Patents by Inventor Yu-Chi Shen

Yu-Chi Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element
    Patent number: 11562972
    Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: January 24, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang
  • MANUFACTURING METHOD OF THE CHIP PACKAGE STRUCTURE
    Publication number: 20210398925
    Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.
    Type: Application
    Filed: September 1, 2021
    Publication date: December 23, 2021
    Applicant: Unimicron Technology Corp.
    Inventors: John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang
  • Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof
    Patent number: 11145610
    Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: October 12, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang
  • CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20210202407
    Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 1, 2021
    Applicant: Unimicron Technology Corp.
    Inventors: John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang