Patents by Inventor Yu-Chiao Tseng

Yu-Chiao Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240321810
    Abstract: A chip package structure includes a substrate, a chip, a light-permeable element, and an adhesive element. The chip is disposed on the substrate. The light-permeable element is disposed above the chip. The adhesive element is connected between the chip and the light-permeable element. The adhesive element surrounds the chip for formation of an accommodating space, and the chip is located in the accommodating space. The adhesive element includes two material layers having complementary visible light absorption spectra, such that the adhesive element is capable of being used to absorb full visible spectrum light.
    Type: Application
    Filed: August 13, 2023
    Publication date: September 26, 2024
    Inventors: YU-CHIAO TSENG, CHIA-MIN WU, YI-TA LAI, CHENG-YUAN WANG, SZU-YAO HUANG
  • Publication number: 20100084006
    Abstract: The present invention provides a photovoltaic module, comprising: a dye-sensitized solar cell; a supercapacitor, which is electrically connected to said dye-sensitized solar cell to store the electrical energy generated therefrom; and an electricity-consuming device, which is electrically connected to said dye-sensitized solar cell and said supercapacitor; wherein, when exposed to light, said dye-sensitized solar cell absorbs the light energy to transform into electrical energy, part of said electrical energy is to provide the operation of said electricity-consuming device, and the other part of said electrical energy is stored in said supercapacitor; in the circumstance of no light, said supercapacitor releases the stored electrical energy to said electricity-consuming device to maintain the operation thereof.
    Type: Application
    Filed: December 18, 2008
    Publication date: April 8, 2010
    Applicant: J Touch Corporation
    Inventors: Ruey-Jong Shyu, Kuan-Liang Chen, Jen-Chih Lee, Yu-Chiao Tseng
  • Publication number: 20050109779
    Abstract: A piece of melamine dinnerware includes an outer body made of melamine resin molding compound and an inner body made of stainless steel. The outer body has a bottom and a circumferential wall extending, up from the bottom, and the upper annular edge of the circumferential wall is covered with a leak-preventing ring. The inner body has a bottom and a circumferential wall extending up from the bottom. Then the inner body is placed in the outer body, with the upper edge of the inner body stably resting on the upper edge of the outer body, and with the leak-preventing ring hampering water from flowing or seeping through into a gap formed between the outer body and the inner body.
    Type: Application
    Filed: May 13, 2004
    Publication date: May 26, 2005
    Inventor: Yu-Chiao Tseng