Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.

Abstract: A resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein the polyolefin includes a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer, the first phosphorus-containing compound includes a compound of Formula (I), and the second phosphorus-containing compound includes a compound of Formula (II), a compound of Formula (III) or a combination thereof.

Abstract: The invention provides a curable composition for inkjet, a cured product, and a flexible printed circuit board. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet has excellent flexibility, and has a withstand voltage of greater than 2 kV even when the thickness is less than 20 ?m.

Abstract: The present invention provides a polybenzoxazole precursor, which comprises a structure of formula (I): wherein the definitions of Y, Z, R1, i, j, and V are provided herein. By means of the polybenzoxazole precursor, the resin composition of the present invention is able to form a film with high frequency characteristics and high contrast.

Abstract: The present invention provides a polyimide comprising a structural unit, which comprises a first structural unit represented by formula (1) and a second structural unit represented by formula (2), wherein A, D and E are defined herein. A polyimide film formed by the polyimide has a low linear thermal expansion coefficient.

Abstract: The present invention provides a photosensitive resin composition comprising (a) a polyamide ester represented by formula (1); (b) a polyimide; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide in which A, B, R1, R2, and m have the meaning as defined herein.

Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) a filler selected from one or more of alumina, graphene, inorganic clay, silica, and zinc oxide and having a particle diameter ranging from 10 nm to 1.0 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.

Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) titanium dioxide having a particle size of 0.2 ?m to 10 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.