Abstract: Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.

Abstract: A semiconductor device includes a substrate, a package structure, a first heat spreader, and a second heat spreader. The package structure is disposed on the substrate. The first heat spreader is disposed on the substrate. The first heat spreader surrounds the package structure. The second heat spreader is disposed on the package structure. The second heat spreader is connected to the first heat spreader. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: An actuator is configured to drive an imaging lens system. The actuator includes a frame portion configured to accommodate the imaging lens system, a supporting portion disposed on the frame portion, a driving portion configured to drive the imaging lens system to move, an optical mark structure disposed on part of the frame portion, the supporting portion or the driving portion and a liquid disposed on the optical mark structure. The supporting portion is configured to support the imaging lens system and give the imaging lens system a degree of freedom of movement with respect to the frame portion. The optical mark structure includes a plurality of optical mark units arranged side by side. The liquid is in physical contact with the imaging lens system, the frame portion, the supporting portion or the driving portion that is adjacent to the optical mark structure.

Abstract: A camera module includes an imaging lens, an image sensor, a corner drive mechanism and a side drive mechanism. The image sensor is disposed at an image side of the imaging lens. The image sensor includes a photosensitive surface. The photosensitive surface faces the imaging lens. The photosensitive surface is substantially rectangular. The photosensitive surface is movable close to or away from the imaging lens in a focusing direction, and is movable in a translational direction orthogonal to the focusing direction. The corner drive mechanism is disposed corresponding to a corner of the photosensitive surface. The side drive mechanism is disposed corresponding to a side of the photosensitive surface. One of the corner drive mechanism and the side drive mechanism drives the image sensor to move in the focusing direction, and another one thereof drives the image sensor to move in the translational direction.

Abstract: An imaging optical lens assembly includes six lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has an object-side surface being concave in a paraxial region thereof and an image-side surface of the first lens element being convex in a paraxial region thereof. The third lens element has an image-side surface being concave in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof. The image-side surface of the sixth lens element is aspheric and has at least one inflection point. At least one of the six lens elements is made of plastic material.

Abstract: A light pass aperture module, in order along a central axis, includes a blade assembly and a cap. The blade assembly includes a plurality of blades. The blades form a light pass aperture, and the light pass aperture is variable in size with the central axis as a center. The cap covers the blade assembly. The cap has a through hole, and the through hole is disposed corresponding to the light pass aperture. The cap includes a surface level down structure. The surface level down structure is disposed corresponding to one of the blades, and the surface level down structure is closer to the one blade than the through hole.

Abstract: An imaging lens system has an optical axis and an image surface through which the optical axis passes. The imaging lens system includes a plastic lens barrel surrounding the optical axis. The plastic lens barrel includes an image-side portion and an object-side aperture through which the optical axis passes, and the image-side portion is located between the image surface and the object-side aperture. The image-side portion includes a protrusive structure surrounding the optical axis and extending towards the image surface. The protrusive structure has an inner surface facing the optical axis, an outer surface disposed opposite to the inner surface and located farther away from the optical axis than the inner surface and a reflection-reducing surface extending towards the image surface and connected to and located between the inner surface and the outer surface. The protrusive structure includes a reflection-reducing structure disposed on the reflection-reducing surface.

Abstract: An imaging lens module includes a sensing part, a lens assembly, a lens holding member, an isolating article and a plastic molding article. The sensing part includes a substrate, a sensing chip and a plurality of conducting wires. The substrate supports the sensing chip. The sensing chip includes an optical effect area and an electrical connection area. The conducting wires are electrically connected to the electrical connection area for transmitting an image signal. The lens assembly corresponds to the optical effect area. The lens holding member holds the lens assembly. The lens holding member includes a wire correspondence structure corresponding to the conducting wires. The isolating article is between the wire correspondence structure and the conducting wires. The plastic molding article is molded on the sensing part. The plastic molding article physically contacts the lens holding member to fix the lens holding member with respect to the sensing part.

Abstract: An imaging lens with an optical axis includes a lens carrier and a variable through hole assembly. The lens carrier is configured for at least one lens element to be disposed therein, and the lens carrier includes a mount structure. The variable through hole assembly includes a plurality of movable blades and a rotatable element. The movable blades movably and together surround the optical axis to form a through hole, and a size of the through hole is variable by movement of the movable blades. The rotatable element is connected to the movable blades, and the rotatable element moves the movable blades to vary the size of the through hole. At least one of the movable blades and the rotatable element of the variable through hole assembly is disposed on the mount structure.

Abstract: A camera module includes an imaging lens assembly, an image sensor, a plate element and a polarizing element. The imaging lens assembly is configured to define an optical axis. The image sensor is disposed on an image surface of the imaging lens assembly. The plate element is farther from the image sensor than the imaging lens assembly from the image sensor on the optical axis, wherein the plate element is inclined to the optical axis. The polarizing element is disposed on an image side of the plate element, so that an object-side light with a specific polarity from the plate element passes through.

Abstract: A controllable aperture stop includes a light pass portion, a fixed portion, a driving part and rollable elements. The light pass portion includes movable blades together surrounding a light pass aperture. The fixed portion has shaft structures corresponding to the movable blades. The driving part includes a rotatable element, a magnet and a coil. The rotatable element is for driving the movable blades to rotate relative to the shaft structures to adjust the size of the light pass aperture. The magnet is disposed on the rotatable element. The coil corresponds to the magnet. The magnet and the coil are to drive the rotatable element to rotate around the light pass aperture. The rollable elements are disposed between the fixed portion and the rotatable element and arranged around the light pass aperture, so the rotatable element is rotatable relative to the fixed portion.

Abstract: A light pass aperture module, in order along a central axis, includes a blade assembly and a cap. The blade assembly includes a plurality of blades. The blades form a light pass aperture, and the light pass aperture is variable in size with the central axis as a center. The cap covers the blade assembly. The cap has a through hole, and the through hole is disposed corresponding to the light pass aperture. The cap includes a surface level down structure. The surface level down structure is disposed corresponding to one of the blades, and the surface level down structure is closer to the one blade than the through hole.

Abstract: An imaging lens system has an optical axis and an image surface through which the optical axis passes. The imaging lens system includes a plastic lens barrel surrounding the optical axis. The plastic lens barrel includes an image-side portion and an object-side aperture through which the optical axis passes, and the image-side portion is located between the image surface and the object-side aperture. The image-side portion includes a protrusive structure surrounding the optical axis and extending towards the image surface. The protrusive structure has an inner surface facing the optical axis, an outer surface disposed opposite to the inner surface and located farther away from the optical axis than the inner surface and a reflection-reducing surface extending towards the image surface and connected to and located between the inner surface and the outer surface. The protrusive structure includes a reflection-reducing structure disposed on the reflection-reducing surface.

Abstract: A lens assembly having a paraxial path includes a carrier, a plurality of optical elements, a retaining element and a first bonding material. A closed structure is located adjacent to the second end. The closed structure is formed by at least one optical element of the optical elements and the inner annular surface, the at least one optical element is in physical contact with the inner annular surface, and an inside space is closed from an outside air by the closed structure. A first ventilation structure is located adjacent to the first end and connected between the closed structure and the outside air. The first ventilation structure is disposed on a side surface facing the optical elements of the retaining element and includes a contact surface and a first shrunk surface.

Abstract: An imaging optical system includes an infrared light absorbing element, an infrared light reducing film and a plate element in order along a paraxial path. The infrared light absorbing element is made of an infrared light absorbing plastic material, and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an image surface of the imaging optical system than an incident surface of the infrared light absorbing element to the image surface of the imaging optical system. The plate element is disposed between the infrared light reducing film and the image surface, the plate element includes a translucent portion, a holder portion and a taper structure coating. The taper structure coating is disposed on at least one of an incident surface and an exit surface of the translucent portion.

Abstract: A camera module includes an imaging lens assembly and an image sensor. The imaging lens assembly includes a plastic optical element with a light-blocking layer disposed on its transparent surface. The plastic optical element includes an optical effective area, and a peripheral region of the light-blocking layer forms a specific shape around the optical effective area so as to define an aperture region. The peripheral region includes a main portion and a compensation portion. The main portion is physically contacted with the transparent surface. The compensation portion is disposed on an edge of the main portion adjacent to the optical effective area, and an optical density of the compensation portion is lower than an optical density of the main portion. The image sensor is disposed on an image side of the imaging lens assembly for defining a maximum image height and further defining a relative illumination.

Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.

Abstract: An optical element driving unit includes a stationary body, a carrier, a supporting mechanism and an electromagnetic driving assembly. The supporting mechanism is connected to the carrier and the stationary body and provides the carrier with a degree of freedom of movement relative to the stationary body. The carrier can be driven to move by the electromagnetic driving assembly. The electromagnetic driving assembly includes a driving coil, a driving magnet and a ferromagnetic element. The driving coil is disposed on the carrier. The driving magnet is disposed on the stationary body. The ferromagnetic element is one-piece formed and embedded in the carrier, and the ferromagnetic element includes a magnetic field guiding part and an electrical connection part. The magnetic field guiding part faces the driving coil and/or the driving magnet. The electrical connection part is exposed on a surface of the carrier and electrically connected to the driving coil.