Patents by Inventor Yu-Chen Cheng

Yu-Chen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250013067
    Abstract: A de-speckle mechanism includes a carrier, an optical homogenizer, an outer frame, a first flexible component, and a first actuator. The optical homogenizer is provided with a light-receiving surface and is disposed on the carrier. The outer frame is disposed adjacent to the carrier. The first flexible component is the only component connecting the carrier and the outer frame. The first actuator includes a first part and a second part which act relative to each other, and the first part is disposed on the carrier. The first actuator can drive the optical homogenizer, with the connecting position between the first flexible component and the outer frame as the fulcrum, so that the optical homogenizer can swing in a plane direction substantially parallel to or identical to the light-receiving surface of the optical homogenizer.
    Type: Application
    Filed: November 16, 2023
    Publication date: January 9, 2025
    Applicant: Young Optics Inc.
    Inventors: Kuan Lun CHENG, Yu Chen CHANG
  • Publication number: 20240429137
    Abstract: A method of manufacturing a semiconductor device is provided. The method includes attaching a first semiconductor die to a first die pad of a first leadframe and attaching a second semiconductor die to a second die pad of a second leadframe. The first leadframe is attached to the second leadframe by way of a non-conductive adhesive. A first plurality of leads of the first leadframe are interleaved with leads of a second plurality of leads of the second leadframe. The first and second semiconductor die and portions of the first and second leadframes are encapsulated with an encapsulant.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 26, 2024
    Inventors: Hsin-En Cheng, Pascal Oberndorff, Yu Chen Li, Hsiu Chun Li
  • Patent number: 12176387
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a capacitor over a substrate. The capacitor includes a plurality of conductive layers and a plurality of dielectric layers. The plurality of conductive layers and dielectric layers define a base structure and a first protrusion structure extending downward from the base structure towards a bottom surface of the substrate. The first protrusion structure comprises one or more surfaces defining a first cavity. A top of the first cavity is disposed below the base structure.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: December 24, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu, Tuo-Hsin Chien, Felix Ying-Kit Tsui, Shi-Min Wu, Yu-Chi Chang
  • Publication number: 20240421464
    Abstract: An electronic device includes a shell and an antenna assembly. The casing has an accommodating space. The antenna assembly is located in the accommodating space, and includes a substrate, a first antenna component, a second antenna component and a third antenna component. The first antenna component, the second antenna component and the third antenna component are disposed on the substrate. The first antenna component includes a first radiation portion and a first ground portion, which are disposed on two opposite sides of the substrate. The second antenna component includes a second radiation portion and a second ground portion, which are disposed on two opposite sides of the substrate. The third 10 antenna component includes a third radiation portion and a third ground portion, which are disposed on two opposite sides of the substrate.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 19, 2024
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Hsin-Hung LIN, Yu Shu TAI, Ssu-Yu LIU, Wei-Chen CHENG
  • Patent number: 12166724
    Abstract: A method of channel state information (CSI) reporting by a first user equipment (UE) is disclosed. The method comprises receiving, from a base station (BS), a radio resource control (RRC) message to configure a first priority level for a logical channel; performing a sidelink (SL) communication with a second UE; generating a Medium Access Control (MAC) control element (CE) for a CSI report for the SL communication with a second priority level in a fixed value; determining a prioritization between the MAC CE including the CSI report and data from the logical channel according to the fixed value of the second priority level and the first priority level; and transmitting, to the second UE or the BS, at least one of the MAC CE and the data from the logical channel based on the determined prioritization.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: December 10, 2024
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yu-Hsin Cheng, Mei-Ju Shih, Hung-Chen Chen, Yung-Lan Tseng, Chia-Hao Yu
  • Patent number: 12152070
    Abstract: The present invention provides a PTX3 monoclonal antibody or antibody Fab fragment thereof and use thereof. The aforementioned monoclonal antibody or antibody Fab fragment thereof specifically inhibit or slow down the binding of PTX3 to the PTX3 receptor, and may be used for a kit and method for detecting PTX3, and a pharmaceutical composition which inhibits or slows down diseases or symptoms associated with PTX3 and PTX3 receptor binding, and a use thereof.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: November 26, 2024
    Assignee: Ohealth Biopharmaceutical (Suzhou) Co., Ltd.
    Inventors: Ju-Ming Wang, I-Chen Lee, Yu-Wei Hsiao, Jhih-Ying Chi, Jyun-yi Du, Hsin-Yin Liang, Chao-chun Cheng, Chiung-Yuan Ko, Feng-Wei Chen, Jhih-Yun Liu
  • Publication number: 20240389338
    Abstract: A three-dimensional memory device and a manufacturing method thereof are provided. The three-dimensional memory device includes first and second stacking structures, isolation pillars, gate dielectric layers, channel layers and conductive pillars. The stacking structures are laterally spaced apart from each other. The stacking structures respectively comprises alternately stacked insulating layers and conductive layers. The isolation pillars laterally extend between the stacking structures. The isolation pillars further protrude into the stacking structures, and a space between the stacking structures is divided into cell regions. The gate dielectric layers are respectively formed in one of the cell regions, and cover opposing sidewalls of the stacking 10 structures and sidewalls of the isolation pillars. The channel layers respectively cover an inner surface of one of the gate dielectric layers.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Han Lin, Chun-Fu Cheng, Feng-Cheng Yang, Sheng-Chen Wang, Yu-Chien Chiu, Han-Jong Chia
  • Patent number: 12143877
    Abstract: A method for sidelink operation performed by a user equipment (UE) is provided. The method includes receiving, from a first cell, a conditional handover command that includes an indication of a second cell and one or more triggering conditions for handover to the second cell, performing handover to the second cell after determining that at least one of the triggering conditions is fulfilled, and applying a sidelink resource configuration that is stored in the UE after performing handover to the second cell based on the conditional handover command.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: November 12, 2024
    Assignee: Hannibal IP LLC
    Inventors: Yung-Lan Tseng, Hung-Chen Chen, Mei-Ju Shih, Yu-Hsin Cheng
  • Patent number: 12137534
    Abstract: A hardware-based fan controller for controlling fan modules in a computer system having multiple computer nodes is disclosed. Each of the computer nodes has a service processor. The fan controller includes a slave module that receives fan speed commands from each of the service processors. A fan speed generator is coupled to the slave module and a subset of the fan modules. The fan speed generator receives fan speed commands from the slave module and fan speed outputs from the subset of fan modules. The fan speed generator is configured to output a speed command to each of the fan modules in the subset.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: November 5, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Hsien-Yang Cheng, Ying-Che Chang, Yi-An Chen, Yu-Tang Zeng
  • Patent number: 12111484
    Abstract: An imaging lens assembly has an optical axis, and includes a plurality of optical elements. The optical elements include a light blocking sheet, and the light blocking sheet includes a through hole surface, a first surface, a second surface, a peripheral surface and a plurality of basin structures. The through hole surface surrounds the optical axis. The first surface and the second surface are connected to and surround the through hole surface. The peripheral surface is connected to the first surface and the second surface, and the peripheral surface is farther from the optical axis than the through hole surface from the optical axis. The basin structures are arranged in interval and around the optical axis, each of the basin structures is caved in from the first surface to the second surface, and each of the basin structures protrudes on the second surface.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: October 8, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chih-Wei Cheng, Yu-Chen Lai, Ming-Ta Chou, Ming-Shun Chang
  • Patent number: 12108341
    Abstract: Some of the present implementations provide a method for a user equipment (UE) for receiving a power saving signal. The method receives, from a base station, a power saving signal comprising a minimum applicable K0 (K0min) that indicates a minimum scheduling offset restriction between a physical downlink control channel (PDCCH) and a physical downlink shared channel (PDSCH). The method determines an application delay based on a predefined value. The method then applies the minimum scheduling offset restriction after the application delay.
    Type: Grant
    Filed: October 23, 2023
    Date of Patent: October 1, 2024
    Assignee: Hannibal IP LLC
    Inventors: Yu-Hsin Cheng, Chie-Ming Chou, Wan-Chen Lin, Tsung-Hua Tsai
  • Patent number: 12108412
    Abstract: A method for uplink transmission performed by a UE is provided. The method includes: receiving a first configured grant configuration that allocates a first PUSCH duration; receiving a second configured grant configuration that allocates a second PUSCH duration, wherein the second PUSCH duration overlaps with the first PUSCH duration; obtaining a first HARQ process ID for the first PUSCH duration, then determining whether a first configured grant timer associated with the first HARQ process ID is running; obtaining a second HARQ process ID for the second PUSCH duration, then determining whether a second configured grant timer associated with the second HARQ process ID is running; and selecting one of the first PUSCH duration and the second PUSCH duration for an uplink transmission based on whether the first configured grant timer is running and whether the second configured grant timer is running.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: October 1, 2024
    Assignee: Hannibal IP LLC
    Inventors: Heng-Li Chin, Chia-Hung Wei, Wan-Chen Lin, Yu-Hsin Cheng, Chie-Ming Chou
  • Publication number: 20240313419
    Abstract: An antenna device includes a substrate and four antenna units. The four antenna units are disposed on the substrate. Each of the four antenna units includes an L-shaped radiation portion, a hook-shaped coupling portion and a ground portion. The hook-shaped coupling portion is adjacent to the L-shaped radiation portion. The ground portion is disposed around the L-shaped radiation portion and the hook-shaped coupling portion. One end of the hook-shaped coupling portion is connected to the ground portion.
    Type: Application
    Filed: June 5, 2023
    Publication date: September 19, 2024
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Hsin-Hung LIN, Yu Shu TAI, Wei-Chen CHENG
  • Publication number: 20240313421
    Abstract: An antenna device includes a first substrate, a second substrate, a radiation portion and an exciter. The second substrate is stacked on the first substrate. The exciter is disposed on the first substrate and includes a feeding transmission portion, an exciting portion, a connection portion and an impedance match portion. The feeding transmission portion is connected to a side of the exciting portion. The exciting portion and the impedance match portion are connected to two opposite sides of the connection portion, respectively. The radiation portion is located on the second substrate and includes a first radiation component, a second radiation component and a third radiation component. The first radiation component is disposed at a side of the second radiation component. The first radiation component and the second radiation component are disposed at a side of the third radiation component.
    Type: Application
    Filed: June 5, 2023
    Publication date: September 19, 2024
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Hsin-Hung LIN, Yu Shu TAI, Wei-Chen CHENG
  • Publication number: 20240313420
    Abstract: An antenna device includes a first substrate, a second substrate, a radiation portion and a cross-shaped exciter. The first substrate has a first top surface. The first substrate is stacked on the second substrate. The second substrate has a second top surface and a bottom surface. The second top surface faces away from the bottom surface. The radiation portion is disposed on the first top surface, and includes a first radiation component, a second radiation component, a third radiation component and a fourth radiation component. The first radiation component and the fourth radiation component are arranged on the first top surface symmetrically along a diagonal of the first top surface. The second radiation component and the third radiation component are arranged on the first top surface symmetrically along another diagonal of the first top surface. The cross-shaped exciter is disposed on the top surface.
    Type: Application
    Filed: June 3, 2023
    Publication date: September 19, 2024
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Hsin-Hung LIN, Yu Shu TAI, Wei-Chen CHENG
  • Publication number: 20240306179
    Abstract: A base station for wireless communication is provided. The base station transmits to a user equipment (UE) a first Radio Resource Control (RRC) configuration and the second RRC configuration. The first RRC configuration is for configuring a first semi-persistent scheduling (SPS) physical downlink shared channel (PDSCH) and includes a first parameter indicating its relative priority for when the first SPS PDSCH overlaps with another SPS PDSCH in a time domain The second RRC configuration, which overlaps the first SPS PDSCH, is for configuring a second SPS PDSCH and includes a second parameter indicating its relative priority for when the second SPS PDSCH overlaps with another SPS PDSCH in the time domain.
    Type: Application
    Filed: March 26, 2024
    Publication date: September 12, 2024
    Inventors: Wan-Chen Lin, Yu-Hsin Cheng, Heng-Li Chin, Hsin-Hsi Tsai
  • Patent number: 12088003
    Abstract: A wearable device includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, and a sixth radiation element. The first radiation element has a feeding point. The first radiation element is coupled to the ground element. The third radiation element is coupled through the second radiation element to the first radiation element. The fourth radiation element is coupled through the second radiation element to the first radiation element. The fifth radiation element is coupled to the first radiation element. The sixth radiation element is coupled to the ground element. The sixth radiation element is adjacent to the fourth radiation element. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, the fourth radiation element, the fifth radiation element, and the sixth radiation element.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: September 10, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Kai-Hsiang Chang, Chung-Ting Hung, Chin-Lung Tsai, Kuan-Hsien Lee, Yu-Chen Zhao, Chun-I Cheng
  • Patent number: 12080952
    Abstract: An antenna module is disposed to an electronic device includes a fixed member, a rotating component, a reflector, a director, and an antenna unit. The electronic device includes a first body and a second body. The first body has a first surface and a second surface. The fixed member is disposed to the first body fixedly. The rotating component is connected to the fixed member rotatably. The reflector and the director are disposed to the rotating component. The antenna unit is disposed to the first body and between the reflector and the director. When the first body and the second body rotate relative to each other, the reflector is located between the antenna unit and one of the first surface and the second surface, and the director is located between the antenna unit and another one of the first surface and the second surface.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: September 3, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Jo-Fan Chang, Yu Chen, Jhih-Ning Cheng, Yu-Hsun Huang
  • Patent number: 12082235
    Abstract: A system and a method of random access resource selection are provided. The method includes a target Base Station (BS) transmitting a first Synchronization Signal Block (SSB) to a User Equipment (UE), the first SSB associated with a first contention-free random access resource for the UE to transmit a random access preamble; the target BS transmitting a second SSB to the UE, the second SSB associated with a contention-based random access resource; and in a case that a first Synchronization Signal-Reference Signal Received Power (SS-RSRP) of the first SSB is not greater than an SS-RSRP threshold and a second SS-RSRP of the second SSB is greater than the SS-RSRP threshold, the target BS receiving the random access preamble from the UE using the contention-based random access resource.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: September 3, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Hung-Chen Chen, Chie-Ming Chou, Yu-Hsin Cheng, Mei-Ju Shih
  • Publication number: 20240243001
    Abstract: An apparatus includes a supporting frame, a platform supported by the supporting frame and having a first side and a second side opposite to the first side, and at least three robot fingers which are mounted to the supporting frame, and which are angularly displaced from each other. Each of the robot fingers has a fingertip configured to retain a substrate on the first side of the platform such that the substrate is spaced apart from the platform. A method for manufacturing a semiconductor structure using the apparatus is also disclosed.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Yun CHENG, Kenichi SANO, Yu-Wei LU, Yi-Chen LO