Abstract: An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.

Abstract: A semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is aside the package structure. The second heat spreader is in physical contact with the first heat spreader. The second heat spreader covers a top surface and sidewalls of the package structure. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A semiconductor device includes a substrate, a package structure, a first heat spreader, and a second heat spreader. The package structure is disposed on the substrate. The first heat spreader is disposed on the substrate. The first heat spreader surrounds the package structure. The second heat spreader is disposed on the package structure. The second heat spreader is connected to the first heat spreader. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: A device includes a source region, a drain region, a channel region, a pair of depletion gates, an accumulation gate, and a superconductive resonator. The channel region is between the source region and the drain region. The pair of depletion gates are spaced apart from each other. The pair of depletion gates both overlap the channel region and define a quantum dot qubit region in the channel region and between the pair of depletion gates. The accumulation gate is above and crossing the pair of depletion gates. The superconductive resonator is laterally adjacent the quantum dot qubit region.

Abstract: A mobile device, a system and a method for task management based on voice intercom function are provided. A mobile device receives a voice message associated with at least one task. Semantic information of the voice message is analyzed to determine at least one message receiver of the voice message and generate a task message. Another mobile device corresponding to one of the at least one message receiver receives the task message. Task management information associated with the at least one task is updated according to the semantic information of the voice message.

Abstract: A mobile device, a system and a method for task management based on voice intercom function are provided. A mobile device receives a voice message associated with at least one task. Semantic information of the voice message is analyzed to determine at least one message receiver of the voice message and generate a task message. Another mobile device corresponding to one of the at least one message receiver receives the task message. Task management information associated with the at least one task is updated according to the semantic information of the voice message.

Abstract: The invention provides a video conferencing system and a video conferencing method. The video conferencing system includes a sound sensor, an omnidirectional camera, and a processor. The sound sensor senses a first sound source and a second sound source, to provide a first positioning coordinate corresponding to the first sound source and a second positioning coordinate corresponding to the second sound source. The omnidirectional camera captures an omnidirectional conference image. The processor acquires a first facial image and a second facial image from the omnidirectional conference image according to the first positioning coordinate and the second positioning coordinate. The processor determines an image stitching order according to positions of the first facial image and the second facial image respectively in the omnidirectional conference image to generate a close-up conference image.

Abstract: The invention provides a video conferencing system and a video conferencing method. The video conferencing system includes a sound sensor, an omnidirectional camera, and a processor. The sound sensor senses a first sound source and a second sound source, to provide a first positioning coordinate corresponding to the first sound source and a second positioning coordinate corresponding to the second sound source. The omnidirectional camera captures an omnidirectional conference image. The processor acquires a first facial image and a second facial image from the omnidirectional conference image according to the first positioning coordinate and the second positioning coordinate. The processor determines an image stitching order according to positions of the first facial image and the second facial image respectively in the omnidirectional conference image to generate a close-up conference image.

Abstract: This invention discloses an antistatic coating composition and antistatic film coated with the same. The antistatic coating composition comprises a hard coating solution and an antistatic solution. The hard coating solution comprises from 20 to 35 parts by weight of an acrylic oligomer, from 5 to 10 parts by weight of an acrylic monomer, from 40 to 60 parts by weight of a solvent and from 1 to 5 parts by weight of a photoinitiator. The antistatic solution comprises from 0.5 to 5 parts by weight of polyacrylic acid and from 1 to 20 parts by weight of ionic liquid. The antistatic film formed by coating the antistatic coating composition has a pencil hardness of 2H and an initial surface resistivity in the range of 108˜1011?/?, and the surface resistivity will maintain in the range of 1010˜1012?/? after isopropanol (IPA) washing.

Abstract: The invention provides an adhesive composition for conduction between electrical elements, comprising 25 to 46 parts by weight of nitrile-butadiene rubber with Mooney viscosity ranged from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides having different one-minute half-life temperatures from each other, and a coupling agent. The thermoplastic resin is selected from the group consisting of phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer and Novolak resin.

Abstract: The invention provides an adhesive composition for conduction between electrical elements, comprising 25 to 46 parts by weight of nitrile-butadiene rubber with Mooney viscosity ranged from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides having different one-minute half-life temperatures from each other, and a coupling agent. The thermoplastic resin is selected from the group consisting of phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer and Novolak resin.