Patents by Inventor Yu-chen Ko

Yu-chen Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230395426
    Abstract: Provided is a conductive structure and a method for forming such a structure. The method includes forming a treatable layer by depositing a layer comprising a metal over a structure; performing a directional treatment process on a targeted portion of the treatable layer to convert the targeted portion to a material different from a non-targeted portion of the treatable layer, wherein the directional treatment process is selected from the group consisting of nitridation, oxidation, chlorination, carbonization; and selectively removing the non-targeted portion from the structure, wherein the targeted portion remains over the structure.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Hsiang Chao, Shu-Lan Chang, Ching-Yi Chen, Shih-Wei Yeh, Pei Shan Chang, Ya-Yi Cheng, Yu-Chen Ko, Yu-Shiuan Wang, Chun-Hsien Huang, Hung-Chang Hsu, Chih-Wei Chang, Ming-Hsing Tsai, Wei-Jung Lin
  • Publication number: 20230386914
    Abstract: Methods of forming a semiconductor device structure are described. In some embodiments, the method includes forming a contact opening in an interlayer dielectric (ILD) layer disposed over an epitaxy source/drain region and forming a metal layer in the contact opening. The metal layer includes top portions, side portions, and a bottom portion, and a space is defined between the top portions of the metal layer. The method further includes performing a gradient metal removal process on the metal layer to enlarge the space, forming a sacrificial layer in the contact opening, recessing the sacrificial layer in the contact opening to expose a portion of the sidewall portions, removing the top portions and the exposed portion of the sidewall portions, removing the sacrificial layer, and forming a bulk metal layer on the bottom portion of the metal layer.
    Type: Application
    Filed: May 26, 2022
    Publication date: November 30, 2023
    Inventors: Yu-Chen KO, Kai-Chieh YANG, Yu-Ting WEN, Ya-Yi CHENG, Min-Hsiu HUNG, Wei-Jung LIN, Chih-Wei CHANG, Ming-Hsing TSAI
  • Publication number: 20230360969
    Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Ting Chung, Shih-Wei Yeh, Kai-Chieh Yang, Yu-Ting Wen, Yu-Chen Ko, Ya-Yi Cheng, Min-Hsiu Hung, Chun-Hsien Huang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20230223302
    Abstract: A method includes forming a dielectric layer over an epitaxial source/drain region. An opening is formed in the dielectric layer. The opening exposes a portion of the epitaxial source/drain region. A barrier layer is formed on a sidewall and a bottom of the opening. An oxidation process is performing on the sidewall and the bottom of the opening. The oxidation process transforms a portion of the barrier layer into an oxidized barrier layer and transforms a portion of the dielectric layer adjacent to the oxidized barrier layer into a liner layer. The oxidized barrier layer is removed. The opening is filled with a conductive material in a bottom-up manner. The conductive material is in physical contact with the liner layer.
    Type: Application
    Filed: May 13, 2022
    Publication date: July 13, 2023
    Inventors: Pin-Wen Chen, Chang-Ting Chung, Yi-Hsiang Chao, Yu-Ting Wen, Kai-Chieh Yang, Yu-Chen Ko, Peng-Hao Hsu, Ya-Yi Cheng, Min-Hsiu Hung, Chun-Hsien Huang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 6952232
    Abstract: The invention provides a digital camera having a viewfinder with an adjustable length. The digital camera includes a first viewfinder member, a second viewfinder member, a first resilient member, a first engagement member, and a second engagement member. In this invention, the first viewfinder member is mounted in the digital camera. The second viewfinder member is mounted in the first viewfinder member and is capable of sliding relative to the first viewfinder member. The first resilient member is connected to the second viewfinder member and capable of pushing the second viewfinder member from a ready position to an ejected position. The first engagement member is mounted on the second viewfinder member.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: October 4, 2005
    Assignee: Inventec Multimedia & Telecom Corp.
    Inventors: Yu-chen Ko, Weng-tiang Tang
  • Patent number: 6519812
    Abstract: A hinge structure for use in an electronic device such as a digital camera for connecting two elements and making the two elements turn against each other. A gear unit is provided, which has two gears engaging with each other and turning in opposite directions. The two gears connect respectively with the two elements. When one element is turned in one direction, through the transmission of the gear unit, another element will be driven to turn in the opposite direction, to thereby change the angle between the two elements and enhance picture taking flexibility.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: February 18, 2003
    Assignee: Inventec Multimedia & Telecom Corporation
    Inventors: Yu-Chen Ko, Heem-Hoe Chee
  • Publication number: 20030020823
    Abstract: The invention provides a digital camera having a viewfinder with an adjustable length. The digital camera includes a first viewfinder member, a second viewfinder member, a first resilient member, a first engagement member, and a second engagement member. In this invention, the first viewfinder member is mounted in the digital camera. The second viewfinder member is mounted in the first viewfinder member and is capable of sliding relative to the first viewfinder member. The first resilient member is connected to the second viewfinder member and capable of pushing the second viewfinder member from a ready position to an ejected position. The first engagement member is mounted on the second viewfinder member.
    Type: Application
    Filed: April 26, 2002
    Publication date: January 30, 2003
    Inventors: Yu-Chen Ko, Weng-Tiang Tang
  • Publication number: 20020038493
    Abstract: A hinge structure for use in an electronic device such as a digital camera for connecting two elements and making the two elements turn against each other. A gear unit is provided, which has two gears engaging with each other and turning in opposite directions. The two gears connect respectively with the two elements. When one element is turned in one direction, through the transmission of the gear unit, another element will be driven to turn in the opposite direction, to thereby change the angle between the two elements and enhance picture taking flexibility.
    Type: Application
    Filed: June 29, 2001
    Publication date: April 4, 2002
    Inventors: Yu-Chen Ko, Heem-Hoe Chee