOU-KUO HSU
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Publication number: 20120000700Abstract: A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.Type: ApplicationFiled: July 15, 2010Publication date: January 5, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIEN-HUNG LIU, PO-CHUAN HSIEH, YU-CHANG PAI, SHOU-KUO HSU
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Publication number: 20120005388Abstract: An exemplary high speed data storage system includes hard disks, a first control panel, a second control panel and a midplane interconnected between each of the first and second control panels and the hard disks. Each of the first and second control panels includes a control chip and a connector. First and second printed circuit wires corresponding to the hard disks are layered on the first and second control panels for electrically connecting the control chip with the connector, respectively. The first printed circuit wires of the first control panel and the second printed circuit wires of the second control panel are arranged symmetrically with respect to each other, and an order of stacking circuit layers of the first printed circuit wires of the first control panel is the reverse of an order of stacking of circuit layers of the second printed circuit wires of the second control panel.Type: ApplicationFiled: September 13, 2010Publication date: January 5, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Po-Chuan HSIEH, Chien-Hung LIU, Yu-Chang PAI
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Publication number: 20110320183Abstract: A computing device and a method determines port relationships of a differential transmission line of a circuit board according to an original scattering parameters file, which records scattering parameter values measured from ports of the differential transmission line under different signal frequencies. The computing device generates a new scattering parameters file matching a scattering parameters model predefined for the differential transmission line according to the determined port relationships. Design of the differential transmission line is analyzed to determine if the differential transmission line is qualified according to the new scattering parameters file and the scattering parameters model.Type: ApplicationFiled: October 17, 2010Publication date: December 29, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: PO-CHUAN HSIEH, YU-CHANG PAI, CHIEN-HUNG LIU
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Publication number: 20110309898Abstract: A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollow spiral patterns in the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines onto the ground layer. Hollowed areas of the two filter portions are bridged by a void.Type: ApplicationFiled: June 28, 2010Publication date: December 22, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YU-CHANG PAI, PO-CHUAN HSIEH, CHIEN-HUNG LIU
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Publication number: 20110298341Abstract: An enclosure of an electronic device includes a plate. The plate defines a number of through holes with a number of shields. Each shield includes a tab apart from the plate. At least two spaced connection pieces connect the tab to a corresponding through hole in such a way that the tab is substantially aligned with and spaced from the corresponding through hole.Type: ApplicationFiled: August 19, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chien-Hung Liu, Yu-Chang Pai, Po-Chuan Hsieh, Shou-Kuo Hsu
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Publication number: 20110297435Abstract: An enclosure includes a ventilation plate. The ventilation plate defines a number of through holes. Two hollow bulges extend from an edge bounding each of the through holes at two opposite sides of the plate. A top of each of the bulges defines an opening. The openings of the two bulges and the corresponding through hole define a passage for ventilation and elongate a path that electromagnetic signals must travel to pass through the ventilation plate. The enclosure can better shield the electronic device from EMI.Type: ApplicationFiled: August 26, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIEN-HUNG LIU, PO-CHUAN HSIEH, YU-CHANG PAI
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Publication number: 20110298563Abstract: A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines.Type: ApplicationFiled: June 25, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YU-CHANG PAI, CHIEN-HUNG LIU, PO-CHUAN HSIEH
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Publication number: 20110301922Abstract: A simulation system for producing equivalent circuits reads data corresponding to a tabular W element format in a storage device, and adds data of the tabular W element format file using interpolation algorithm. A frequency-dependent transmission matrix is transformed into an N-port network matrix describing electrical properties of a multi-input and multi-output network. An N-port network matrix is transformed into a S-parameter matrix. A range of frequency of a s-parameter is determined and numbers of pole-residue, times for recursion and durable maximum system errors in the equivalent circuit is also determined. A a vector fitting algorithm is performed and a rational function matrix composed with s-parameters is produced, to produce a general SPICE equivalent circuit based on the generated rational function matrix.Type: ApplicationFiled: December 2, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: WEN-LAING TSENG, CHENG-HSIEN LEE, SHEN-CHUN LI, YU-CHANG PAI, SHOU-KUO HSU
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Publication number: 20110297413Abstract: An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference.Type: ApplicationFiled: August 23, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chien-Hung LIU, Po-Chuan HSIEH, YU-CHANG PAI
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Publication number: 20110301923Abstract: A simulation system and method for generating equivalent circuits compatible with HSPICE reads data corresponding to N-port network system format in a storage device, and obtains S-parameter matrixes from the N-port network system. S-parameters in the S-parameter matrix that satisfy passivity are checked, and an interpolation algorithm to supplement S-parameters with passivity when some S-parameters not satisfy passivity is performed. Numbers of pole-residue, times for recursion and a tolerant system error of a rational function are generated for determining S-parameters. A rational function matrix composed of S-parameters is generated by performing a vector fitting algorithm, and an equivalent circuit is generated compatible with HSPICE format based on the generated rational function matrix.Type: ApplicationFiled: December 8, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: WEN-LAING TSENG, CHENG-HSIEN LEE, SHEN-CHUN LI, YU-CHANG PAI, SHOU-KUO HSU
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Publication number: 20110299263Abstract: An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.Type: ApplicationFiled: August 13, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Yu-Chang Pai, Po-Chuan Hsieh, Chien-Hung Liu, Shou-Kuo Hsu
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Publication number: 20110297438Abstract: An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI.Type: ApplicationFiled: August 25, 2010Publication date: December 8, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: PO-CHUAN HSIEH, YU-CHANG PAI, CHIEN-HUNG LIU
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Patent number: 8068553Abstract: A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system.Type: GrantFiled: December 9, 2009Date of Patent: November 29, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Po-Chuan Hsieh, Chun-Jen Chen, Chien-Hung Liu, Yu-Chang Pai, Shou-Kuo Hsu
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Patent number: 8067700Abstract: A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) is defined in the PCB having a plated sidewall (230) plated on its inner surface, and a first clearance hole (271) is defined in a first inner layer (260) of the PCB around the sidewall. A first transmission line (210) defined on the top surface of the PCB is coupled to the upper cap, a first void (273) extending from a boundary of the first clearance hole being disposed along the layout direction of the first transmission line.Type: GrantFiled: October 30, 2007Date of Patent: November 29, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yu-Chang Pai, Shou-Kuo Hsu, Chien-Hung Liu
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Publication number: 20110273245Abstract: A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollowing patterns on the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines on the ground layer. Each of the two filter portions includes a number of long narrow parallel strips connected in a snake like pattern. Hollowed areas of the two filter portions are bridged through a void.Type: ApplicationFiled: May 7, 2010Publication date: November 10, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YU-CHANG PAI, CHIEN-HUNG LIU, PO-CHUAN HSIEH