Patents by Inventor Yu-Chen Shih

Yu-Chen Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12219416
    Abstract: A user equipment (UE) includes one or more non-transitory computer-readable media containing computer-executable instructions embodied therein and at least one processor coupled to the one or more non-transitory computer-readable media. The at least one processor is configured to receive through a serving cell of a first Radio Access Technology (RAT), a sidelink (SL) resource configuration of a second RAT, determine first validity area information associated with the first RAT and second validity area information associated with the second RAT, and identify a validity area of the SL resource configuration based on the first validity area information and the second validity area information.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: February 4, 2025
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Yung-Lan Tseng, Hung-Chen Chen, Mei-Ju Shih, Yu-Hsin Cheng
  • Publication number: 20250039753
    Abstract: A method for sidelink operation performed by a user equipment (UE) is provided. The method includes receiving, from a first cell, a conditional handover command that includes an indication of a second cell and one or more triggering conditions for handover to the second cell, performing handover to the second cell after determining that at least one of the triggering conditions is fulfilled, and applying a sidelink resource configuration that is stored in the UE after performing handover to the second cell based on the conditional handover command.
    Type: Application
    Filed: August 27, 2024
    Publication date: January 30, 2025
    Inventors: Yung-Lan Tseng, Hung-Chen Chen, Mei-Ju Shih, Yu-Hsin Cheng
  • Publication number: 20150257296
    Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 10, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: Tzu-Ching Hung, Yu-Chen Shih, Feng-Jung Tien, Chen-Kuo Lu, Yu-Hsien Lee, Su-Ping Wu