Abstract: An airtight semiconductor transferring container is disclosed to included a container base, an elastically deformable packing member covered on the top surface of the container base, and a top cover closed on the container base, the top cover having an outer cover body, and an elastically deformable inner lining shell fitted into the outer cover body, the elastically deformable inner lining shell having a downwardly protruding peripheral flange, which is pressed on the border area of the elastically deformable packing member to keep the inside space of the airtight semiconductor transferring container in an airtight status after closing of the top cover on the container base.

Abstract: An airtight semiconductor transferring container is disclosed to included a container base, an elastically deformable packing member covered on the top surface of the container base, and a top cover closed on the container base, the top cover having an outer cover body, and an elastically deformable inner lining shell fitted into the outer cover body, the elastically deformable inner lining shell having a downwardly protruding peripheral flange, which is pressed on the border area of the elastically deformable packing member to keep the inside space of the airtight semiconductor transferring container in an airtight status after closing of the top cover on the container base.

Abstract: A semiconductor container molded from a plastic material containing silver that absorb sulfide to prevent crystal formation on masks/wafers carried in the enclosed storage space inside the semiconductor container during a photolithographic process under the radiation of a deep-ultraviolet light source. In an alternate form of the invention, the inside wall of the semiconductor container is coated with a layer of silver to absorb sulfide. In another alternate form of the present invention, blocks of silver are fixedly provided inside the semiconductor container to absorb sulfide in the enclosed storage space.