Abstract: A disclosed display device capable of detecting bonding defects includes: a display panel having an active area used to display images and a pad area in which pads are formed; driver IC (Integrated Circuit) chip mounted on a pad region of the display panel; a flexible printed circuit board bonded to the pad region of the display panel; and a bonding resistance detection circuit disposed in the driver IC chip. The display panel includes: first and second bonding portions formed in a mounting region of the driver IC chip within the pad area of the display panel; and third and fourth bonding portions formed in a bonding region of the flexible printed circuit board within the pad area of the display panel. The first through fourth bonding portions are electrically connected to one another, and the first and second bonding portions are connected to the bonding resistance detection circuit.

Abstract: A bonding-defect-detectable display device is disclosed which includes: a display panel defined into an active area used to display images and a pad area in which pads is formed; driver IC (Integrated Circuit) chip loaded on a pad region of the display panel; a flexible printed circuit board mounted to the pad region of the display panel; and a bonding resistance detection unit disposed into the driver IC chip. The display panel includes: first and second bonding portions formed in an occupation region of the driver IC chip within the pad area of the display panel; and third and fourth bonding portions formed in an occupation region of the flexible printed circuit board with the pad area of the display panel.