Patents by Inventor Yu-Cheng Yu

Yu-Cheng Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device with conductive structure directly abutting metal frame to ground bracket
    Patent number: 10615525
    Abstract: An electronic device is provided. The electronic device includes a substrate, a connector, a ground bracket and a conductive structure. The substrate includes a ground layer. The connector is disposed on the substrate, wherein the connector includes a metal frame. The ground bracket is affixed on the substrate and coupled to the ground layer, wherein at least a portion of the connector is located in the ground bracket. The conductive structure is adapted to abut the metal frame and to abut the ground bracket, wherein when the conductive structure connects the metal frame to the ground bracket, the conductive structure electrically connects the ground bracket to the metal frame.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: April 7, 2020
    Assignee: WISTRON NEWEB CORP.
    Inventors: Yi-Chieh Lin, San-Yi Kuo, Man-Ning Lu, Cheng-Hsiung Lu, Huei-Chi Wu, Yu-Cheng Yu