Patents by Inventor Yu-Chia Cheng

Yu-Chia Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983052
    Abstract: A display device and a bezel thereof are provided. The display device includes a display panel and a bezel. The display panel has a first surface and a second surface. The first surface includes at least one pixel pad section, and the second surface includes at least one circuit pad section. The bezel includes a first surface connecting portion, a second surface connecting portion and at least one conductive wire. The edge of the display panel having the pixel pad section and the circuit pad section is accommodated between the first surface connecting portion and the second surface connecting portion. Each conductive wire has a first end and a second end. The first end is disposed on the first surface connecting portion and the second end is disposed on the second surface connecting portion. The part of the first connecting portion having the first end corresponds to the pixel pad section, and the part of the second connecting portion having the second end corresponds to the circuit pad section.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: May 14, 2024
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Yi-Fan Chen, Che-Chia Chang, Shang-Jie Wu, Yu-Chieh Kuo, Yi-Jung Chen, Yu-Hsun Chiu, Mei-Yi Li, He-Yi Cheng
  • Publication number: 20240121935
    Abstract: Methods for fabricating semiconductor structures are provided. An exemplary method includes forming a first transistor structure and a second transistor structure over a substrate, wherein each transistor structure includes at least one nanosheet. The method further includes depositing a metal over each transistor structure and around each nanosheet; depositing a coating over the metal; depositing a mask over the coating; and patterning the mask to define a patterned mask, wherein the patterned mask lies over a masked portion of the coating and the second transistor structure, and wherein the patterned mask does not lie over an unmasked portion of the coating and the first transistor structure. The method further includes etching the unmasked portion of the coating and the metal over the first transistor structure using a dry etching process with a process pressure of from 30 to 60 (mTorr).
    Type: Application
    Filed: January 18, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Y.L. Cheng, Tzu-Wen Pan, Yu-Hsien Lin, Ryan Chia-Jen Chen
  • Publication number: 20240097444
    Abstract: Embodiments of the present invention provide a hybrid system and method for distributed virtual power plants integrated intelligent net zero. In this method, a cyber physical agent (CPA) is utilized to collect a carbon emission information and an energy management information, and then an artificial intelligence (AI) optimization model of an intelligent central dispatch platform is utilized to obtain a power dispatch manner of the distributed virtual power plants based on the carbon emission information and the energy management information, such that the power dispatch manner of the distributed virtual power plants meets the requirements of enterprise economic benefits and net zero carbon emissions at the same time.
    Type: Application
    Filed: November 1, 2022
    Publication date: March 21, 2024
    Inventors: Ting-Chia OU, Hao TIENG, Fan-Tien CHENG, Tsung-Han TSAI, Yu-Yong LI
  • Publication number: 20240095755
    Abstract: A hybrid method for green intelligent manufacturing (GiM) combines the carbon reduction and the energy saving into the intelligent manufacturing based Industry 4.1 cloud platform. GiM assists companies to achieve the goal of net zero transition and help them advance to Industry 4.2 as soon as possible by simultaneously taking carbon footprint and energy issues into account. GiM collects large volumes of essential data (including carbon footprint) via cyber physical agents (CPAs), and sends them to two critical services of carbon management and intelligent energy management system (iEMS) deployed on the cloud platform. The two critical services optimize the energy dispatch schedule by strictly following the requirements of energy saving, carbon reduction, and net zero. Then, the state of zero defects of intelligent manufacturing achieved in Industry 4.1 can be upgraded to net zero of GiM in Industry 4.2.
    Type: Application
    Filed: November 1, 2022
    Publication date: March 21, 2024
    Inventors: Hao TIENG, Fan-Tien CHENG, Ting-Chia OU, Tsung-Han TSAI, Yu-Yong LI
  • Publication number: 20230262944
    Abstract: An airflow guiding mechanism includes a housing and a shielding assembly. The housing includes an airflow guiding portion and a guiding track. The shielding assembly is movably connected to the guiding track. The shielding assembly is able to move within the airflow guiding portion along the guiding track. In an embodiment, the shielding assembly may include a first shielding plate and at least one second shielding plate. The first shielding plate is connected to the housing. The at least one second shielding plate and the first shielding plate are movably connected to each other. The at least one second shielding plate are able to move with respect to each other to be folded and unfolded, so as to open and shield the airflow guiding portion.
    Type: Application
    Filed: April 1, 2022
    Publication date: August 17, 2023
    Applicant: Wistron Corporation
    Inventors: Yu-Chia Cheng, Chien-Hsiang Chueh
  • Patent number: 10298258
    Abstract: A data compression method based on sampling and estimation is provided. The method includes: receiving a piece of data; extracting N data regions from M data regions of the piece of data; examining a data redundancy ratio in the N data regions; and determining, according to a value of the data redundancy ratio, whether to compress the piece of data.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: May 21, 2019
    Assignee: ACCELSTOR LTD.
    Inventors: Shih-Chiang Tsao, Ting-Fang Chien, Yu-Chia Cheng