Abstract: A network device supporting TRILL protocol includes a memory, a processor, and a communication interface. The memory includes a lookup table stored therein. The processor is coupled to the memory. The communication interface is coupled to the processor. The communication interface includes a trunk port and an access port and is configured to receive a first packet. When the processor determines that an output port corresponding to a destination address of the first packet is the trunk port, and determines that there is a lack of nickname information corresponding to the destination address according to the look up table, a second packet is transmitted through the trunk port of the communication interface. The second packet includes an enable local bit. The second packet and the first packet include the same payload information.

Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.

Abstract: A network device supporting TRILL protocol includes a memory, a processor, and a communication interface. The memory includes a lookup table stored therein. The processor is coupled to the memory. The communication interface is coupled to the processor. The communication interface includes a trunk port and an access port and is configured to receive a first packet. When the processor determines that an output port corresponding to a destination address of the first packet is the trunk port, and determines that there is a lack of nickname information corresponding to the destination address according to the look up table, a second packet is transmitted through the trunk port of the communication interface. The second packet includes an enable local bit. The second packet and the first packet include the same payload information.

Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.

Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.

Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.

Abstract: An MEMS probe card with elastic multi-layer structure mainly includes a substrate and a plurality of MEMS probe assemblies. The MEMS probe assemblies are disposed on a plurality of testing pads of the substrate, and each of the MEMS probe assemblies includes a plurality of first layer bridge elements, a second layer bridge element and a probe tip. The first and the second layer bridge elements each forms a -shaped cross-section and has two piers and a beam. The piers of the second layer bridge elements are respectively disposed on the beams of the first layer elements, and the probe tips are disposed on the beams of the second layer bridge elements. According to the stacks formed by the second layer bridge elements disposing on the first layer bridge elements, the probe tips may have more elastic buffer and a better resistance to the compressive strain when probing the bumps or bonding pads on wafers.

Abstract: An MEMS probe card with elastic multi-layer structure mainly includes a substrate and a plurality of MEMS probe assemblies. The MEMS probe assemblies are disposed on a plurality of testing pads of the substrate, and each of the MEMS probe assemblies includes a plurality of first layer bridge elements, a second layer bridge element and a probe tip. The first and the second layer bridge elements each forms a ?-shaped cross-section and has two piers and a beam. The piers of the second layer bridge elements are respectively disposed on the beams of the first layer elements, and the probe tips are disposed on the beams of the second layer bridge elements. According to the stacks formed by the second layer bridge elements disposing on the first layer bridge elements, the probe tips may have more elastic buffer and a better resistance to the compressive strain when probing the bumps or bonding pads on wafers.