Abstract: A ground point fixing device for a power supply module includes an engaging part and a fastening part. The engaging part includes an engaging body, a joining portion and an engaging portion. The engagement body has a body outer diameter and a body surface larger than a grounding hole on a power supply module circuit board. The joining portion is disposed on the body surface and has a joining portion outer diameter smaller than the grounding hole. The engagement portion is disposed on the body surface and around an outer circumference of the joining portion. The joining portion is passed through the grounding hole to be connected to the fastening part, so that the engagement portion of the engaging part is engaged in the grounding hole, and the fastening part and the engagement body of the engaging part are respectively fixed on an upper surface and a lower surface of the circuit board.

Abstract: A device includes a substrate, a first fin, a second fin, a first isolation structure, a second isolation structure, and a gate structure. The first fin extends from a p-type region of the substrate. The second fin extends from an n-type region of the substrate. The first isolation structure is over the p-type region and adjacent to the first fin. The first isolation structure has a bottom surface and opposite first and second sidewalls connected to the bottom surface, a first round corner is between the bottom surface and the first sidewall of the first isolation structure, and the first sidewall is substantially parallel to the second sidewall. The second isolation structure is over the n-type region and adjacent to the first fin. The first isolation structure is deeper than the second isolation structure. The gate structure is over the first isolation structure and covering the first fin.

Abstract: A driving mechanism is provided, including a base, a movable unit, and a movable part. The movable unit is movably disposed on the base and connected to an optical element. The movable part is movably disposed on the base and forms a passage. When the movable part moves from the first position to the second position relative to the base, the movable unit can slide relative to the base from its initial position through the passage to a closed position.

Abstract: A manufacturing method of a memory device are provided. The method includes following steps. A gate stacking structure is formed over a substrate. A first insulating layer, a second insulating layer and a mask material layer are sequentially formed over the substrate to cover the gate stacking structure. An ion implantation process is performed on the mask material layer to form a doped portion in the mask material layer. The doped portion caps on a top portion of the gate stacking structure. A first patterning process is performed on the mask material layer using the doped portion as a shadow mask to remove a bottom portion of the mask material layer extending along a surface of the substrate. A second patterning process is performed to remove the doped portion of the mask material layer and an exposed bottom portion of the second insulating layer surrounding the gate stacking structure.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion and a sensing assembly. The movable portion is connected with an optical element. The movable portion is movable relative to the fixed portion. The sensing assembly senses whether the movable portion is in a first position relative to the fixed portion.

Abstract: An optical element driving mechanism, which drives an optical element, includes a fixed portion, a first movable portion, and a driving assembly. The first movable portion is moved relative to the fixed portion, and the driving assembly drives the first movable portion to move relative to the fixed portion. The first movable portion is moved in a first dimension relative to the fixed portion, and the first movable portion drives the optical element to move.

Abstract: A driving mechanism for moving an optical element is provided, including a fixed part, a movable part, movably connected to the fixed part, a positioning structure, and a driving assembly. The optical element is disposed on the movable part, and the positioning structure is formed on the fixed part to restrict the movable part in a specific position relative to the fixed part. The driving assembly is configured to drive the movable part to move relative to the fixed part.

Abstract: An optical element driving mechanism is provided in the present disclosure, including a fixed portion, a first movable portion, and a driving assembly. The first movable portion is movable relative to the fixed portion. The driving assembly drives the first movable portion to move relative to the fixed portion. The first movable portion brings an optical element to move.

Abstract: An optical driving mechanism is provided. The optical driving mechanism includes a first movable part, a fixed part, and a first driving assembly. The first movable part is connected with an optical element. The first movable part is movable relative to the fixed part. The first driving assembly drives the first movable part to move relative to the fixed part. The fixing part has an opening.

Abstract: A manufacturing method of a memory device are provided. The method includes following steps. A gate stacking structure is formed over a substrate. A first insulating layer, a second insulating layer and a mask material layer are sequentially formed over the substrate to cover the gate stacking structure. An ion implantation process is performed on the mask material layer to form a doped portion in the mask material layer. The doped portion caps on a top portion of the gate stacking structure. A first patterning process is performed on the mask material layer using the doped portion as a shadow mask to remove a bottom portion of the mask material layer extending along a surface of the substrate. A second patterning process is performed to remove the doped portion of the mask material layer and an exposed bottom portion of the second insulating layer surrounding the gate stacking structure.

Abstract: A driving mechanism is provided, including a base, a movable unit, a magnetic element, and a driving assembly. The movable unit is movably disposed on the base. The magnetic element is disposed on the movable unit and has plastic material. The driving assembly is configured to drive the movable unit to move relative to the base, wherein the driving assembly has a coil, and the magnetic element and the movable unit move relative to the base when an electrical current is applied to the coil.

Abstract: An optical element driving mechanism is provided and includes a first movable part, a fixed assembly and a first driving assembly. The first movable part includes an optical element, and the first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly. The fixed assembly includes a first base and a second base arranged along a first axis, and the first movable part moves along the first axis.

Abstract: A driving mechanism is provided, including a base, a movable unit, and a movable part. The movable unit is movably disposed on the base and connected to an optical element. The movable part is movably disposed on the base and forms a passage. When the movable part moves from the first position to the second position relative to the base, the movable unit can slide relative to the base from its initial position through the passage to a closed position.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a gate stacking structure, a first insulating layer, a second insulating layer and a first spacer. The gate stacking structure is disposed over a substrate. The first insulating layer covers a top surface and a sidewall of the gate stacking structure. The second insulating layer covers a surface of the first insulating layer. A top corner region of the gate stacking structure is covered by the first and second insulating layers. The first spacer is located on the sidewall of the gate stacking structure, and covers a surface of the second insulating layer. A topmost end of the first spacer is lower than a topmost surface of the second insulating layer.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes a gate stacking structure, a first insulating layer, a second insulating layer and a first spacer. The gate stacking structure is disposed over a substrate. The first insulating layer covers a top surface and a sidewall of the gate stacking structure. The second insulating layer covers a surface of the first insulating layer. A top corner region of the gate stacking structure is covered by the first and second insulating layers. The first spacer is located on the sidewall of the gate stacking structure, and covers a surface of the second insulating layer. A topmost end of the first spacer is lower than a topmost surface of the second insulating layer.

Abstract: A device and method for cultivating cells are provided, wherein a cell cultivating layer is formed on a surface of a substrate, and a temperature-responsive layer having a plurality of temperature-responsive polymer with magnetic objects is formed on a surface of the cell cultivating layer. When a controlling characteristic exerted on the temperature-responsive layer is varied, a plurality of cells can be adhered on the cell cultivating layer or detached therefrom. When the device is utilized, a temperature control step is operated to control environmental temperature at a first temperature for inducing temperature-responsive polymers becoming hydrophobic whereby the plurality of cells are adhered on the cell cultivating layer. In addition, the alternating magnetic field is utilized to rise temperature of the temperature-responsive polymers so that the plurality of cells can be kept being adhered on the cell cultivating layer at a second temperature lower than the first temperature.

Abstract: A casing includes a display side which is provided with a plurality of through holes that form a predetermined pattern. A light generating unit is disposed in the casing, and a light receiving unit is spaced from the light generating unit. The light receiving unit includes a mounting plate, a plurality of optical fiber bundles and a motor. Each of the optical fiber bundles has a first end fixed onto the mounting plate and a second end fixed in a respective one of the through holes in the display side. The motor rotatably carries a transparent circular disc and is mounted to the mounting plate. The transparent circular disc has different colored regions.