Abstract: A semiconductor device includes one or more metal-insulator-metal (MiM) capacitors. The semiconductor device includes a bottom electrode, a dielectric layer located above, and in physical contact with, the bottom electrode, a top electrode located above, and in physical contact with, the dielectric layer, a first top contact contacting the top electrode, a first bottom contact contacting the bottom electrode from a top electrode direction, a first metal bump connecting to the top contact, and a second metal bump connecting to the bottom contact. The top electrode has a smaller area than the bottom electrode. The bottom electrode, the dielectric layer, and the top electrode is a MiM capacitor. Top electrodes of a number of MiM capacitors and bottom electrodes of a number of MiM capacitors are daisy chained to allow testing of the conductivity of the electrodes.

Abstract: A semiconductor device includes a substrate includes a first layer and a second layer over the first layer, a bump disposed over the second layer, a molding disposed over the second layer and surrounding the bump, and a retainer disposed over the second layer, wherein the retainer is disposed between the molding and a periphery of the substrate. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing several bumps on the substrate, disposing a retainer on the substrate and surrounding the bumps, and disposing a molding between the bumps and the retainer.

Abstract: A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure.

Abstract: A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure.

Abstract: A semiconductor structure includes an oval-shaped pad and a dielectric layer. The oval-shaped pad is on a substrate and includes a major axis corresponding to the largest distance of the oval-shaped pad. The major axis is toward a geometric center of the substrate. The dielectric layer covers the substrate and surrounds the oval-shaped pad.

Abstract: A semiconductor device includes one or more metal-insulator-metal (MiM) capacitors. The semiconductor device includes a bottom electrode, a dielectric layer located above, and in physical contact with, the bottom electrode, a top electrode located above, and in physical contact with, the dielectric layer, a first top contact contacting the top electrode, a first bottom contact contacting the bottom electrode from a top electrode direction, a first metal bump connecting to the top contact, and a second metal bump connecting to the bottom contact. The top electrode has a smaller area than the bottom electrode. The bottom electrode, the dielectric layer, and the top electrode is a MiM capacitor. Top electrodes of a number of MiM capacitors and bottom electrodes of a number of MiM capacitors are daisy chained to allow testing of the conductivity of the electrodes.

Abstract: An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected.

Abstract: A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure.

Abstract: A method includes forming a passivation layer over a portion of a metal pad, forming a polymer layer over the passivation layer, and exposing the polymer layer using a photolithography mask. The photolithography mask has an opaque portion, a transparent portion, and a partial transparent portion. The exposed polymer layer is developed to form an opening, wherein the metal pad is exposed through the opening. A Post-Passivation Interconnect (PPI) is formed over the polymer layer, wherein the PPI includes a portion extending into the opening to connect to the metal pad.

Abstract: A seal ring structure of an integrated circuit includes a seal ring and a metal-insulator-metal (MIM) capacitor. The MIM capacitor includes a top electrode, a bottom electrode disposed below the top electrode, and a first insulating layer disposed between the top electrode and the bottom electrode. The MIM capacitor is disposed within the seal ring and the MIM capacitor is insulated from the seal ring.

Abstract: A server includes a server enclosure having an accommodating room with a front area and a rear area and a top plate defining a first intake hole communicating with the accommodating room, a first component module and a second component module respectively at the front and rear areas, a first fan module and a second fan module in the accommodating room. The first fan module is for forcing air to flow from the front area to the rear area. The second fan module includes an air-guiding housing and a fan inside the air-guiding housing. The air-guiding housing has a second intake hole aligned with the first intake hole, and an exhaust hole opening toward the rear area. The fan draws air outside the server enclosure through the first and second intake holes, and blows the air toward the rear area through the exhaust hole.

Abstract: An electronic device includes a housing, a printed circuit board received in the housing, a plurality of heat-generating elements mounted on the printed circuit board and a heat dissipation device secured to an end of the housing. The heat dissipation device includes a fan module and a bracket securing the fan module onto the housing. The housing includes a first side wall and a second side wall with a passage defined therebetween. The heat-generating elements are positioned in the passage. The fan module includes first and second fans arranged side by side. The bracket defines first and second openings corresponding to the first and second fans respectively for air flow generated by the fans. An air baffle is pivotally connected to the bracket and capable of turning to close a corresponding opening corresponding to a failing fan upon failure of either the first or second fan.

Abstract: A cooling system includes a fan and an air conducting cover. The air conducting cover includes a first airflow channel and an opposite second airflow channel. The first airflow channel includes a first air inlet and an opposite first air outlet, the second airflow channel includes a second air inlet and an opposite second air outlet. The first air inlet and the second air inlet are both aligned with the fan.

Abstract: An air guiding device is mounted on a main board. The air guiding device and the main board cooperatively form an air passage therebetween for allowing cooling air to pass therethrough. The air passage includes an inlet at a first end of the air guiding device, a first outlet at an opposite second end of the air guiding device, and a second outlet. The air guiding device includes a top wall, two sidewalls, and a shielding assembly. The top wall includes the second outlet therein at an intermediate portion thereof. The second outlet opens toward the second end. The sidewalls extend downwardly from opposite sides of the top wall. The shielding assembly is positioned on the top wall for regulating a size of the second outlet.

Abstract: An exemplary computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a first side panel, a second side panel, and a ventilation area defining ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame is configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame. The two air-guiding members and the first and second side panels cooperatively surround the ventilation area to allow the air to enter the chassis from the ventilation area and allow all of the air to pass through the mounting frame.

Abstract: An electronic device includes a housing, a printed circuit board received in the housing, a plurality of heat-generating elements mounted on the printed circuit board and a heat dissipation device secured to an end of the housing. The heat dissipation device includes a fan module and a bracket securing the fan module onto the housing. The housing includes a first side wall and a second side wall with a passage defined therebetween. The heat-generating elements are positioned in the passage. The fan module includes first and second fans arranged side by side. The bracket defines first and second openings corresponding to the first and second fans respectively for air flow generated by the fans. An air baffle is pivotally connected to the bracket and capable of turning to close a corresponding opening corresponding to a failing fan upon failure of either the first or second fan.

Abstract: An air guiding device is mounted on a main board. The air guiding device and the main board cooperatively form an air passage therebetween for allowing cooling air to pass therethrough. The air passage includes an inlet at a first end of the air guiding device, a first outlet at an opposite second end of the air guiding device, and a second outlet. The air guiding device includes a top wall, two sidewalls, and a shielding assembly. The top wall includes the second outlet therein at an intermediate portion thereof. The second outlet opens toward the second end. The sidewalls extend downwardly from opposite sides of the top wall. The shielding assembly is positioned on the top wall for regulating a size of the second outlet.

Abstract: A server includes a server enclosure having an accommodating room with a front area and a rear area and a top plate defining a first intake hole communicating with the accommodating room, a first component module and a second component module respectively at the front and rear areas, a first fan module and a second fan module in the accommodating room. The first fan module is for forcing air to flow from the front area to the rear area. The second fan module includes an air-guiding housing and a fan inside the air-guiding housing. The air-guiding housing has a second intake hole aligned with the first intake hole, and an exhaust hole opening toward the rear area. The fan draws air outside the server enclosure through the first and second intake holes, and blows the air toward the rear area through the exhaust hole.

Abstract: A cooling system includes a fan and an air conducting cover. The air conducting cover includes a first airflow channel and an opposite second airflow channel. The first airflow channel includes a first air inlet and an opposite first air outlet, the second airflow channel includes a second air inlet and an opposite second air outlet. The first air inlet and the second air inlet are both aligned with the fan.

Abstract: A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means.