Patents by Inventor Yu-Chi Chu
Yu-Chi Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12265838Abstract: A system for model protection includes a processor. The processor is arranged to execute a guest virtual machine (VM), a primary VM, and a hypervisor. The guest VM includes a model, and is arranged to send at least one command to a command hub. The primary VM is arranged to refer to the at least one command sent from the command hub to manage and configure a protection setting for a protected model derived from the model. The hypervisor is arranged to receive a safety setting command sent by the primary VM, and manage and configure the safety protection component according to the safety setting command, to set a read-only mode of the protected model.Type: GrantFiled: June 15, 2022Date of Patent: April 1, 2025Assignee: MEDIATEK INC.Inventors: Chih-Hsiang Hsiao, Pei-Lun Suei, Yu-Chi Chu
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Publication number: 20240419478Abstract: A virtual machine (VM) operating system (OS) device assignment system includes a processor, wherein the processor is configured to execute a host VM, a hypervisor, a device assigner, and a guest VM. The host VM is arranged to generate a driving signal for driving a booting of the guest VM. The hypervisor is arranged to generate a first trigger signal according to the driving signal, for triggering assignment of at least one device. The device assigner is arranged to modify a descriptor to generate a modified descriptor for assigning the at least one device among a plurality of devices to the guest VM, and install the modified descriptor into a protected memory, wherein an OS of the guest VM is configured according to the modified descriptor.Type: ApplicationFiled: June 14, 2024Publication date: December 19, 2024Applicant: MEDIATEK INC.Inventors: Chih-Hsiang Hsiao, Ze-Yu Wang, Yi-De Wu, Yu-Chi Chu
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Publication number: 20240414641Abstract: A system and a method for wireless access point (AP) assignment are provided. The method includes: scanning a plurality of wireless devices by a first wireless AP to obtain a first subset of the plurality of wireless devices; scanning the plurality of wireless devices by a second wireless AP to obtain a second subset of the plurality of wireless devices; calculating a first probability of assigning a first wireless device to the first wireless AP and a second probability of assigning the first wireless device to the second wireless AP in response to the first wireless device of the plurality of wireless devices being included in both the first subset and the second subset; assigning the first wireless device to the first wireless AP to generate an assignment result in response to the first probability being greater than the second probability; and outputting the assignment result.Type: ApplicationFiled: July 7, 2023Publication date: December 12, 2024Applicant: Wistron CorporationInventors: Yu Chi Chu, Ching-Nan Lin
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Publication number: 20240244034Abstract: A computing system includes a memory, an MPU, and a processor. The MPU is arranged to: receive permission information of the memory; and perform a protection operation through a dynamic firewall. The processor is arranged to execute a root manager and a hypervisor. The root manager is arranged to provide the permission information to the MPU. The hypervisor is arranged to: receive the permission information from the MPU; set the dynamic firewall according to the permission information; and provide the dynamic firewall to the MPU.Type: ApplicationFiled: August 29, 2023Publication date: July 18, 2024Applicant: MEDIATEK INC.Inventors: Chih-Hsiang Hsiao, Pei-Lun Suei, Yu-Chi Chu, Yingshiuan Pan
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Patent number: 11706587Abstract: A management system, a management method, and a location finding method for managing a plurality of physical locations having multi-dimensional coordinates within a room are provided. The management system includes a plurality of terminal devices, at least one coordination device, and a management device. The management device stores a first and a second pairing table. The management device is configured to, in response to an external command, perform: obtaining an identification number of a first terminal device of the terminal devices from the first pairing table; determining, from the second pairing table, a first coordination device that is configured to manage the first terminal device; and transmitting a task command to the first coordination device such that the first coordination device assigns the first terminal device to complete the task command.Type: GrantFiled: November 15, 2021Date of Patent: July 18, 2023Assignee: WISTRON CORPORATIONInventors: Ching-Nan Lin, Wen-Hua Liu, Yu-Chi Chu
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Publication number: 20230087520Abstract: A system for kernel protection includes a processor and a transmission interface. The processor is arranged to execute at least one guest virtual machine (VM), at least one primary VM, and a hypervisor. The at least one guest VM is arranged to send at least one command to a command hub. The at least one primary VM is arranged to manage and configure a safety setting according to the at least one command from the command hub and at least one policy, and manage and configure a safety protection component according to the safety setting. The hypervisor is arranged to manage and configure the safety protection component according to a ground rule and at least one safety setting command from the at least one primary VM. The transmission interface is arranged to bind the at least one primary VM to the hypervisor.Type: ApplicationFiled: June 30, 2022Publication date: March 23, 2023Applicant: MEDIATEK INC.Inventors: Chih-Hsiang Hsiao, Pei-Lun Suei, Yu-Chi Chu
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Publication number: 20230091722Abstract: A computing system includes a processor, and the processor is arranged to execute: a guest virtual machine (VM), a hypervisor, and a primary VM, wherein an operating system (OS) runs on the guest VM, and an application (APP) runs on the OS. The kernel of the OS includes a protection service module and a memory management unit (MMU) manager. The protection service module is arranged to receive at least one virtual address and a first size information sent by a client of the APP. The primary VM includes a protection manager, and the protection manager is arranged to obtain a physical address array and a second size information according to the at least one virtual address and the first size information sent by the protection service through the hypervisor.Type: ApplicationFiled: November 2, 2022Publication date: March 23, 2023Applicant: MEDIATEK INC.Inventors: Chih-Hsiang Hsiao, Hung-Wen Chien, Yu-Chi Chu, Pei-Lun Suei
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Publication number: 20230092808Abstract: A system for model protection includes a processor. The processor is arranged to execute a guest virtual machine (VM), a primary VM, and a hypervisor. The guest VM includes a model, and is arranged to send at least one command to a command hub. The primary VM is arranged to refer to the at least one command sent from the command hub to manage and configure a protection setting for a protected model derived from the model. The hypervisor is arranged to receive a safety setting command sent by the primary VM, and manage and configure the safety protection component according to the safety setting command, to set a read-only mode of the protected model.Type: ApplicationFiled: June 15, 2022Publication date: March 23, 2023Applicant: MEDIATEK INC.Inventors: Chih-Hsiang Hsiao, Pei-Lun Suei, Yu-Chi Chu
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Publication number: 20230090251Abstract: A system for application (APP) protection includes a processor. The processor is arranged to execute a guest virtual machine (VM), at least one primary VM, a hypervisor, and a host VM, wherein at least one APP protection with at least one identification (ID) of the at least one APP running on the guest VM is downloaded to the guest VM. The hypervisor includes an install service module and a launcher module. The host VM is arranged to: receive at least one install command from the guest VM, and generate an install service command to the install service module; verify the at least one APP protection by the at least one ID and generate at least one verification result; obtain the at least one ID from the at least one primary VM according to the at least one verification result; and generate a launch command to the launcher module.Type: ApplicationFiled: June 26, 2022Publication date: March 23, 2023Applicant: MEDIATEK INC.Inventors: Chih-Hsiang Hsiao, Pei-Lun Suei, Yu-Chi Chu
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Publication number: 20230056127Abstract: A management system, a management method, and a location finding method for managing a plurality of physical locations having multi-dimensional coordinates within a room are provided. The management system includes a plurality of terminal devices, at least one coordination device, and a management device. The management device stores a first and a second pairing table. The management device is configured to, in response to an external command, perform: obtaining an identification number of a first terminal device of the terminal devices from the first pairing table; determining, from the second pairing table, a first coordination device that is configured to manage the first terminal device; and transmitting a task command to the first coordination device such that the first coordination device assigns the first terminal device to complete the task command.Type: ApplicationFiled: November 15, 2021Publication date: February 23, 2023Inventors: Ching-Nan Lin, Wen-Hua Liu, Yu-Chi Chu
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Patent number: 8446071Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: May 21, 2013Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 8237335Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: August 7, 2012Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7902728Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: June 27, 2008Date of Patent: March 8, 2011Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Publication number: 20080262358Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: June 27, 2008Publication date: October 23, 2008Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7405510Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: July 29, 2008Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7378779Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: GrantFiled: July 20, 2006Date of Patent: May 27, 2008Assignee: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Patent number: 7305264Abstract: Noninvasive pain treatment of skeletal cancer metastases in cancer patients utilizing planar or focused ultrasound. The ultrasound energy preferably targets at the Periosteum or immediate soft-bone-tissue interface, where local sensory pain receptors are directly affected by the growing tumor, to generate heat to destroy local sensory pain receptors so as to interrupt or block the pain feedback pathway to the central nervous system.Type: GrantFiled: November 22, 2004Date of Patent: December 4, 2007Assignee: UST, Inc.Inventors: Eugene A. Larson, Perry W. Kaminski, Yu-Chi Chu
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Publication number: 20070167803Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: July 19, 2007Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu
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Publication number: 20070055182Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: March 8, 2007Applicant: UST, Inc.Inventors: Perry Kaminski, Yu-Chi Chu
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Publication number: 20070055183Abstract: A system and method for removing unwanted heat generated by a piezoelectric element of an ultrasound transducer. Some implementations have high thermal conductivity (HTC) material placed adjacent to the piezoelectric element. The HTC material can be thermally coupled to one or more heat sinks. Use of HTC material in conjunction with these piezoelectric element surfaces is managed to avoid degradation of propagating acoustic energy. Use of the HTC material in conjunction with heat sinks allows for creation of thermal paths away from the piezoelectric element. Active cooling of the heat sinks with water or air can further draw heat from the piezoelectric element. Further implementations form a composite matrix of thermally conductive material or interleave thermally conductive layers with piezoelectric material.Type: ApplicationFiled: July 20, 2006Publication date: March 8, 2007Applicant: UST, INC.Inventors: Perry Kaminski, Yu-Chi Chu