Abstract: A liquid cooling device comprises a cabinet, a liquid flowing unit, a liquid tray, and a liquid sensor. The cabinet is configured for containing an electronic component. The liquid flowing unit comprises a plurality of liquid delivery pieces connected and configured for circulating coolant to cool the electronic component. The liquid tray defines a confluence groove configured for gathering the coolant leaking from two connected ones of the plurality of liquid delivery pieces. The liquid sensor is placed in the confluence groove and is configured for sending a signal when contacting with the coolant. When the coolant leaks from two connected ones of the plurality of liquid delivery pieces then drops on the liquid tray and flows into the confluence groove by gravity, the liquid sensor contacts with the coolant in the confluence groove and sends the signal. A server with the liquid cooling device is also disclosed.

Abstract: An immersion cooling device includes a housing defining a receiving chamber, a working liquid received in the receiving chamber, a condenser received in the receiving chamber and located outside the working liquid, and a blocking member received in the receiving chamber. The blocking member includes a plurality of blocking bodies dispersed on a top surface of the working liquid.

Abstract: An immersion cooling device includes a housing defining a chamber, a working liquid received in the chamber, a condenser received in the chamber and located outside the working liquid, and at least one support plate received in the chamber. Each of the at least one support plate includes a first portion and a second portion connected to the first portion. The first portion is immersed in the working liquid and configured to hold an electronic device. The second portion protrudes from the working liquid. The second portion defines a slot extending through the second portion, and an opening of the slot faces the condenser.

Abstract: A power supply has a housing, a circuit board, a wire, and a wire securing assembly. The wire securing assembly has a base plate and a securing structure. The securing structure has a first plate and a second plate. A side edge of the first plate is connected to the base plate. The second plate is spaced apart from the first plate. The wire is mounted through and between the first plate and the second plate. The wire securing assembly is modified from the current insulating part, in which the original side plate extends and forms an additional part, or a bent structure is added on the original side plate, and thus the additional structures become the securing structure. Thus, the wire is prevented from moving under vibration or external force and contacting the blades of the fan, or keeps in a position in compliance with safety requirements.

Abstract: A head-up display system for a vehicle is provided. The vehicle has a windshield, a vehicle front and a vehicle rear. The head-up display system includes a first image generation device and an optical element. The first image generation device is configured to provide a first light. The optical element is configured to adjust a transmission direction of the first light. The vehicle front and the vehicle rear are connected along a first direction. Along a second direction perpendicular to the first direction, a first headlight and a second headlight are configured along the second direction and at the vehicle front. A minimum distance between the first headlight and a driver seat is less than a minimum distance between the second headlight and the driver seat. A distance between the first image generation device and the second headlight is different from a distance between the first image generation device and the first headlight.

Abstract: A two-phase liquid cooling system for cooling electronic devices includes a housing configured for accommodating the electronic devices, a cooling loop connected to the housing, and an impedance device connected to the cooling loop. The cooling loop includes a supply manifold, a return manifold, and multiple cooling branches connected in parallel between the supply manifold and the return manifold, each cooling branch is configured for transferring cooling liquid to cool one electronic device. The impedance device increases impedance in each of the multiple cooling branches to reduce difference in impedance between each cooling branch and balances the pressure drop in each cooling branch, and thus balancing the cooling liquid flow rate in each cooling branch. A two-phase liquid cooling cabinet and method for liquid cooling of multiple electronic devices with different thermal loads are also disclosed.

Abstract: An immersed cooling system for cooling electronic devices includes a cooling tank accommodating coolant and multiple electronic devices and a liquid cooling circuit for circulating coolant, the electronic device includes key components and common components, the liquid cooling circuit includes cooling branches connected to the key components for cooling, the coolant in the cooling branches flows faster than the coolant in the cooling tank, which improves the heat dissipation effect of the key components and the utilization rate of the coolant by cooling the key components and the common components with different flow rates of coolant, reduces the energy consumption of the immersed cooling system and provides a more efficient thermal solution. An immersed cooling cabinet is also provided.

Abstract: A head-up display system for a vehicle having a windshield is provided. The head-up display system includes a first image generation device and an optical system. The first image generation device is configured to provide a first light. The optical system is configured to reflect the first light. A first distance between the first image generation device and the optical system is greater than a second distance between the optical system and the windshield.

Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.

Abstract: A manifold for cooling server includes an inlet pipe, an outlet pipe, a plurality of first hole groups, and a plurality of second hole groups. The distance between every two adjacent first hole groups is first distance, the distance between every two adjacent second hole groups is second distance, and the first distance is not equal to the second distance. The first distance is designed for one size of server, and the second distance is designed for another size of server. When changing the size of all servers in the rack, turning manifold 100 to 180 degrees to change the first hole groups 30 to the second hole groups 40 for adapting the severs, which makes the manifold 100 adapt two different sizes of server. A rack and a data center cooling system using the manifold are also disclosed.

Abstract: An isolation device for isolating leaked liquid coolant and an electronic equipment carrying same are disclosed. The isolation device includes a liquid cooling radiator, a fixing structure, and a detection device. The liquid cooling radiator includes a first housing and a second housing which are connected with each other and enclose a chamber allowing a liquid coolant to flow therethrough. The first housing defines a groove away from the chamber, a bottom wall of the groove including a first end and a second end lower than the first end. The fixing structure is disposed on the bottom wall and configured to fix a pipe. The groove is configured to receive liquid coolant leaked from a connection between the fixing structure and the pipe. The detection device is disposed on the second end and configured to detect presence of liquid.

Abstract: An inverter integrated motor having a frame, a motor body, a cap, a fan, an inverter, and a heat transfer module is provided. The motor body is received in the frame, and a heat dissipation passage is formed between them, the motor body is covered and closed by the cap, and the cap and the motor body are presented in a continuous form. The inverter is attached on an outer side surface of the frame. The heat transfer module is located between the cap and the fan and thermally connected to the inverter. Airflow is generated by the fan to flow through the heat transfer module and exchange heat therewith, and the airflow then flows into the heat dissipation passage along the cap. Accordingly, an attached additional fan for the inverter is not necessary.

Abstract: An inverter integrated motor having a frame (100), a motor body (200), a cap (300), a fan (400), an inverter (500), and a heat transfer module (600) is provided. The motor body (200) is received in the frame (100), and a heat dissipation passage (201a/201b) is formed between them, the motor body (200) is covered and closed by the cap (300), and the cap (300) and the motor body (200) are presented in a continuous form. The inverter (500) is attached on an outer side surface of the frame (100). The heat transfer module (600) is located between the cap (300) and the fan (400) and thermally connected to the inverter (500). Airflow is generated by the fan (400) to flow through the heat transfer module (600) and exchange heat therewith, and the airflow then flows into the heat dissipation passage (201a/201b) along the cap (300). Accordingly, an attached additional fan (400) for the inverter (500) is not necessary.