Patents by Inventor Yu-Chi Tai

Yu-Chi Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155758
    Abstract: An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element is disposed over the first dielectric layer. The encapsulant encapsulates the electronic element and has a second CTE. The second dielectric layer is disposed over the encapsulant and having a third CTE. The second CTE ranges between the first CTE and the third CTE.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Yu Hsin CHANG CHIEN, Chiu-Wen LEE, Chang Chi LEE
  • Patent number: D937829
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: December 7, 2021
    Assignee: Kaijet Technology International Corporation
    Inventor: Yu-Chi Tai
  • Patent number: D950619
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: May 3, 2022
    Assignee: Kaijet Technology International Corporation
    Inventor: Yu-Chi Tai