Patents by Inventor Yu-Chiao Chen

Yu-Chiao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency package
    Patent number: 9653408
    Abstract: A high-frequency package comprises a die; a plurality of leads; and a die pad; wherein a surface of the die pad is lower than top surfaces of the plurality of leads, the die is disposed on the die pad with the lower surface, such that a top surface of the die is substantially aligned with the top surfaces of the plurality of leads.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: May 16, 2017
    Assignee: WIN Semiconductors Corp.
    Inventors: Chih-Wen Huang, Yu-Chiao Chen
  • High-Frequency Package
    Publication number: 20170047299
    Abstract: A high-frequency package comprises a die; a plurality of leads; and a die pad; wherein a surface of the die pad is lower than top surfaces of the plurality of leads, the die is disposed on the die pad with the lower surface, such that a top surface of the die is substantially aligned with the top surfaces of the plurality of leads.
    Type: Application
    Filed: October 14, 2015
    Publication date: February 16, 2017
    Inventors: Chih-Wen Huang, Yu-Chiao Chen
  • High-frequency package
    Patent number: 9515032
    Abstract: A high-frequency package comprises a ground lead, connected to a die, occupying a side of the high-frequency package, wherein a slot is formed within the ground lead; and a signal lead, connected to the die, disposed within the slot; wherein the ground lead surrounds the signal lead, and the ground lead and the signal lead form as a ground-signal-ground structure.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: December 6, 2016
    Assignee: WIN Semiconductors Corp.
    Inventors: Chih-Wen Huang, Yu-Chiao Chen