Abstract: A method for annealing a wafer includes loading the wafer to a fork of a delivering robot in an annealing apparatus, wherein the wafer is in contact with a vibration-detecting sensor on the fork; rotating the fork between a heating plate and a cooling plate of the annealing apparatus; outputting, by the vibration-detecting sensor, a first signal in response to a motion of the fork of the delivering robot when the wafer is loaded on the fork; and providing, by a circuitry of the annealing apparatus, a response in response to the first signal.

Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

Abstract: A method of controlling chemical concentration in electrolyte includes measuring the chemical concentration in the electrolyte in a tank, wherein an end of an exhaust pipe is connected to a top of the tank; determining, by a valve moved along a top surface of the tank, a vapor flux through the exhaust pipe based on the measured chemical concentration; rotating, by using a motor connected to a ball screw connected to the valve, the ball screw to move a gate of the valve based on the determined vapor flux; electroplating, using the electrolyte provided by the tank, wafers respectively in a plurality of electroplating cells that are connected to the tank; and recycling the electrolyte to the tank.

Abstract: An electrostatic substrate holder for use in an extreme ultraviolet radiation lithography system includes a substrate receiving surface having a plurality of gas passages in fluid communication with a variable gas pressure pump. Varying the pressure in a void space between the backside of the substrate and the substrate receiving surface of the substrate holder promotes removal of non-gaseous materials within the void space between the backside of the substrate and the substrate receiving surface of the substrate holder.

Abstract: An electrostatic substrate holder for use in an extreme ultraviolet radiation lithography system includes a substrate receiving surface having a plurality of gas passages in fluid communication with a variable gas pressure pump. Varying the pressure in a void space between the backside of the substrate and the substrate receiving surface of the substrate holder promotes removal of non-gaseous materials within the void space between the backside of the substrate and the substrate receiving surface of the substrate holder.

Abstract: An image processing method includes following operations: receiving, by a processor, an input image from a camera; performing, by the processor, a top-view calibration process to generate a top-view calibrated image according to the input image; performing, by the processor, an object extraction process on the top-view calibrated image to generate at least one target object frame; performing, by the processer, a centering process on the at least one target object frame to generate a centered image; and outputting, by the processor, the centered image for a display panel to display.

Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

Abstract: An image processing method includes following operations: executing, by a transmitter device, a driver program of a camera to acquire a dynamic image; executing, by the transmitter device, the driver program to acquire a plurality of position data of input information, in which the plurality of position data is associated with the transmitter device; executing, by the transmitter device, the driver program to perform a superimpose process on the input information and the dynamic image according to the plurality of position data so as to generate a superimposed dynamic image; and executing, by the transmitter device, the driver program to display the superimposed dynamic image.

Abstract: A method of controlling chemical concentration in electrolyte includes measuring the chemical concentration in the electrolyte in a tank, wherein an end of an exhaust pipe is connected to a top of the tank; determining, by a valve moved along a top surface of the tank, a vapor flux through the exhaust pipe based on the measured chemical concentration; rotating, by using a motor connected to a ball screw connected to the valve, the ball screw to move a gate of the valve based on the determined vapor flux; electroplating, using the electrolyte provided by the tank, wafers respectively in a plurality of electroplating cells that are connected to the tank; and recycling the electrolyte to the tank.

Abstract: A woven textile has one or more weavable threads and at least one lighting filament in which the weavable threads and the at least one lighting filament are woven together to form a textile with integrally woven lighting.

Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.

Abstract: A method for annealing a wafer includes loading the wafer to a fork of a delivering robot in an annealing apparatus, wherein the wafer is in contact with a vibration-detecting sensor on the fork; rotating the fork between a heating plate and a cooling plate of the annealing apparatus; outputting, by the vibration-detecting sensor, a first signal in response to a motion of the fork of the delivering robot when the wafer is loaded on the fork; and providing, by a circuitry of the annealing apparatus, a response in response to the first signal.

Abstract: A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

Abstract: An annealing apparatus includes a heater plate and a cooler plate disposed in a chamber, a delivering robot, a sensor and circuitry. The delivering robot is configured to deliver a wafer between the heater plate and the cooler plate in the chamber. The sensor is located on the delivering robot and configured to output a first signal in response to a motion of the delivering robot. The circuitry is coupled to the sensor and configured to detect whether an abnormality of the delivering robot occurs according to the first signal.

Abstract: A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

Abstract: An electrostatic substrate holder for use in an extreme ultraviolet radiation lithography system includes a substrate receiving surface having a plurality of gas passages in fluid communication with a variable gas pressure pump. Varying the pressure in a void space between the backside of the substrate and the substrate receiving surface of the substrate holder promotes removal of non-gaseous materials within the void space between the backside of the substrate and the substrate receiving surface of the substrate holder.

Abstract: A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

Abstract: A method for managing electrical power to a server or server system is used in a power management system. The power management system comprises a power module, a backup power module, and a server system, the method comprises setting the server system to operate under a first working mode and controlling initialization of a BMC by an initialization command. A specified pin of the BMC is measured for a logic low voltage level and the server system is set to operate under a second working mode if the specified pin of the BMC is at the logic low voltage level. In different modes, the manner of supplying power and the working parameters of the server system are adjusted.

Abstract: A method for fault detection in a fabrication tool is provided. The method includes processing a semiconductor wafer in a fabrication tool according to a plurality of process events of a process run. The method further includes measuring humidity in the fabrication tool in at least one of the process events. The method also includes comparing the humidity measured in one of the process events with an expected humidity associated with the process event. In addition, the method includes based on the comparison, indicating an alarm condition when a difference between the measured humidity and the expected humidity exceeds a range of acceptable values associated with the process event.

Abstract: A lower-cost power distribution apparatus (PDU) using a lesser number of components that connects with many power supply units. The PDU comprises first and second switching modules, for outputting AC from a first or a second power source. The first switching module and the second switching module automatically switch between opposite states (turned on or turned off) based on the AC power source. At a given instant, the first switching module and the second switching module are in opposite states.