Patents by Inventor Yu-Chiang Lu

Yu-Chiang Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board and manufacturing method thereof
    Patent number: 7898820
    Abstract: A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: March 1, 2011
    Assignee: Giga-Byte Technology Co., Ltd
    Inventors: Yung-Shun Kao, Hui-Ling Chung, Yu-Chiang Lu, Chung-Wei Chiang
  • Circuit board and manufacturing method thereof
    Publication number: 20090034214
    Abstract: A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.
    Type: Application
    Filed: May 19, 2008
    Publication date: February 5, 2009
    Inventors: Yung-Shun Kao, Hui-Ling Chung, Yu-Chiang Lu, Chung-Wei Chiang