Patents by Inventor Yu Chen

Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240065609
    Abstract: Disclosed are methods and devices of generating predicted brain images. The present disclosure provides a method of generating a predicted brain image. The method comprises: receiving a first brain image; encoding the first brain image to generate a latent vector; and decoding the latent vector and one or more conditional features to generate the predicted brain image. The first brain image is generated by a magnetic resonance imaging (MRI) method. The one or more conditional features include at least one of: an age in future, a gender, previous brain images, omics features, and medical history. The latent vector is multiplied by a first normal distribution.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: Yi-Tien LI, Cheng-Yu CHEN
  • Publication number: 20240065765
    Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: Alvin Chao-Yu CHEN, Yi-Sheng CHAN, Chi-Pin HSU, Shang-Chih LIN, Chin-Ju WU, Jeng-Ywan JENG
  • Publication number: 20240069660
    Abstract: An electronic device and a forming method thereof are provided. The electronic device includes a substrate, a metal layer, a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer. The metal layer is disposed on the substrate and includes a sensing line and a drain electrode. The first insulating layer is disposed on the metal layer. The first conductive layer is disposed on the first insulating layer and includes a touch electrode. The second insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the second insulating layer and includes a conductive pattern. The conductive pattern is electrically connected to the sensing line and the touch electrode.
    Type: Application
    Filed: July 18, 2023
    Publication date: February 29, 2024
    Inventors: Kuei-Chen CHIU, Yu-Ti HUANG, Cheng-Tso CHEN, Li-Wei SUNG
  • Publication number: 20240068359
    Abstract: Disclosed is a method for measuring gas pressure of a close-distance seam group simultaneously, including the following steps: constructing a pressure-measuring drill hole inclined downwards; lowering a first seam piezometer tube, lowering a baffle and a polyurethane blocking material after a tube head reaching a lowermost seam; and installing a gas pressure gauge; lowering a second seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a second layer of seam; and installing the gas pressure gauge; lowering a nth seam piezometer tube, lowering the baffle and the polyurethane blocking material after the tube head reaching a nth layer of seam; and installing the gas pressure gauge; injecting a high-water and quick-solidifying material into the drill hole; and connecting the gas pressure gauges through optical fibers, and connecting the gas pressure gauges with a ground control system.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Anhui University of Science and Technology
    Inventors: Shaobo LI, Lei WANG, Xingang NIU, Chuanqi ZHU, Zhenyu YANG, Lipeng CHEN, Yu ZHANG
  • Publication number: 20240066635
    Abstract: A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.
    Type: Application
    Filed: October 5, 2022
    Publication date: February 29, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Chi LEE, Bo-Han CHEN, Chih-Hsuan LU, Ping-Han WU, Zih-Yi LI, Shang-Yu HSU
  • Publication number: 20240074052
    Abstract: An integrated substrate can include: a top structure having a plurality of first pads for mounting electronic devices, where each of the first pads is electrically coupled with a corresponding electronic device, such that each of the first pads has a corresponding potential; a bottom structure having a plurality of second pads for coupling with peripheral circuits; a plurality of intermediate metal layers stacked up/down and located between the top structure and the bottom structure; a first type of penetrating connection structures configured to couple the intermediate metal layers and a part of the first pads, such that the intermediate metal layers have the same potential as the part of the first pads; and a second type of penetrating connection structures configured to couple the intermediate metal layers and the second pads, such that the second pads have the same potential as the part of the first pads.
    Type: Application
    Filed: August 16, 2023
    Publication date: February 29, 2024
    Inventors: Gao Fan, Yu Qi, Wei Chen
  • Publication number: 20240068064
    Abstract: The present invention discloses a 400 MPa corrosion-resistant steel bar and a production method thereof. The steel bar includes the following chemical ingredients: 9.5-10.4% of Cr, 1.0-1.2% of Mo, 0.3-0.6% of Mn, 0.01-1% of Ni, 0.01-0.5% of Cu, at most 0.014% of C, at most 0.004% of N, 0.01-0.05% of Nb, 0.2-0.6% of Si, and the balance of Fe, where Cr+Mo+0.5Mn+0.35Ni+0.25Cu is 11.1-12.2%, and C+N+0.3Si+Mn+1.8Nb is 0.4-0.8%.
    Type: Application
    Filed: April 12, 2021
    Publication date: February 29, 2024
    Applicants: INSTITUTE OF RESEARCH OF IRON AND STEEL, JIANGSU PROVINCE/SHA-STEEL, CO. LTD (CN), JIANGSU SHAGANG GROUP CO., LTD.
    Inventors: Han MA, Yun ZHOU, Jiaqi ZHAO, Yu ZHANG, Huande CHEN
  • Publication number: 20240067746
    Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.
    Type: Application
    Filed: February 28, 2023
    Publication date: February 29, 2024
    Inventors: Tong-Hsuan CHANG, Mei-Chun YANG, Liahng-Yirn LIU, Jerry TING, Shu-Yen CHANG, Yen-Ying CHEN, Yu-Yu LIN, Shu-Lun TANG
  • Publication number: 20240072534
    Abstract: A start method for a photovoltaic rapid shutdown system, an application apparatus and a system. In the method, an inverter system controls the voltage change of a corresponding direct current bus in a photovoltaic rapid shutdown system; and a photovoltaic module shutdown device performs determination according to a measured output voltage of itself, and controls itself to be turned on when the change characteristic of the voltage of the direct current bus connected to itself satisfies a preset turn-on condition. Therefore, merely by means of a self-contained voltage sampling device, the photovoltaic module shutdown device can determine whether a turn-on signal is received, without additionally providing a corresponding receiving device, thereby reducing hardware cost of the photovoltaic module shutdown device while realizing communication between the photovoltaic module shutdown device and the outside.
    Type: Application
    Filed: January 10, 2022
    Publication date: February 29, 2024
    Applicant: Sungrow Power Supply Co., Ltd.
    Inventors: Yu Yang, Yanfei Yu, Jun Xu, Qiaodi Chen
  • Publication number: 20240072019
    Abstract: An electronic package is provided, in which an electronic module and a plurality of conductive pillars are embedded in an encapsulation layer, and a circuit structure is formed on the encapsulation layer, where the electronic module includes a carrier structure having conductive vias and at least a first electronic element disposed on the carrier structure. The first electronic element has a plurality of conductors in a form of conductive through-silicon vias, and at least a second electronic element is disposed on the circuit structure. Therefore, the design of the electronic module can reduce the layout area occupied by the electronic element on a surface of a packaging zone of the circuit structure, such that other functional elements can be added to the electronic package according to requirements, and the electronic package can improve functional requirements of the end product.
    Type: Application
    Filed: October 27, 2022
    Publication date: February 29, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chung-Yu Ke, Liang-Pin Chen
  • Publication number: 20240071455
    Abstract: The present disclosure relates to an integrated chip structure. The integrated chip structure includes a first source/drain region and a second source/drain region disposed within a substrate. A select gate is over the substrate between the first source/drain region and the second source/drain region. A ferroelectric random access memory (FeRAM) device is over the substrate between the select gate and the first source/drain region. A transistor device is disposed on an upper surface of the substrate. The substrate has a recessed surface that is below the upper surface of the substrate and that is laterally separated from the upper surface of the substrate by a boundary isolation structure extending into a trench within the upper surface of the substrate. The FeRAM device is arranged over the recessed surface.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Inventors: Tzu-Yu Chen, Kuo-Chi Tu, Wen-Ting Chu, Yong-Shiuan Tsair
  • Publication number: 20240072185
    Abstract: A solar energy generation system includes a first solar panel, a second solar panel, and at least one side reflection plate. The first solar panel includes a first top surface adapted to convert solar energy to electricity and a first bottom surface opposite to the first top surface. The second solar panel is disposed below the first solar panel and includes a second top surface for converting solar energy to electricity and facing the first bottom surface of the first solar panel. The side reflection plate is disposed on a side of the first solar panel and the second solar panel. A radius of curvature of a reflection surface of the side reflection plate ranges between 2000 mm and 5000 mm. The side reflection plate is for reflecting sunlight to the first bottom surface of the first solar panel and the second top surface of the second solar panel.
    Type: Application
    Filed: June 8, 2023
    Publication date: February 29, 2024
    Applicant: BOHAN TECHNOLOGIES CO., LTD.
    Inventor: WEN-YU CHEN
  • Publication number: 20240071758
    Abstract: A method for fabricating a high electron mobility transistor (HEMT) includes the steps of forming a buffer layer on a substrate, forming a barrier layer on the buffer layer, forming a p-type semiconductor layer on the barrier layer, forming a gate electrode layer on the p-type semiconductor layer, and patterning the gate electrode layer to form a gate electrode. Preferably, the gate electrode includes an inclined sidewall.
    Type: Application
    Filed: September 23, 2022
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Tung Yeh, You-Jia Chang, Bo-Yu Chen, Yun-Chun Wang, Ruey-Chyr Lee, Wen-Jung Liao
  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Publication number: 20240072549
    Abstract: An energy storage apparatus includes a control circuit, multiple battery clusters connected in parallel, and switch circuits corresponding to the battery clusters. The switch circuit includes a first switch and a protection circuit connected in parallel. The control circuit is connected to each first switch and each protection circuit. Each battery cluster is connected to the corresponding first switch and protection circuit. The control circuit is configured to control, according to a high voltage on signal, the protection circuit to be closed and the first switch to be opened.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 29, 2024
    Inventors: Xinwei CHEN, Xiangtao LI, Yu YAN, Zhimin DAN, Qidong LOU
  • Publication number: 20240073360
    Abstract: Embodiments of this application relate to the technical field of video shooting, and provide a video processing method and apparatus, an electronic device, and a storage medium. The video processing method includes: determining one video storage resolution; determining one video style template; obtaining a video shot through a camera lens; snapping a corresponding image in the video as a snapped image in response to a snapping instruction; processing the video by using a LOG curve; processing the snapped image by using the LOG curve; converting a LOG video into a determined video storage resolution if the determined video storage resolution is less than a preset resolution, and processing the LOG video based on a LUT; and processing a LOG-based snapped image based on the LUT, where a resolution of the snapped image is equal to the preset resolution.
    Type: Application
    Filed: May 24, 2022
    Publication date: February 29, 2024
    Inventors: Hantao CUI, Weilong HOU, Guoqiao CHEN, Yu Wang
  • Publication number: 20240072021
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20240074041
    Abstract: A circuit board includes a substrate and a metallic layer. A first area and at least one second area are defined on a portion of the substrate, the second area is located outside the first area. The metallic layer includes first test lines disposed on the first area and second test lines disposed on the second area. A first test pad of each of the first test lines has a first width, and a second test pad of each of the second test lines has a second width. The second width is greater than the first width such that probes of an electrical testing tool can contact the first and second test pads on the circuit board correctly during electrical testing.
    Type: Application
    Filed: August 16, 2023
    Publication date: February 29, 2024
    Inventors: Gwo-Shyan Sheu, Kuo-Liang Huang, Hsin-Hao Huang, Pei-Wen Wang, Yu-Chen Ma
  • Publication number: 20240071888
    Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.
    Type: Application
    Filed: August 28, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
  • Publication number: 20240071849
    Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Jian-You Chen, Kuan-Yu Huang, Li-Chung Kuo, Chen-Hsuan Tsai, Kung-Chen Yeh, Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu