Abstract: A light guide plate has a light-receiving surface, a light-emitting surface, and a light-reflecting surface. Multiple first arc-shaped longitudinal structures are arranged on the light-receiving surface with their longitudinal directions being substantially parallel with each other. Multiple second arc-shaped longitudinal structures are arranged on the light-emitting surface with their longitudinal directions being substantially parallel with each other. The light-reflecting surface is shaped to form a plurality of prismatic structures, and a luminance-adjusting structure is formed on part of the light-reflecting surface near the point light source and interlaced with the prismatic structures.

Abstract: A back light module includes a light guide plate, a light emitting unit, and a prism sheet. The light guide plate has a bottom surface, a light output surface opposite to the bottom surface, a light incident surface connected to the bottom surface and the light output surface, and multiple cambered diffusion portions on the light output surface. The cambered diffusion portions are paralleled to one another. Each cambered diffusion portion has a cambered surface. The light emitting unit is disposed near the light incident surface. The prism sheet is disposed over the cambered diffusion portions and has multiple linear prisms protruding toward the light guide plate. The linear prisms are paralleled to one another. The stretching direction of the linear prisms is substantially perpendicular to that of the cambered diffusion portions. Backlight uniformity can be improved and the viewing angle of the backlight system also increases in specific direction.

Abstract: Systems and methods for semiconductor fabrication management. A processing unit receives an engineering change request (ECR) comprising information regarding new engineering for a wafer lot, generates an ECR reminder comprising information regarding the ECR request, transmits the ECR reminder to a client operator through a communication device, receives a reply corresponding to the ECR reminder, determines a reply result indicating whether the ECR is accepted by detecting the reply, and transmits the reply result to a manufacturing execution system (MES).

Abstract: Systems and methods for semiconductor fabrication management. A processing unit receives an engineering change request (ECR) comprising information regarding new engineering for a wafer lot, generates an ECR reminder comprising information regarding the ECR request, transmits the ECR reminder to a client operator through a communication device, receives a reply corresponding to the ECR reminder, determines a reply result indicating whether the ECR is accepted by detecting the reply, and transmits the reply result to a manufacturing execution system (MES).

Abstract: A method and apparatus to synchronize the heterogeneous databases of this invention, first extracts the files to be synchronized from a first database (in the case of the manufacturing facility, the online specification database). These files have a first format such as character or numeric data that is then converted to a second format such as the Engineering Data Workflow (EDW) or Lotus Notes to create the document object files of the second database. The converted files are then automatically attached to the second database for review by a document manager. The document manager is either a person responsible for reviewing changes to the second database or may be an automated reviewing mechanism. If the database modification is approved, the document manager generates a permission semaphore to gain access and use of the first database.