Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.

Abstract: The application relates to a method for developing the agitation system of a scale-up polymerization vessel. A simulated prediction model is obtained by use of a small polymerization vessel and by integrating Taguchi experimental design method with artificial intelligence (AI) neural network. Accordingly, vessel parameters for the agitation system of a scale-up polymerization vessel can be rapidly and accurately predicted based on simulation qualities thereof, further facilitating a construction of the agitation system of a scale-up polymerization vessel.

Abstract: An electronic package is provided, in which a first electronic element and at least one support member are disposed on a carrier structure, a spacer is disposed on the first electronic element, and a second electronic element is disposed on the at least one support member and the spacer, so as to prevent the second electronic element from tilting during a wire bonding process.

Abstract: Various examples of conductor features in integrated circuit layouts are disclosed herein. In an example, a method includes receiving an integrated circuit layout, inserting, into the integrated circuit layout, a design containing a first set of Front-End Of Line (FEOL) shapes of an integrated circuit and a first set of Back-End Of Line (BEOL) shapes of the integrated circuit, inserting, into the integrated circuit layout, a set of cells containing a second set of FEOL shapes of the integrated circuit and a second set of BEOL shapes of the integrated circuit, removing a subset of the second set of BEOL shapes that conflict with the design, and providing the integrated circuit layout that includes the design and the set of cells for fabrication of the integrated circuit. The second set of FEOL shapes includes contact shapes that define contacts of the integrated circuit.

Abstract: Various examples of conductor features in integrated circuit layouts are disclosed herein. In an example, a method includes initializing a layout for fabricating an integrated circuit. A plurality of fill cells is inserted into the layout. The plurality of fill cells includes a plurality of fill line shapes that correspond to conductive lines of the integrated circuit. Thereafter, a design is inserted into the layout that includes a plurality of functional shapes. A conflicting subset of the plurality of fill line shapes of the plurality of fill cells that conflict with the plurality functional shapes are removed. The layout that includes the plurality of fill cells and the design is provided for fabricating the integrated circuit.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: Various examples of conductor features in integrated circuit layouts are disclosed herein. In an example, a method includes initializing a layout for fabricating an integrated circuit. A plurality of fill cells is inserted into the layout. The plurality of fill cells includes a plurality of fill line shapes that correspond to conductive lines of the integrated circuit. Thereafter, a design is inserted into the layout that includes a plurality of functional shapes. A conflicting subset of the plurality of fill line shapes of the plurality of fill cells that conflict with the plurality functional shapes are removed. The layout that includes the plurality of fill cells and the design is provided for fabricating the integrated circuit.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.

Abstract: A post placement abutment treatment for cell row design is provided. In an embodiment a first cell and a second cell are placed in a first cell row and a third cell and a fourth cell are placed into a second cell row. After placement vias connecting power and ground rails to the underlying structures are analyzed to determine if any can be merged or else removed completely. By merging and removing the closely placed vias, the physical limitations of photolithography may be by-passed, allowing for smaller structures to be formed.