Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A display device includes a display panel. The display panel has a functional display area. The functional display area includes a plurality of display pixels and a plurality of light transmitting regions. The plurality of display pixels are around by the plurality of the light transmitting regions. A boundary between one of the plurality of display pixels and one of the plurality of light transmitting regions comprises an arc segment.

Abstract: A water purifier including a cover body mounted on top of a cylindrical seat having a partition board, with a delicate filtering cylinder and a plurality of filtering cylinders mounted on to the partition board in two rows. The partition board has a surrounding edge provided with a plurality of circular holes, each of the plurality of circular holes having a cavity box arranged underneath, each of the plurality of cavity boxes having two magnets and a cover board. A plurality of water conduits connects said delicate filtering cylinder and said plurality of filtering cylinders via said circular holes. The cylindrical seat also includes control panel provided with a water inlet for connecting to a tap, a water outlet port for magnetized and purified water, and an overflow port for removing water which accumulates at the partition board.

Abstract: The present invention relates to a structure of a water purifier comprising a cylindrical seat, a cover body, a delicate filtering cylinder and a plurality filtering cylinders, wherein the cover body is mounted onto the top of the cylindrical seat, and the top of the delicate filtering cylinder and the plurality of the filtering cylinders are provided with a screw cap, and the top face is provided with a water port and the bottom section is provided with a screw rod seat for mounting within the interior of the cylindrical seat, characterized in that the lower section of the cylindrical seat is provided with a partition board having a plurality of connection holes, and a plurality of circular holes being formed at the surrounding edge, and the side of the bottom face of the circular hole is provided with a cavity box for the mounting of a magnet, the partition board is used to hold the delicate filtering cylinder and a plurality of cylinders, and the water port of the control panel is used for connection with