Patents by Inventor Yu-Chia Chung

Yu-Chia Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250022721
    Abstract: A method for making a multi-chip package device includes: providing a lead frame unit having a plurality of lead frames, each of the lead frames having a base seat that has an upper surface and a bottom surface, and a plurality of leads; electrically attaching a transistor chip onto the base seat, the transistor chip having a plurality of electrode pads; attaching a circuit control chip to the base seat; covering the transistor chip with a main conducting part, and electrically connecting the main conducting part with at least one of the source electrode pads; electrically connecting the circuit control chip to another source electrode pad; encapsulating the transistor chip and the circuit control chip to expose a leg part; and bending the leg part that is exposed to form a planar conducting portion having a bottom surface coplanar with the bottom surface of the base seat.
    Type: Application
    Filed: June 24, 2024
    Publication date: January 16, 2025
    Inventors: YUAN-SHUN CHANG, KAO-WAY TU, PING-CHIA CHUNG, YU-CHAN TSAI
  • Publication number: 20250022846
    Abstract: A multi-chip package device includes a lead frame, a transistor chip, a metallic frame, a circuit control chip, and an encapsulation layer. The lead frame has a base seat, and a plurality of leads. The transistor chip is disposed on the base seat, and includes a plurality of source electrode pads, a gate electrode and a drain electrode. The metallic frame has a main conducting part and a conducting leg having a first conducting section and a second conducting section. The circuit control chip is disposed on the base seat and electrically connected to the transistor chip and the leads. The encapsulation layer envelops the lead frame, the transistor chip, the main conducting part, the first conducting section, and the circuit control chip to expose the second conducting section of the conducting leg.
    Type: Application
    Filed: June 24, 2024
    Publication date: January 16, 2025
    Inventors: YUAN-SHUN CHANG, KAO-WAY TU, PING-CHIA CHUNG, YU-CHAN TSAI
  • Patent number: 9747694
    Abstract: Method and apparatus for optimizing depth information are provided. One of a left image and a right image is divided into a plurality of segmentations for obtaining a plurality of segmentation maps. A necessary repair depth map is obtained, and the necessary repair depth map is partitioned into a plurality of depth planes according to a plurality of primary depth values and a camera parameter. The primary depth values are recorded in the necessary repair depth map having a plurality of holes. A plurality of optimized depth values are respectively generated for the holes in each of the depth planes by using the segmentation maps, and the optimized depth values are filled into the depth planes to obtain an optimized depth map.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: August 29, 2017
    Assignee: Altek Semiconductor Corp.
    Inventors: Yu-Chia Chung, Wen-Yan Chang, Chia-Chun Tseng, Yun-Chin Lee
  • Patent number: 9406140
    Abstract: A method and an apparatus for generating depth information are provided. A main depth map associated with one of a left image and a right image and corresponding to multiple first pixels is obtained. The left image or the right image associated with the main depth map is divided into multiple segments according to pixel information, so as to obtain a segment distribution map including the segments. Multiple invalid depth values which do not match to a reliable condition are removed from the main depth map according to the segment distribution map, so as to generate a necessary repair depth map including multiple holes. Multiple optimized depth values are respectively generated for the holes in the necessary repair depth map according to the segment distribution map, and the optimized depth values are filled into the necessary repair depth map to generate an optimized depth map.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: August 2, 2016
    Assignee: Altek Semiconductor Corp.
    Inventors: Yun-Chin Lee, Chia-Chun Tseng, Yu-Chia Chung
  • Publication number: 20150319421
    Abstract: Method and apparatus for optimizing depth information are provided. One of a left image and a right image is divided into a plurality of segmentations for obtaining a plurality of segmentation maps. A necessary repair depth map is obtained, and the necessary repair depth map is partitioned into a plurality of depth planes according to a plurality of primary depth values and a camera parameter. The primary depth values are recorded in the necessary repair depth map having a plurality of holes. A plurality of optimized depth values are respectively generated for the holes in each of the depth planes by using the segmentation maps, and the optimized depth values are filled into the depth planes to obtain an optimized depth map.
    Type: Application
    Filed: June 16, 2014
    Publication date: November 5, 2015
    Inventors: Yu-Chia Chung, Wen-Yan Chang, Chia-Chun Tseng, Yun-Chin Lee
  • Publication number: 20150302595
    Abstract: A method and an apparatus for generating depth information are provided. A main depth map associated with one of a left image and a right image and corresponding to multiple first pixels is obtained. The left image or the right image associated with the main depth map is divided into multiple segments according to pixel information, so as to obtain a segment distribution map including the segments. Multiple invalid depth values which do not match to a reliable condition are removed from the main depth map according to the segment distribution map, so as to generate a necessary repair depth map including multiple holes. Multiple optimized depth values are respectively generated for the holes in the necessary repair depth map according to the segment distribution map, and the optimized depth values are filled into the necessary repair depth map to generate an optimized depth map.
    Type: Application
    Filed: June 18, 2014
    Publication date: October 22, 2015
    Inventors: Yun-Chin Lee, Chia-Chun Tseng, Yu-Chia Chung