Abstract: Electronic modules and methods for manufacturing electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a main printed circuit board (PCB) having a first surface, a first chip substrate disposed on the first surface, and a second chip substrate disposed on the first surface. The electronic module may include an intermediate PCB supported by the main PCB, where at least a portion of the intermediate PCB is disposed between the first chip substrate and the second chip substrate. The intermediate PCB may electrically connect the first chip substrate to the second chip substrate. For example, the intermediate PCB may include pins extending substantially parallel to the first surface, and the first chip substrate and the second chip substrate may include contacts configured to electrically connect to the pins of the intermediate PCB.

Abstract: A self-aligning connector for a computing system includes a case and a fluid pipe. The case has a pipe channel that extends internally, along a radial axis, between a case entry side and a case exit side. The fluid pipe is movably mounted within the pipe channel, separated from an internal surface of the pipe channel by a floating space. The fluid pipe is rotatably and linearly movable within the floating space, and includes a pipe entry side, a pipe exit side, and an internal channel for receiving a liquid coolant. The internal channel extends along the radial axis between a pipe entry end and a pipe exit end. The fluid pipe further has a tilt area that is located between the pipe entry side and the pipe exit side, and that is configured to rotatably adjust the fluid pipe relative to the case.

Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to control and remedy the infliction caused by Fusarium oxysporum f. sp. tracheiphilum. By selectively choosing specific weights of feathers and water, and treating the mixture to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then inject to the soil of young asparagus bean plants. Optionally, the KHP solution can be diluted by water, as disclosed in the specification, for applying to the asparagus bean plants.

Abstract: A pixel structure includes conductive patterns, a first insulating layer, bonding pads, and light emitting elements. The first insulating layer has contacts overlapping the conductive patterns respectively. The bonding pads are disposed on the first insulating layer and are electrically connected to the conductive patterns through the contact of the first insulating layer respectively. The light emitting elements are electrically connected to the bonding pads respectively. The light emitting elements include a first light emitting element and a second light emitting element. The bonding pads include a first bonding pad and a second bonding pad electrically connected to the first light emitting element and the second light emitting element respectively. The contacts include a first contact and a second contact overlapping with the first bonding pad and the second bonding pad respectively. An area of the first contact is different from an area of the second contact.

Abstract: A pixel structure includes a first conductive layer, a second conductive layer, and multiple light-emitting elements. The first conductive layer includes multiple conductive pattern groups and a connection pattern. Each conductive pattern group includes a first conductive pattern and a second conductive pattern, and the first conductive pattern is island-shaped. Second conductive patterns of the conductive pattern groups are directly connected to the connection pattern. The second conductive layer includes multiple pad groups. A first pad and a second pad of each pad group are respectively overlapped with and are electrically connected to the first conductive pattern and the second conductive pattern of the conductive pattern group. In a top view of the pixel structure, at least one first pad overlaps at least one first conductive pattern and a portion of the connection pattern.

Abstract: A light emitting module is disclosed. The light emitting module includes a board, a plurality of light sources, and a package layer. The board includes a first surface. The plurality of light sources are disposed on the first surface. The package layer is disposed on the first surface, which contacts and surrounds the light sources. A plurality of micro-structure areas are defined on the face of the package layer opposite to the first surface, wherein the micro-structure areas are disconnected with each other. The orthographic projection of each micro-structure area on the first surface covers the respective orthographic projection of one of the plurality of light sources on the first surface. The package layer concaves to form a plurality of micro-structures toward the first surface in the micro-structure areas.

Abstract: A teleprompter includes a connecting bracket, a prompting optical mechanism, a transferring board, and a supporting seat. The connecting bracket is used to support a monitor assembly. The prompting optical mechanism includes a main housing, a front frame, a rear frame, and a splitter. The transferring board is detachably connected to the rear frame. The transferring board has a photography opening. The supporting seat has an assembly board, and a horizontal carrier. The horizontal carrier is connected to a top end of the assembly board. The assembly board is connected to one side of the connecting bracket, and can be adjusted to different positions of the connecting bracket. Therefore, the horizontal carrier can be adjusted to different heights corresponding with the photography opening of the transferring board.

Abstract: A backlight module, including a reflective plate and a plurality of light-emitting units. The reflective plate is provided with a reflective side. The light-emitting units are provided on the reflective side. The reflective plate includes a substrate and a reflective layer. The reflective layer covers the substrate. The reflective side is divided by the reflective layer into a first region and a second region surrounding the first region, and the reflectivity of the second region is greater than that of the first region.

Abstract: A computing device include a chassis, a mounting ear, a lever, and a locking unit. The chassis holds one or more electronic devices and is insertable into a rack, such as a server rack. The mounting ear is coupled to the chassis. The lever is rotatably coupled to the mounting ear and is rotatable between a first position and a second position. In the first position, the lever engages the rack to prevent the chassis from being removed. In the second position, the lever disengages the rack and allows the chassis to be removed. The locking unit is coupled to the mounting ear and transitions between locked and unlocked states. In the locked state, the locking unit secures the lever in the first position. In the unlocked state, the lever is movable from the first position to the second position.

Abstract: According to an example aspect of the present invention, there is provided a Coulomb blockade thermometer, comprising a Coulomb blockade thermometer sensor element, a radio-frequency generator configured to feed a radio-frequency signal to a first port of the Coulomb blockade thermometer, and a radio-frequency sensor configured to measure a response of the Coulomb blockade thermometer to the radio-frequency signal from a second port of the Coulomb blockade thermometer to perform a conductance measurement of the Coulomb blockade thermometer, and a bias voltage generator configured to sweep through a bias voltage range during the conductance measurement, performed using the radio-frequency generator, of the Coulomb blockade thermometer.

Abstract: A reflective element is adapted to a backlight module including a plurality of light-emitting elements. The reflective element includes a body provided with a top surface, a bottom surface, and a plurality of light source grooves. Each light source groove is provided with a light outlet, a bottom, and a reflective portion. The light outlet is formed on the top surface. The bottom is adapted to arrange the light-emitting element. The reflective portion is located between the light outlet and the bottom and is adapted to surround the light-emitting element. The reflective portion includes a first reflective surface and a second reflective surface. The first reflective surface is located between the second reflective surface and the bottom, and the second reflective surface is located between the first reflective surface and the light outlet. The first reflective surface and the second reflective surface have different slopes or curvatures.

Abstract: A micro-structure film and a light emitting module are disclosed. A plurality of micro-structures with at least one predefined shape are uniformly distributed on at least one of surfaces of two opposite sides of the micro-structure film. The light emitting module includes a substrate, a plurality of light sources, and a package layer. The substrate has a first surface. The plurality of light sources are arranged on the first surface. The package layer is arranged on the first surface to contact with and cover the light sources. A plurality of micro-structures with at least one predefined shape are uniformly distributed on an other side of the package layer opposite to the first surface.

Abstract: A method of controlling a feedback control system of a semiconductor process chemical fluid in a storage tank includes performing a fluid quality measurement of fluid by a spectrum analyzer positioned adjacent to a dispensing port of the storage tank, and determining whether a variation in fluid quality measurement of the fluid is within an acceptable range. The method further includes in response to a variation in fluid quality measurement that is not within the acceptable range of variation in fluid quality measurement, automatically adjusting a configurable parameter of the semiconductor process chemical fluid in the storage tank to set the variation in fluid quality measurement of the fluid within the acceptable range.

Abstract: A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.

Abstract: An eye-bolt assembly includes an eye bolt and a base portion. The eye bolt includes a ring portion, a stem portion, and at least one winged extension. The ring portion is attached a first end of the stem portion. The at least one winged extension is attached to a second end of the stem portion. The base portion receives and securely locks the eye bolt therein. The base portion includes a collar and a platform secured to the collar. The collar forms a first aperture therein. The platform forms a second aperture therein. The platform includes a spring being located at least partially within the second aperture. A first end of the spring is attached to the platform. The second aperture formed in the platform is in spaced communication with the first aperture formed in the collar.

Abstract: An electronic device includes a temporary storage base, an adhesive layer, light-emitting elements, and a sealant. The adhesive layer is disposed on the temporary storage base. The light-emitting elements are disposed on the adhesive layer. The sealant is disposed on the temporary storage base and surrounds the adhesive layer. In addition, other electronic devices and a manufacturing method of the electronic device are also provided.

Abstract: Cable release devices and methods are disclosed. The device includes a frame defining an aperture. The frame is sized to fit around a connector on a printed circuit board (PCB) within a computer system with the connector extending into the aperture. The device further includes a post extending from the frame. The device further includes a lever connected to the post. The lever includes a first end positioned such that the first end aligns with a latch of a cable when the cable is connected to the connector and when the frame is around the connector such that actuation of the lever causes the lever to depress the latch. The actuation causes the release of the cable from being retained by the connector.

Abstract: An inductive device and a manufacturing method thereof are provided. The inductive device includes a magnetic base, a coil structure, and a package structure. The magnetic base has an assembling surface, and an arrangement region is defined thereon. The coil structure is assembled to the magnetic base and includes a coil body, a first extending section, and a second extending section. The coil body has a though hole corresponding in position to the arrangement region, and the first and second extending sections both extend from the coil body toward the magnetic base and are wound on the magnetic base. The package structure covers the magnetic base and the coil structure. The package structure includes a magnetic molding main body, and a portion of the magnetic molding main body fills into the through hole of the coil body and is connected to the magnetic base.

Abstract: A display apparatus includes a light-transmitting structural plate, some optical microscopic structures, an optical film, a base plate and some light emitting elements. The light-transmitting structural plate has a first side and a second side opposite to each other. The optical microscopic structures are regularly arrayed and formed on the first side or the second side. The optical microscopic structure has an inclined surface connecting at a connecting line and forming an angle ranging between 30 degrees and 150 degrees with a corresponding inclined surface of an adjacent one of the optical microscopic structures. The optical film is located on the first side. The base plate is separated from the second side by a space. The light emitting elements are located inside the space and disposed on the base plate. The light emitting elements respectively emit a light ray to the light-transmitting structural plate.

Abstract: A wafer picking and placing apparatus includes a platform and a hooking unit. The platform is adapted to support a wafer. The hooking unit includes a driving device and a hooking structure, and the hooking structure is connected to the driving device and has at least one hooking end. The driving device is adapted to drive the hooking structure to move between a first position and a second position in a horizontal direction. The driving device is adapted to drive the hooking structure to move between the second position and a third position above the second position in a vertical direction. When the hooking structure is located at the first position, the hooking end is away from the platform. When the hooking structure is located at the second position, the hooking end inserts between a lower side of an edge of the wafer and the platform to hook the wafer.