Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A power consumption monitoring device includes a sensor, a storage, and a processor. The sensor is configured to detect a power-consuming device quantity and a power consumption amount. The storage is configured to store the power-consuming device quantity and the power consumption amount. The processor is communicatively connected to the sensor and the storage. The processor is configured to calculate a power-consuming device idling indicator based on the power-consuming device quantity and the power consumption amount in a monitoring time interval, wherein the power-consuming device idling indicator is used for indicating a deviation status of the power-consuming device quantity and the power consumption amount. The processor is further configured to determine whether the power-consuming device idling indicator exceeds a warning threshold. In response to the power-consuming device idling indicator exceeding the warning threshold, the processor is further configured to generate a warning message.

Abstract: One embodiment of the invention provides an illumination system including a light-source supporting body and a power supporting body. The light-source supporting body has a first groove. At least a light-source module is received in the first groove. The power supporting body has second groove. At least a power module is received in the second groove. The light-source supporting body is detachably fixed on the power supporting body. Each light-source module includes a multichip package structure composed of a plurality of light-emitting chips, and each of the light-source modules and the power module are separated by the light-source supporting body and the power supporting body.

Abstract: A light emitting system is provided. An exemplary embodiment of a light emitting system comprising at least a light emitting module comprises a substrate, and light emitting rows supported by the substrate, wherein each light emitting row has unpackaged light emitting chips, surrounded by a reflective structure, and a transparent lens is disposed above the light emitting rows for mixing lights emitted from the light emitting rows to form a light source. An exemplary embodiment of a light emitting module of the invention can improve light emitting efficiency effectively with achieving better heat dissipation efficiency.

Abstract: A light emitting element includes: a substrate; a first electrically conductive semiconductor layer located on the substrate; a light emitting layer located on a top surface of the first electrically conductive semiconductor layer; a second electrically conductive semiconductor layer located on a top surface of the light emitting layer; a positive electrode located on a top surface of the second electrically conductive semiconductor layer; and a negative electrode at least partially located on a side surface of the first electrically conductive semiconductor layer.

Abstract: One embodiment of the invention provides an illumination system including a light-source supporting body and a power supporting body. The light-source supporting body has a first groove. At least a light-source module is received in the first groove. The power supporting body has second groove. At least a power module is received in the second groove. The light-source supporting body is detachably fixed on the power supporting body. Each light-source module includes a multichip package structure composed of a plurality of light-emitting chips, and each of the light-source modules and the power module are separated by the light-source supporting body and the power supporting body.

Abstract: A light emitting system, a light emitting apparatus and the forming method thereof, the light emitting system comprising a plurality of light emitting units (100) and a frame for connecting the light emitting units. Each light emitting unit comprises a substrate (102), one or a plurality of chips (104) disposed on the substrate, an annular member (110) disposed on the substrate and surrounding the chips, the annular member used for adjusting the direction of the light emitted from the chips, and a protective layer (108) covering the chips, wherein the height of the protective layer is not more than that of the annular member.

Abstract: A light emitting device fabrication method. The fabrication method of the light emitting device comprises providing a light emitting semiconductor device; positioning a plurality of luminescent particles at the optical path of the light emitting semiconductor device; and reducing the distance between the luminescent particles to enhance the molecular attraction between the luminescent particles, than the luminescent particles is coagulated to a luminescent powder layer by the molecular attraction.

Abstract: A light emitting system, a light emitting apparatus and the forming method thereof, the light emitting system comprising a plurality of light emitting units (100) and a frame for connecting the light emitting units. Each light emitting unit comprises a substrate (102), one or a plurality of chips (104) disposed on the substrate, an annular member (110) disposed on the substrate and surrounding the chips, the annular member used for adjusting the direction of the light emitted from the chips, and a protective layer (108) covering the chips, wherein the height of the protective layer is not more than that of the annular member.

Abstract: A light emitting device fabrication method. The fabrication method of the light emitting device comprises providing a light emitting semiconductor device; positioning a plurality of luminescent particles at the optical path of the light emitting semiconductor device; and reducing the distance between the luminescent particles to enhance the molecular attraction between the luminescent particles, than the luminescent particles is coagulated to a luminescent powder layer by the molecular attraction.

Abstract: A light emitting system is provided. An exemplary embodiment of a light emitting system comprising at least a light emitting module comprises a substrate, and light emitting rows supported by the substrate, wherein each light emitting row has unpackaged light emitting chips, surrounded by a reflective structure, and a transparent lens is disposed above the light emitting rows for mixing lights emitted from the light emitting rows to form a light source. An exemplary embodiment of a light emitting module of the invention can improve light emitting efficiency effectively with achieving better heat dissipation efficiency.

Abstract: A light emitting device fabrication method. The fabrication method of the light emitting device comprises providing a light emitting semiconductor device; positioning a plurality of luminescent particles at the optical path of the light emitting semiconductor device; and reducing the distance between the luminescent particles to enhance the molecular attraction between the luminescent particles, than the luminescent particles is coagulated to a luminescent powder layer by the molecular attraction.