Patents by Inventor Yu-Chen Shih

Yu-Chen Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COVER LAYER WITH HIGH THERMAL RESISTANCE AND HIGH REFLECTIVITY FOR A PRINTED CIRCUIT BOARD
    Publication number: 20150257296
    Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 10, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: Tzu-Ching Hung, Yu-Chen Shih, Feng-Jung Tien, Chen-Kuo Lu, Yu-Hsien Lee, Su-Ping Wu