Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.

Abstract: A manifold for cooling server includes an inlet pipe, an outlet pipe, a plurality of first hole groups, and a plurality of second hole groups. The distance between every two adjacent first hole groups is first distance, the distance between every two adjacent second hole groups is second distance, and the first distance is not equal to the second distance. The first distance is designed for one size of server, and the second distance is designed for another size of server. When changing the size of all servers in the rack, turning manifold 100 to 180 degrees to change the first hole groups 30 to the second hole groups 40 for adapting the severs, which makes the manifold 100 adapt two different sizes of server. A rack and a data center cooling system using the manifold are also disclosed.

Abstract: An isolation device for isolating leaked liquid coolant and an electronic equipment carrying same are disclosed. The isolation device includes a liquid cooling radiator, a fixing structure, and a detection device. The liquid cooling radiator includes a first housing and a second housing which are connected with each other and enclose a chamber allowing a liquid coolant to flow therethrough. The first housing defines a groove away from the chamber, a bottom wall of the groove including a first end and a second end lower than the first end. The fixing structure is disposed on the bottom wall and configured to fix a pipe. The groove is configured to receive liquid coolant leaked from a connection between the fixing structure and the pipe. The detection device is disposed on the second end and configured to detect presence of liquid.

Abstract: An inverter integrated motor having a frame, a motor body, a cap, a fan, an inverter, and a heat transfer module is provided. The motor body is received in the frame, and a heat dissipation passage is formed between them, the motor body is covered and closed by the cap, and the cap and the motor body are presented in a continuous form. The inverter is attached on an outer side surface of the frame. The heat transfer module is located between the cap and the fan and thermally connected to the inverter. Airflow is generated by the fan to flow through the heat transfer module and exchange heat therewith, and the airflow then flows into the heat dissipation passage along the cap. Accordingly, an attached additional fan for the inverter is not necessary.

Abstract: An inverter integrated motor having a frame (100), a motor body (200), a cap (300), a fan (400), an inverter (500), and a heat transfer module (600) is provided. The motor body (200) is received in the frame (100), and a heat dissipation passage (201a/201b) is formed between them, the motor body (200) is covered and closed by the cap (300), and the cap (300) and the motor body (200) are presented in a continuous form. The inverter (500) is attached on an outer side surface of the frame (100). The heat transfer module (600) is located between the cap (300) and the fan (400) and thermally connected to the inverter (500). Airflow is generated by the fan (400) to flow through the heat transfer module (600) and exchange heat therewith, and the airflow then flows into the heat dissipation passage (201a/201b) along the cap (300). Accordingly, an attached additional fan (400) for the inverter (500) is not necessary.