Abstract: In an automated detection system for acute ischemic stroke, a preprocessor performs registration on a whole-brain image and a standard-brain spatial template to extract individual brain region masks from the whole-brain image. A deep learning encoder performs feature extraction on the whole-brain image and the individual brain region masks, thereby converting the whole-brain image into 2D whole-brain slice images. A first processor maps the individual brain masks onto the whole-brain slice images for registration, thereby generating sets of brain region slice images. A second processor computes the stroke-related weight values of the slice images of each of the sets of brain region slice images and sums the weight values to obtain the characteristic value of each brain region. A disparity-aware classifier determines whether any brain region has acute ischemic stroke according to the characteristic value of each brain region.

Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.

Abstract: The present disclosure relates to a semiconductor device and a method of forming the same, and the semiconductor device includes a substrate, a gate line and a stress layer. The substrate has a plurality of first fins protruded from the substrate. The gate line is disposed over the substrate, across the first fins, to further include a gate electrode and a gate dielectric layer, wherein the dielectric layer is disposed between the gate electrode layer and the first fins. The stress layer is disposed only on lateral surfaces of the first fins and on a top surface of the substrate, wherein a material of the stress layer is different from a material of the first fins.

Abstract: An internal rotor type nail drive device of electric nail gun, comprising a nailing rod and an internal rotor type rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator comprises a stator and a rotor arranged inside the stator, even groups of electromagnetic mutual action components are configured in pairs between the stator and the rotor, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by a specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified, and the kinetic energy for nailing can be increased.

Abstract: An electronic device includes a first antenna, a second antenna, and an interference reduction device. The first antenna is arranged at a first position. The second antenna is arranged at a second position. The second position is different from the first position. The interference reduction device is arranged at a third position. The third position is different from the first position and the second position. The interference reduction device includes a structural feature configured to couple an electromagnetic wave and reduce radiation of the electromagnetic wave.

Abstract: A mobile device includes a main antenna and a hairpin element. The hairpin element is disposed adjacent to the main antenna, and substantially has a U-shape. The hairpin element is configured to increase bandwidth and antenna efficiency of the main antenna.

Abstract: A mobile device includes a ground plane, a grounding trace, and a feeding trace. The grounding trace defines a notch, and has a shorted end coupled to the ground plane. The feeding trace is disposed adjacent to the grounding trace, and has a feeding end and an open end. An antenna structure is formed by the grounding trace and the feeding trace. The feeding end of the feeding trace is coupled to a signal source. The open end of the feeding trace substantially extends into the notch of the grounding trace.

Abstract: A circuit under pad structure comprises a bonding pad to provide a bonding region and a probing region which are not overlapped to each other, so as to reduce the pounding to the structure under the bounding pad during the test and package process. A simple process for forming the circuit under pad structure is further provided, which comprises formation of a passivation layer over the bonding pad, and etch to the passivation layer to form two openings for exposing the bonding pad so as to provide the bonding region and the probing region.

Abstract: A cellular MOS array becomes denser by employing an asymmetric structure, in which the areas of the sources are reduced without changing the length and the width of the channel thereof, and thereby the chip size is reduced and the cost is lowered.

Abstract: A cellular MOS array becomes denser by employing an asymmetric structure, in which the areas of the sources are reduced without changing the length and the width of the channel thereof, and thereby the chip size is reduced and the cost is lowered.