Abstract: Disclosed is a diamine compound represented by Formula (1), in which R1, R2, R3, R4, R5, X1, X2, X3, X4, m, n, a, b, c, and d are as defined herein. Also disclosed are a method for manufacturing the diamine compound, a composition including the diamine compound having a (chain alkoxy-methylene) phenyl group or a (hydroxyl-methylene) phenyl group, and a polymer including the (chain alkoxy-methylene) phenyl group or the (hydroxyl-methylene) phenyl group.

Abstract: A back panel of a solar cell and a method for manufacturing the same are provided. The back panel includes a prepreg and a fluorine-containing polymer layer, and the fluorine-containing polymer layer is formed on the prepreg. The prepreg is formed by immersing a fiber substrate into a resin composition. Based on a total weight of the resin composition being 100 PHR (parts per hundred resin), the resin composition includes: 5 PHR to 70 PHR of a first epoxy resin, 1 PHR to 20 PHR of a hardener, and 0.01 PHR to 10 PHR of an accelerant. The first epoxy resin contains phosphorus atoms, and an amount of the phosphorus atoms in the first epoxy resin ranges from 0.1 wt % to 5 wt %.

Abstract: A plastic wrap is provided. The plastic wrap is formed from a biodegradable material. The biodegradable material includes a biodegradable polymer and a chain extender. The biodegradable polymer includes polybutylene adipate terephthalate (PBAT). Based on a total weight of the plastic wrap being 100 phr, an amount of the PBAT is higher than 85 phr. The chain extender is selected from the group consisting of: an epoxy functional compound, a dianhydride compound, diisocyanate, phosphite, dioxazoline, and any combination thereof.

Abstract: A device includes a sensor die having a sensing region at a top surface of the sensor die, an encapsulant at least laterally encapsulating the sensor die, a conductive via extending through the encapsulant, and a front-side redistribution structure on the encapsulant and on the top surface of the sensor die, wherein the front-side redistribution structure is connected to the conductive via and the sensor die, wherein an opening in the front-side redistribution structure exposes the sensing region of the sensor die, and wherein the front-side redistribution structure includes a first dielectric layer extending over the encapsulant and the top surface of the sensor die, a metallization pattern on the first dielectric layer, and a second dielectric layer extending over the metallization pattern and the first dielectric layer.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: A container sealing device includes a platform slidable and movable in and out of a casing and having an opening for receiving a container to be sealed. A lever and a support device are slidably attached to the platform, and movable up and down relative to the platform, to support the container. The platform includes a peripheral bulge having a peripheral channel to form an inner peripheral wall which may support an outer flange of the container, and an outer peripheral wall having an orifice for supplying a food preserving agent to the container, and an aperture for vacuuming the container. The support device may be adjusted relative to the lever, to support containers of different heights or depths.