Abstract: The present disclosure is directed to a transfer blade including a first end segment, a second end segment opposite to the first end segment, and an intermediate segment extending from the first end segment to the second end segment. The first end segment includes a first contact region and the second end segment includes a second contact region. The first and second contact regions are configured to contact locations of a surface of a workpiece that do not overlap or are not aligned with a sensitive area of the workpiece. The sensitive area of the workpiece may be an EUV frame or a reticle of the workpiece. A non-contact region extends continuously along the first end segment, the intermediate segment, and the second end segment, and the non-contact region overlaps the sensitive area of the workpiece and is spaced apart from the sensitive area of the workpiece.

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: An apparatus for performing a deposition process on a semiconductor wafer includes a chamber, a wafer holder, and a shielding structure. The chamber contains a reaction area, the wafer holder is disposed in the chamber to hold the semiconductor wafer, and the reaction area is above the semiconductor wafer. The shielding structure is disposed in the chamber and isolates an inner sidewall of the chamber from the reaction area. The shielding structure includes a base member, a first member, and a second member. The base member is disposed between the inner sidewall of the chamber and the wafer holder. The first member is disposed on the base member and is windowless. The second member is disposed on the base member and within the first member, and the second member includes a sidewall provided with a first window to transfer the semiconductor wafer.

Abstract: A clamp ring including an inner periphery of increased diameter at locations where inwardly extending tabs are not located reduces the risk a workpiece that is placed in close proximity to the clamp ring or which contacts the clamp ring during processing will stick to the clamp ring.

Abstract: A wafer pod transfer assembly is provided. The wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: A deposition tool includes a power cable pedestal including a pedestal body with a first surface and a second surface and a guide hole that extends through the pedestal body from the first surface to the second surface, where at least a portion of a sidewall of the guide hole has a slanted surface, and where the pedestal body is formed from a first material with a melting point that is higher than a melting point of Polyoxymethylene (POM). The deposition tool includes a bushing arranged over the guide hole, where the bushing is formed from a second material with a melting point that is higher than the melting point of POM.

Abstract: Methods and systems for analysing a property of a cornea of an eye using terahertz (THz) radiation are provided. The method includes projecting a first THz wave onto a surface of the cornea and detecting a first reflected wave being a reflection of the first THz wave reflected from the surface of the cornea. The method further includes deforming the cornea by projecting visible light or puffing air to the surface of the cornea, projecting a second THz wave onto the surface of the cornea after the deforming, and detecting a second reflected wave being a reflection of the second THz wave reflected from the surface of the cornea after the deforming. Finally, the method includes calculating the property of the cornea based on the first reflected wave and the second reflected wave. The invention particularly relates to systems and methods for corneal elasticity and/or rigidity analysis using terahertz (THz) time-domain spectroscopy.

Abstract: Methods and systems for dry eye analysis using terahertz (THz) radiation. The method includes projecting a THz wave onto a surface of an eye and detecting a reflected wave being a reflection of the THz wave reflected from the surface of the eye. The method further includes analysing properties of the eye in response to the THz wave reflected from the surface of the eye, the properties of the eye including thickness of the eye's cornea and ambient tissues, and analyzing the properties of the eye comprises measuring the thickness of the cornea and/or the ambient tissues and/or measuring an amount of chemical components of one or more of the eye's layers.

Abstract: The present invention relates to a control system and control method. The control system is applied to a machine tool and includes a horizontal monitor unit, a temperature monitor unit, a temperature adjustment device and a controller. The horizontal monitor unit is configured to measure a horizontal angle of a table and the temperature monitor unit is configured to measure a temperature information of a sensing area in a machining device. The controller receives the horizontal angle and the temperature information, then generates a compensation signal to the temperature adjustment device to change the temperature of an adjusting area in the machining device so that the horizontal angle of the table and the vertical inclination of the machining device are orthogonal to each other.

Abstract: An antenna system includes a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, a first dipole antenna, a second dipole antenna, a third dipole antenna, a fourth dipole antenna, a fifth dipole antenna, a sixth dipole antenna, a seventh dipole antenna, and an eighth dipole antenna. Each dipole antenna is coupled through a corresponding transmission line to a feeding point. Each of the fifth dipole antenna, the sixth dipole antenna, the seventh dipole antenna, and the eighth dipole antenna is positioned between the feeding point and a corresponding one of the first dipole antenna, the second dipole antenna, the third dipole antenna, and the fourth dipole antenna. Each of the partial dipole antennas includes a positive radiation branch and a negative radiation branch. The angle between the positive radiation branch and the negative radiation branch is less than 100 degrees.

Abstract: An antenna system includes a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, a first dipole antenna, a second dipole antenna, a third dipole antenna, a fourth dipole antenna, a fifth dipole antenna, a sixth dipole antenna, a seventh dipole antenna, and an eighth dipole antenna. Each dipole antenna is coupled through a corresponding transmission line to a feeding point. Each of the fifth dipole antenna, the sixth dipole antenna, the seventh dipole antenna, and the eighth dipole antenna is positioned between the feeding point and a corresponding one of the first dipole antenna, the second dipole antenna, the third dipole antenna, and the fourth dipole antenna. Each of the partial dipole antennas includes a positive radiation branch and a negative radiation branch. The angle between the positive radiation branch and the negative radiation branch is less than 100 degrees.

Abstract: The present disclosure provides warm-up compensation system and method. This method includes steps as follow. Critical area of a machine is analyzed, where the critical area includes a plurality of critical temperature-sensitive blocks and at least one critical heating block. Then, temperature sensors are used to detect the temperature of the critical areas of the machine. The correspondence relationship among temperature changes of critical areas, tilt angle changes of a spindle of the machine and temperature changes of the at least one critical heating block along heating time. The critical area of the machine is compensated in accordance with the correspondence relationship. Whether the temperature of the spindle has reached equilibrium is determined.

Abstract: A tool measurement method includes receiving, through a first communication component, at least one first sensing signal from a tool sensor; receiving, through a second communication component, a plurality of coordinates from a machine tool controller; calculating a tool diameter of a cutting tool according to at least first one target coordinate of the coordinates, wherein the at least one first target coordinate corresponds to the first sensing signal; and providing, through the second communication component, the tool diameter of the cutting tool to the machine tool controller.

Abstract: A planar light source including a transflective film, a plurality of cold cathode fluorescence flat lamps and at least one reflective component to provide a uniform light source is described. A portion of the light emitted from the emitting areas of the cold cathode fluorescence flat lamps passes through the transflective film, and the other portion of the light is reflected to the reflective component by the transflective film. Then, the light is reflected to the dark areas between the emitting areas to compensate the brightness of the dark areas. When the brightness of the dark areas is compensated, the planar light source provides a uniform light without dark stripes.