Abstract: The present disclosure provides a light emitting element including a substrate, a plurality of light blocking layers, a cover layer, a plurality of protrusions and an anti-reflective layer. The light blocking layers are disposed on a first surface of the substrate and include a plurality of openings. The plurality of protrusions are disposed on the cover layer, and two adjacent protrusions of the plurality of protrusions have an organic light emitting unit in between. The anti-reflective layer is disposed on a second surface of the substrate. The second surface is parallel to and opposite to the first surface.

Abstract: A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.

Abstract: The present disclosure provides a light emitting element including a substrate, an anti-reflective layer, multiple light blocking layers, a cover layer, a conductive layer and multiple protrusions. The anti-reflective layer is in contact with a first surface of the substrate. The multiple light blocking layers are in contact with a first surface of the anti-reflective layer. The cover layer is in contact with the first surface of the anti-reflective layer, and covers the multiple light blocking layers. The conductive layer is in contact with a second surface of the substrate, wherein the second surface is in parallel and opposite to the first surface. The multiple protrusions are disposed on the second surface of the substrate and cover a portion of the conductive layer.

Abstract: A method for forming a semiconductor device is provided.

Abstract: A battery module capable of suppressing spread of battery fire including a case, a plurality of battery packs, a plurality of temperature sensors, an energy consumption module and a controller. The case forms an accommodation space, and the battery packs is accommodated in the accommodation space. The temperature sensors are dispersedly configured to the accommodation space, and the temperature sensors respectively detect an ambient temperature around configure locations. The controller is coupled to the temperature sensors, and when the ambient temperature detected by one of the temperature sensors is greater than or equal to a first specific temperature range, the controller controls the energy consumption module to consume a battery capacity of at least one battery pack around the one of the temperature sensors.

Abstract: The application provides a panoramic perception method, system and a non-transitory computer readable medium. The panoramic perception method comprises: performing a first pretraining on a plurality of weights of a training model using the source database; performing a second pretraining with data augmentation on the plurality of weights of the training model using the source database; performing a combined training on the plurality of weights of the training model using both the source database and the target database; performing a quantization-aware training on the plurality of weights of the training model using the source database and the target database; performing a post training quantization on the plurality of weights of the training model using the target database; and performing panoramic perception by the training model.

Abstract: In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.

Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; a carrier substrate on the MLI structure; a first through substrate via (TSV) structure extending though the carrier substrate and configured to provide an electrical connection between the MLI structure and a separate die; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; and a microfluidic channel cap structure attached to the buried oxide layer.

Abstract: A biosensor system package includes: a transistor structure in a semiconductor layer having a front side and a back side, the transistor structure comprising a channel region; a buried oxide (BOX) layer on the back side of the semiconductor layer, wherein the buried oxide layer has an opening on the back side of the channel region, and an interface layer covers the back side over the channel region; a multi-layer interconnect (MLI) structure on the front side of the semiconductor layer, the transistor structure being electrically connected to the MLI structure; and a cap structure attached to the buried oxide layer, the cap structure comprising a microneedle.

Abstract: An eye-bolt assembly includes an eye bolt and a base portion. The eye bolt includes a ring portion, a stem portion, and at least one winged extension. The ring portion is attached a first end of the stem portion. The at least one winged extension is attached to a second end of the stem portion. The base portion receives and securely locks the eye bolt therein. The base portion includes a collar and a platform secured to the collar. The collar forms a first aperture therein. The platform forms a second aperture therein. The platform includes a spring being located at least partially within the second aperture. A first end of the spring is attached to the platform. The second aperture formed in the platform is in spaced communication with the first aperture formed in the collar.

Abstract: Disclosed are a display device. The display device includes a display panel, a backlight source, a computing unit, and a connection switch. The display panel includes a display region. The backlight source is disposed below the display panel. The panel driving circuit is configured to drive the display region of the display panel. The computing unit is electrically connected to the panel driving circuit and the backlight source. The connection switch is electrically connected between the computing unit and the panel driving circuit. The connection switch is turned on or off according to a plurality of signals, and when the connection switch is turned on, the plurality of signals are sent from the computing unit to the panel driving circuit.

Abstract: Pseudo resistor having an auto-tune function automatically calibrates resistance of the pseudo resistor and compensates for DC drift based on an output signal of an electrical circuit to which the pseudo resistor is coupled, as to mitigate signal phenomenon in the output signal caused by PVT variation. The pseudo resistor includes first transistor, second transistor, and adder. The first terminal of the second transistor is coupled to the first terminal of the first transistor and forms a first common node. The control terminal of the first transistor is coupled to the control terminal of the second transistor and forms second common node. The adder is coupled between the first and second common nodes and configured to receive adjustment voltage for generating a bias voltage for controlling the first and second transistors, where the adjustment voltage corresponds to the output signal coupled to the second terminal of the second transistor.

Abstract: A manufacturing method for an antibacterial fiber includes the following steps. A dipping step is performed to soak a conductive fiber in a solution, in which the solution includes an ionic compound, and the ionic compound includes a metal cation. An oxidation step is performed by using the conductive fiber as an anode, such that an antibacterial material produced by the solution is adhered to a surface of the conductive fiber, in which the antibacterial material includes a metal oxide.

Abstract: A Bluetooth communication system is provided, which comprises a Bluetooth host device and a Bluetooth device set. The connections between the Bluetooth host device and the Bluetooth device set complies with the specification of Bluetooth Low Energy Audio technology. The Bluetooth device set comprises at least a first member device and a second member device. The first member device and the second member device may be configured in a first mode wherein uplink audio signal transmission is allowed, and the connections are carried out by isochronous streaming channels respectively. The first member device transmits captured voice data to the Bluetooth host device, while the second member device does not. When an event is triggered, the first member device can notify the second member device through direct wireless connection, so that the first member device and the second member device can carry out subsequent voice input handover procedures.

Abstract: Cable release devices and methods are disclosed. The device includes a frame defining an aperture. The frame is sized to fit around a connector on a printed circuit board (PCB) within a computer system with the connector extending into the aperture. The device further includes a post extending from the frame. The device further includes a lever connected to the post. The lever includes a first end positioned such that the first end aligns with a latch of a cable when the cable is connected to the connector and when the frame is around the connector such that actuation of the lever causes the lever to depress the latch. The actuation causes the release of the cable from being retained by the connector.

Abstract: A Bluetooth communication system is provided, which comprises a Bluetooth host device and a Bluetooth device set. The connections between the Bluetooth host device and the Bluetooth device set complies with the specification of Bluetooth Low Energy Audio technology. The Bluetooth device set comprises at least a first member device and a second member device. The first member device and the second member device may be configured in a first mode and a second mode respectively, and the connections are carried out by isochronous streaming channels. The first member device transmits captured voice data to the Bluetooth main control device, while the second member device does not. When an event is triggered, the first member device can notify the second member device through the Bluetooth host device, so that the first member device and the second member device can carry out subsequent voice input handover procedures.

Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.

Abstract: An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.

Abstract: In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.

Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.